SAK-TC234LP-32F200N vs TC275T64F200WDCKXUMA1 Vergleich
Detaillierter Direktvergleich von SAK-TC234LP-32F200N von Infineon und TC275T64F200WDCKXUMA1 von Infineon. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Infineon
SAK-TC234LP-32F200N - AURIX TC23xL MCU 200MHz 2MB Flash TQFP-144 | Infineon
SAK-TC234LP-32F200N ✓ AktivInfineon
TC275T64F200WDCKXUMA1 - 32-Bit TriCore AURIX MCU, 200MHz, 4MB Flash | Infineon
TC275T64F200WDCKXUMA1 ✓ AktivSpezifikationsvergleich
| Parameter | SAK-TC234LP-32F200N | TC275T64F200WDCKXUMA1 |
|---|---|---|
| Marke | Infineon | Infineon |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11,40 | $18,24 |
| Core Architecture | TriCore (32-bit) | — |
| Family | AURIX TC23xL | — |
| Maximale Taktfrequenz | 200 MHz | 200 MHz |
| Program Flash Memory | 2 MB (2M x 8) | — |
| Data Flash Memory | 128 KB | — |
| SRAM (incl. Cache) | 192 KB | 472 KB |
| Operating Voltage Range | 1.17 V to 5.5 V | — |
| Betriebstemperaturbereich | -40 C to +125 C | — |
| CAN Nodes | 6 (CAN / CAN-FD, ISO 11898-1) | 4 |
| ADC Input Lines | 24 | — |
| Gehäuse | TQFP-144 (16x16 mm), exposed pad | PG-LQFP-176-22 (LQFP-176 with exposed pad) |
| Package Designator | PG-TQFP-144-27 | — |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| RoHS-Status | Compliant | Compliant |
| Automotive Grade | Yes (AEC-Q100 qualified) | — |
| Architecture | — | TriCore AURIX (TC27xT family) |
| CPU Cores | — | 3 x TriCore v1.6 (one may operate in lockstep) |
| Program Memory (Flash) | — | 4 MB (4M x 8) |
| Versorgungsspannung | — | 1.3 V core / 5 V I/O |
| Betriebstemperatur | — | -40C to +150C (AEC-Q100 Grade 0, [DATA_NEEDED: exact range]) |
| Automotive Qualification | — | AEC-Q100 |
| Functional Safety | — | ISO 26262 ASIL-D capable |
| Hardware Security Module (HSM) | — | Yes (AES, RSA, TRNG) |
| Communication Interfaces | — | CAN, CAN FD, LIN, FlexRay, SPI, UART |
| ADC | — | [DATA_NEEDED: ADC channel count and resolution] |
| Pin-Anzahl | — | 176 |