SC370760EFR vs SC370760EF Vergleich
Detaillierter Direktvergleich von SC370760EFR von NXP Semiconductors und SC370760EF von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
SC370760EF - Specialized Interface IC, 7x7mm QFN, Freescale | NXP
SC370760EF ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | SC370760EFR | SC370760EF |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Specialized ICs | Interface ICs |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,85 | $7,15 |
| Manufacturer | Freescale Semiconductor (now NXP Semiconductors) | NXP Semiconductors (formerly Freescale) |
| Part Number | SC370760EFR | — |
| Kategorie | Specialized Interface IC | — |
| Package Type | Bulk | QFN-32 (7 mm × 7 mm) with exposed thermal pad |
| MSL-Level | 3 (168 Hours) | [DATA_NEEDED: MSL rating per J-STD-020] |
| ECCN Code | EAR99 | — |
| HTSUS Code | 8542.31.0001 | — |
| RoHS Compliance | Compliant | — |
| Process Material | LBCC MOS9 L45M | — |
| Supply Status | Limited | — |
| Popularity | Medium | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Versorgungsspannung | [DATA_NEEDED: supply voltage range] | — |
| Schnittstellentyp | [DATA_NEEDED: interface protocol details] | — |
| Country of Origin | [DATA_NEEDED: country of origin] | — |
| Part Category | — | Specialized Interface IC |
| Montageart | — | Surface Mount |
| Interface (to host MCU) | — | SPI-compatible digital interface [DATA_NEEDED: exact protocol] |
| Number of Analog Channels | — | [DATA_NEEDED: channel count] |
| Supply Voltage Range | — | [DATA_NEEDED: VDD min/max] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: -40C to +85C or -40C to +125C] |
| Ruhestrom | — | [DATA_NEEDED: typical Iq in mA] |
| Thermal Resistance (theta_JA) | — | [DATA_NEEDED: C/W on JEDEC EIA/JESD51 4-layer test board] |
| Thermal Pad | — | Yes (exposed paddle, must be soldered to PCB thermal land) |
| RoHS-Status | — | Compliant (per JLCPCB and Octopart listings) |
| Lead-Free | — | Yes |
| Halogenfrei | — | [DATA_NEEDED: halogen-free status] |