TMS5701227CPGEQQ1 vs S5LS10106ASPGEQQ1 Vergleich

Detaillierter Direktvergleich von TMS5701227CPGEQQ1 von Texas Instruments und S5LS10106ASPGEQQ1 von Texas Instruments. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Texas Instruments
TMS5701227CPGEQQ1 TMS5701227CPGEQQ1 - 160MHz Cortex-R4F Dual-Core MCU | Texas Instruments

TMS5701227CPGEQQ1 - 160MHz Cortex-R4F Dual-Core MCU | Texas Instruments

TMS5701227CPGEQQ1 ✓ Aktiv

Spezifikationsvergleich

Parameter TMS5701227CPGEQQ1 S5LS10106ASPGEQQ1
Marke Texas Instruments Texas Instruments
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $21,50 $10,85
Manufacturer Texas Instruments —
Series Hercules TMS570 ARM Cortex-R4F —
Core Processor ARM Cortex-R4F (dual-core, lockstep) —
Core Architecture 32-bit RISC with IEEE-754 single-precision FPU ARM Cortex-R4F (Hercules TMS570 family)
Maximum Clock Speed 160 MHz —
Program Memory (Flash) 1.25 MB (1.25M x 8) with ECC —
Data RAM 192 KB with ECC (SECDED) —
Bus Width 32-bit (64-bit flash bus per TI documentation) —
Operating Voltage Range 1.2 V core / 3.3 V I/O (typical dual-rail) —
Betriebstemperaturbereich -40C to +125C (automotive grade) -40C to +125C
Gehäuse 144-LQFP (PGE) 20x20 mm —
Montageart Surface Mount —
Automotive Qualification AEC-Q100 Grade (-40C to +125C) —
Connectivity FlexRay, EMAC, CAN, SPI, LIN, UART, I2C —
ADC 12-bit MibADC (Multi-buffered ADC) —
PWM Channels Enhanced ePWM with trip-zone protection (per TI datasheet) —
MSL-Level [DATA_NEEDED: MSL moisture sensitivity level] —
RoHS-Status Compliant Compliant (TI datasheet)
Functional Safety Dual lockstep cores + ECC + parity + peripheral loopback (ASIL-D capable per datasheet) —
Supplier Device Package 144-LQFP (PGE) —
Datenbusbreite — 16/32-bit
Maximale Taktfrequenz — 140 MHz
Program Memory Size — 1 MB (1M x 8) Flash
Program Memory Type — Flash (with ECC)
RAM Size — 128 KB (1M x 8)
Number of I/O — 68
ADC Resolution — 12-bit
Betriebsversorgungsspannung — 1.5 V (core) / 3.3 V (I/O)
Gehäuse / Bauform — 144-LQFP (20x20 mm)
Montagestil — SMD/SMT (gull wing)
Supply Type — External clock (programmable ECLK output)
Communication Interfaces — MibSPI x3 (4 chip selects each), SCI/UART x2, CAN x2
AEC-Q100 Qualification — Yes (automotive grade)

Datenblätter & Ressourcen

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