S9S12GN16F1MTJ vs MC9S08SH4MFK Vergleich
Detaillierter Direktvergleich von S9S12GN16F1MTJ von NXP Semiconductors und MC9S08SH4MFK von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | S9S12GN16F1MTJ | MC9S08SH4MFK |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4,20 | $2,15 |
| Manufacturer | NXP Semiconductors | — |
| Series | S12G (12V1 die) | — |
| Core | HCS12 (16-bit) | HCS08 (8-bit) |
| Program Memory Size | 16 KB (16K x 8) Flash | 4 KB (4K x 8) Flash |
| RAM Size | 1 KB | 256 B |
| Maximum CPU Frequency | 25 MHz | — |
| ADC Resolution | 10 bit | — |
| Datenbusbreite | 16 bit | — |
| Number of I/Os | 14 I/O | — |
| Supply Voltage Range | 3.13 V to 5.5 V (5 V nominal) | 2.7 V to 5.5 V |
| Betriebstemperatur | -40C to +125C (Automotive Qualified) | -40 C to +85 C (industrial, [DATA_NEEDED: confirm exact grade]) |
| Gehäuse | 20-TSSOP (4.40 mm Width) | — |
| Montagestil | SMD/SMT | — |
| Montageart | Surface Mount | Surface Mount |
| Automotive Grade | AEC-Q100 Qualified | — |
| Communication Interfaces | CAN, SCI (LIN/SAE J2602 capable), SPI, I2C | — |
| RoHS-Status | Compliant | — |
| Maximum CPU Clock | — | 40 MHz |
| Number of I/O Pins | — | 17 |
| Gehäuse / Bauform | — | 24-VFQFN Exposed Pad (4x4 mm) |
| ADC | — | 12-channel, 10-bit, 2.5 us conversion |
| Oscillator Type | — | Internal |
| Interrupt/Reset Sources | — | Up to 32 |
| Instruction Set | — | HC08 with BGND instruction |
| Packaging | — | Tray |
| Compliance | — | RoHS compliant ([DATA_NEEDED: confirm exact status]) |