TMS5701227CPGEQQ1 vs S5LS10106ASPGEQQ1 Comparación
Comparación detallada lado a lado de TMS5701227CPGEQQ1 por Texas Instruments y S5LS10106ASPGEQQ1 por Texas Instruments. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Texas Instruments
TMS5701227CPGEQQ1 - 160MHz Cortex-R4F Dual-Core MCU | Texas Instruments
TMS5701227CPGEQQ1 ✓ ActivoTexas Instruments
S5LS10106ASPGEQQ1 - Hercules TMS570 Cortex-R4F MCU 1MB Flash 144LQFP | TI
S5LS10106ASPGEQQ1 ✓ ActivoComparación de especificaciones
| Parámetro | TMS5701227CPGEQQ1 | S5LS10106ASPGEQQ1 |
|---|---|---|
| Marca | Texas Instruments | Texas Instruments |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $21,50 | $10,85 |
| Manufacturer | Texas Instruments | — |
| Series | Hercules TMS570 ARM Cortex-R4F | — |
| Core Processor | ARM Cortex-R4F (dual-core, lockstep) | — |
| Core Architecture | 32-bit RISC with IEEE-754 single-precision FPU | ARM Cortex-R4F (Hercules TMS570 family) |
| Maximum Clock Speed | 160 MHz | — |
| Program Memory (Flash) | 1.25 MB (1.25M x 8) with ECC | — |
| Data RAM | 192 KB with ECC (SECDED) | — |
| Bus Width | 32-bit (64-bit flash bus per TI documentation) | — |
| Operating Voltage Range | 1.2 V core / 3.3 V I/O (typical dual-rail) | — |
| Rango de temperatura de funcionamiento | -40C to +125C (automotive grade) | -40C to +125C |
| Encapsulado | 144-LQFP (PGE) 20x20 mm | — |
| Tipo de montaje | Surface Mount | — |
| Automotive Qualification | AEC-Q100 Grade (-40C to +125C) | — |
| Connectivity | FlexRay, EMAC, CAN, SPI, LIN, UART, I2C | — |
| ADC | 12-bit MibADC (Multi-buffered ADC) | — |
| PWM Channels | Enhanced ePWM with trip-zone protection (per TI datasheet) | — |
| Nivel MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Estado RoHS | Compliant | Compliant (TI datasheet) |
| Functional Safety | Dual lockstep cores + ECC + parity + peripheral loopback (ASIL-D capable per datasheet) | — |
| Supplier Device Package | 144-LQFP (PGE) | — |
| Ancho del bus de datos | — | 16/32-bit |
| Frecuencia de reloj máxima | — | 140 MHz |
| Program Memory Size | — | 1 MB (1M x 8) Flash |
| Program Memory Type | — | Flash (with ECC) |
| RAM Size | — | 128 KB (1M x 8) |
| Number of I/O | — | 68 |
| ADC Resolution | — | 12-bit |
| Tensión de alimentación de funcionamiento | — | 1.5 V (core) / 3.3 V (I/O) |
| Encapsulado / Carcasa | — | 144-LQFP (20x20 mm) |
| Estilo de montaje | — | SMD/SMT (gull wing) |
| Supply Type | — | External clock (programmable ECLK output) |
| Communication Interfaces | — | MibSPI x3 (4 chip selects each), SCI/UART x2, CAN x2 |
| AEC-Q100 Qualification | — | Yes (automotive grade) |