SI53112-A00AGM vs 5PB1203NTGK Vergleich
Detaillierter Direktvergleich von SI53112-A00AGM von Skyworks Solutions und 5PB1203NTGK von Renesas Electronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Skyworks Solutions
SI53112-A00AGM - 12-Output PCIe Gen 3 ZDB Buffer | Skyworks
SI53112-A00AGM ✓ Aktiv
Spezifikationsvergleich
| Parameter | SI53112-A00AGM | 5PB1203NTGK |
|---|---|---|
| Marke | Skyworks Solutions | Renesas Electronics |
| Kategorie | Clock & Timing | Clock & Timing |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,76 | $0,84 |
| Product Type | 1:12 Zero-Delay Buffer (ZDB) | — |
| Compliance Specification | Intel DB1200ZL | — |
| Anzahl der Ausgänge | 12 differential pairs (24 outputs) | 3 |
| Input Frequency Range | 25 MHz to 200 MHz | — |
| Output Frequency Range | 100 MHz / 133.33 MHz (hardware pin selectable) | — |
| Ausgangstyp | HCSL (current-mode differential) | LVCMOS |
| Additive Phase Jitter | < 0.5 ps RMS (12 kHz to 20 MHz) | — |
| Input-to-Output Delay | < 50 ps (ZDB PLL alignment) | — |
| Core Supply Voltage | 3.3 V | — |
| Betriebstemperatur | -40C to +85C (industrial) | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 64-pin QFN (9x9 mm) with exposed pad | 10-WFDFN Exposed Pad |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| RoHS-Status | Compliant | Compliant |
| Supported Protocols | PCIe Gen 1/2/3/4, Intel QPI, SAS, SATA, SMI | — |
| Funktion | — | 1:3 TCXO/LVCMOS clock fanout buffer |
| Input Type | — | LVCMOS square wave or clipped sine wave (TCXO) |
| Supply Voltage (VDD) | — | 1.8 V (typical) |
| Maximum Output Frequency | — | 200 MHz |
| Output Enable | — | Individual OE pins per output |
| Additive Jitter | — | Industry-leading low jitter (per datasheet) |
| Ruhestrom | — | Extremely low (per datasheet) |
| Application | — | Smart mobile devices, wearables, IoT |