SPC5566MVR132 vs MPC555LFAVR40 Vergleich
Detaillierter Direktvergleich von SPC5566MVR132 von NXP Semiconductors und MPC555LFAVR40 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
SPC5566MVR132 - 32-bit MCU, 3MB Flash, 132MHz, Automotive | NXP
SPC5566MVR132 ✓ Aktiv
Spezifikationsvergleich
| Parameter | SPC5566MVR132 | MPC555LFAVR40 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,50 | $0,00 |
| Core | e200z6 Power Architecture 32-bit | — |
| Maximum CPU Frequency | 132 MHz | — |
| Program Memory (Flash) | 3 MB (3M x 8) | — |
| RAM | [DATA_NEEDED: SRAM size in KB] | — |
| Operating Voltage | [DATA_NEEDED: VDD core/IO range] | — |
| Betriebstemperatur | -40C to +125C | [DATA_NEEDED: operating temperature range] |
| Automotive Qualification | AEC-Q100 Grade 1 | — |
| Gehäuse | 416-PBGA (27 x 27 mm) | 272-PBGA |
| Montageart | Surface Mount | Surface mount |
| Communication Interfaces | FlexCAN, DSPI, eSCI | — |
| Timer Modules | eMIOS (enhanced Modular I/O System) | — |
| ADC | [DATA_NEEDED: eQADC channel count and resolution] | — |
| FPU | Yes (double-precision on e200z6) | — |
| Debug Interface | Nexus/JTAG | — |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| RoHS-Status | Compliant (PBGA package) | unknown |
| Lead-Free | Yes | — |
| Product Type | — | 32-bit microcontroller (MCU) |
| Processor Core | — | PowerPC |
| Maximale Taktfrequenz | — | 40 MHz |
| Program Memory Size | — | 448 KB (448K x 8) |
| Program Memory Type | — | Flash |
| RAM Size | — | 26K x 8 |
| Number of I/O | — | 101 |
| Oscillator Type | — | External |
| Betriebsversorgungsspannung | — | [DATA_NEEDED: operating supply voltage] |
| Package Dimensions | — | 27 x 27 mm |
| Packaging | — | Tray |
| Automotive Positioning | — | Automotive applications |
| Core Architecture | — | PowerPC |
| Product Family | — | MPC500 |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |