SPC5674FAMVR3R vs SPC5643LFF2MMM1R Vergleich

Detaillierter Direktvergleich von SPC5674FAMVR3R von NXP Semiconductors und SPC5643LFF2MMM1R von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
SPC5674FAMVR3R SPC5674FAMVR3R - 32-bit e200z7 MCU 4MB Flash 264MHz PBGA-416

SPC5674FAMVR3R - 32-bit e200z7 MCU 4MB Flash 264MHz PBGA-416

SPC5674FAMVR3R ✓ Aktiv
NXP Semiconductors
SPC5643LFF2MMM1R SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R ✓ Aktiv

Spezifikationsvergleich

Parameter SPC5674FAMVR3R SPC5643LFF2MMM1R
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $35,02 $24,85
Core Processor e200z7 (Power Architecture) —
Core Size 32-Bit —
Core Speed 264 MHz —
Program Memory Size 4 MB (4M x 8) —
Program Memory Type FLASH —
EEPROM Size [DATA_NEEDED: EEPROM size] —
RAM Size [DATA_NEEDED: RAM size] —
Versorgungsspannung 1.2 V / 3.3 V / 5 V —
Number of I/O 32 —
Connectivity CANbus, SCI, SPI —
Peripherals DMA, POR, PWM —
Betriebstemperatur -40C to +125C —
Gehäuse 416-PBGA (27x27 mm) 257-LFBGA / MAPBGA 14x14 mm
Montageart Surface Mount (PBGA) Surface Mount (BGA)
Automotive Grade AEC-Q100 —
Series MPC56xx Qorivva MPC5643L (MPC56xx Qorivva family)
Temperature Grade Automotive —
Manufacturer — NXP Semiconductors (formerly Freescale)
Core Architecture — Power Architecture® e200z4 (dual-core with delayed lockstep)
Core Count — 2 (1 main + 1 lockstep checker)
Maximum CPU Clock — 120 MHz
Program Memory (Flash) — 1 MB (1M x 8)
Data Memory (SRAM) — [DATA_NEEDED: SRAM size]
Operating Voltage Range — [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O]
Betriebstemperaturbereich — -40 °C to +125 °C (automotive grade)
AEC-Q100 Qualification — Yes (Automotive qualified per NXP product page)
Functional Safety Target — ISO 26262 ASIL-D capable (via lockstep + ECC + FCU)
Communication Interfaces — FlexCAN, SPI, I²C, UART (LIN-capable via SCI)
Debug Interface — Nexus (JTAG, auxiliary)
Lead-Free / RoHS — Compliant (lead-free BGA)

Datenblätter & Ressourcen

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