SPC5674FAMVR3R vs SPC5643LFF2MMM1R Comparación
Comparación detallada lado a lado de SPC5674FAMVR3R por NXP Semiconductors y SPC5643LFF2MMM1R por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
SPC5674FAMVR3R - 32-bit e200z7 MCU 4MB Flash 264MHz PBGA-416
SPC5674FAMVR3R ✓ ActivoNXP Semiconductors
SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP
SPC5643LFF2MMM1R ✓ ActivoComparación de especificaciones
| Parámetro | SPC5674FAMVR3R | SPC5643LFF2MMM1R |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $35,02 | $24,85 |
| Core Processor | e200z7 (Power Architecture) | — |
| Core Size | 32-Bit | — |
| Core Speed | 264 MHz | — |
| Program Memory Size | 4 MB (4M x 8) | — |
| Program Memory Type | FLASH | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| Tensión de alimentación | 1.2 V / 3.3 V / 5 V | — |
| Number of I/O | 32 | — |
| Connectivity | CANbus, SCI, SPI | — |
| Peripherals | DMA, POR, PWM | — |
| Temperatura de funcionamiento | -40C to +125C | — |
| Encapsulado | 416-PBGA (27x27 mm) | 257-LFBGA / MAPBGA 14x14 mm |
| Tipo de montaje | Surface Mount (PBGA) | Surface Mount (BGA) |
| Automotive Grade | AEC-Q100 | — |
| Series | MPC56xx Qorivva | MPC5643L (MPC56xx Qorivva family) |
| Temperature Grade | Automotive | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Core Architecture | — | Power Architecture® e200z4 (dual-core with delayed lockstep) |
| Core Count | — | 2 (1 main + 1 lockstep checker) |
| Maximum CPU Clock | — | 120 MHz |
| Program Memory (Flash) | — | 1 MB (1M x 8) |
| Data Memory (SRAM) | — | [DATA_NEEDED: SRAM size] |
| Operating Voltage Range | — | [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] |
| Rango de temperatura de funcionamiento | — | -40 °C to +125 °C (automotive grade) |
| AEC-Q100 Qualification | — | Yes (Automotive qualified per NXP product page) |
| Functional Safety Target | — | ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) |
| Communication Interfaces | — | FlexCAN, SPI, I²C, UART (LIN-capable via SCI) |
| Debug Interface | — | Nexus (JTAG, auxiliary) |
| Lead-Free / RoHS | — | Compliant (lead-free BGA) |