TMS5701227CPGEQQ1 - 160MHz Cortex-R4F Dual-Core MCU | Texas Instruments
Teilenummer: TMS5701227CPGEQQ1 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2.890,00 |
| 500 | $24.1 | $12.050,00 |
| 1.000 | $21.5 | $21.500,00 |
TMS5701227CPGEQQ1 Übersicht
A safety microcontroller (MCU) is a microcontroller designed for functional-safety-critical applications, integrating hardware diagnostics such as dual CPUs in lockstep, built-in self-test (BIST) for CPU and memory, ECC on flash and SRAM, and peripheral parity/loopback features. The TMS570 family occupies the high-end of TI's safety MCU portfolio alongside the RM4x series, and is widely used in chassis, braking, and body-domain automotive electronic control units that require ISO 26262 ASIL-D capability.
Key features include dual ARM Cortex-R4F cores running in lockstep for fault detection, single-bit error correction and double-bit error detection (SECDED) on the 1.25 MB flash and 192 KB SRAM, an IEEE-754 compliant single-precision floating-point unit, integrated FlexRay and EMAC peripherals, an enhanced PWM (ePWM) module with trip-zone protection synchronized to the on-chip 12-bit MibADC, and a rich connectivity set including multiple CAN, SPI, LIN, and UART channels. The AEC-Q100 qualification ensures operation across the automotive -40C to +125C temperature range.
The architecture supports up to 160 MHz system clock with separate instruction and data buses for deterministic execution, hardware floating-point acceleration reducing software overhead for control-loop math, and tightly-coupled memory for low-latency interrupt response - critical for real-time motor control and sensor-fusion loops. The FlexRay + EMAC combination makes the device equally well-suited to vehicle network nodes and industrial safety PLCs requiring deterministic Ethernet.
Typical applications include automotive electronic stability control (ESC), electric power steering (EPS), anti-lock braking systems (ABS), battery management in hybrid and electric vehicles, and industrial servo drives. The on-chip floating-point unit accelerates field-oriented control (FOC) math, while the FlexRay interface suits time-triggered chassis networks, and the EMAC supports industrial Ethernet protocols such as EtherCAT or PROFINET.
When designing with this device, allocate PCB area for the 144-pin LQFP thermal pad, route the JTAG/Trace 14-pin header for boundary-scan and code development, and ensure decoupling on each supply rail per the datasheet. The lockstep cores require software partitions that tolerate both cores reporting diverged diagnostics, and the SECDED-enabled flash must use TI's safe-RTI library for ASIL-D workflows.
This page synthesizes distributor pricing for the TMS5701227CPGEQQ1, validated drop-in Hercules family alternatives, and practical design notes that go beyond the manufacturer datasheet.
Drop-in-Alternativen für TMS5701227CPGEQQ1 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit TMS5701227CPGEQQ1 (gleiche Bauform und Footprint) – abweichend in Core Architecture, RoHS Status, ADC, AEC-Q100 Qualification, Functional Safety.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
TMS5701227CPGEQQ1
✅ Drop-In✓ Auf Lager
$21.5 / Stück
Datenblatt ansehen →TMS5701227BZWTQQ1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TMS5701225BPGEQQ1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TMS5702125BPGEQQ1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TMS5701114CPGEQQ1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TMX5701227APGEQQ1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TMS5701227CPGEQQ1 Grenzwerte & elektrische Eigenschaften
| Manufacturer | Texas Instruments |
| Series | Hercules TMS570 ARM Cortex-R4F |
| Core Processor | ARM Cortex-R4F (dual-core, lockstep) |
| Core Architecture | 32-bit RISC with IEEE-754 single-precision FPU |
| Maximum Clock Speed | 160 MHz |
| Program Memory (Flash) | 1.25 MB (1.25M x 8) with ECC |
| Data RAM | 192 KB with ECC (SECDED) |
| Bus Width | 32-bit (64-bit flash bus per TI documentation) |
| Operating Voltage Range | 1.2 V core / 3.3 V I/O (typical dual-rail) |
| Betriebstemperaturbereich | -40C to +125C (automotive grade) |
| Gehäuse | 144-LQFP (PGE) 20x20 mm |
| Montageart | Surface Mount |
| Automotive Qualification | AEC-Q100 Grade (-40C to +125C) |
| Connectivity | FlexRay, EMAC, CAN, SPI, LIN, UART, I2C |
| ADC | 12-bit MibADC (Multi-buffered ADC) |
| PWM Channels | Enhanced ePWM with trip-zone protection (per TI datasheet) |
| RoHS-Status | Compliant |
| Functional Safety | Dual lockstep cores + ECC + parity + peripheral loopback (ASIL-D capable per datasheet) |
| Supplier Device Package | 144-LQFP (PGE) |
TMS5701227CPGEQQ1 144-lqfp (pge) Pinbelegungsleitfaden
Pinbelegung für TMS5701227CPGEQQ1 (144-lqfp (pge)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für TMS5701227CPGEQQ1.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
TMS5701227CPGEQQ1 ist geeignet für 6 Anwendungs: Automotive Electronic Stability Control (ESC), Electric Power Steering (EPS), Battery Management System (BMS) for Hybrid/EV, Industrial Safety PLC with EtherCAT, Automotive Braking Systems (ABS / i-Booster), Body-Domain Controller with CAN/LIN Gateway.
Automotive Electronic Stability Control (ESC)
The TMS5701227CPGEQQ1 is well-suited for ESC/ECU chassis controllers because its dual Cortex-R4F lockstep cores at 160 MHz deliver deterministic computation of vehicle dynamics while the SECDED ECC on 1.25 MB flash and 192 KB SRAM meets ISO 26262 ASIL-D diagnostic coverage. The on-chip enhanced ePWM module with trip-zone protection can drive FET bridges directly for solenoid actuation, and the 12-bit MibADC samples wheel-speed sensors with synchronized conversion. The FlexRay interface connects the ESC node to time-triggered chassis networks. Choose this part over an RM4x alternative when FlexRay + EMAC connectivity is required on the same die.
Empfohlen
Electric Power Steering (EPS)
Electric power steering systems require torque-loop control with sub-millisecond latency, fault detection on motor position, and ASIL-D compliance. The TMS5701227CPGEQQ1's hardware FPU accelerates the FOC (field-oriented control) math for brushless-DC torque motors, while the lockstep cores detect single-point faults within one clock cycle. The 192 KB SRAM buffers position-sensor samples from the MibADC, and the 1.25 MB flash stores the SafeTI safety library plus application firmware. The EMAC peripheral enables diagnostics logging over industrial Ethernet. The 144-LQFP package with thermal pad supports under-hood operating temperatures.
Empfohlen
Battery Management System (BMS) for Hybrid/EV
High-voltage battery management for hybrid and electric vehicles demands cell-voltage sampling across many channels with strict isolation and fault containment. The TMS5701227CPGEQQ1 supports up to multiple CAN channels for cell-monitoring ASIC communication and provides the safety architecture (dual-core lockstep, ECC, peripheral parity) needed for ASIL-C/D battery-pack controllers. The 160 MHz Cortex-R4F cores compute state-of-charge and state-of-health algorithms in real time using the hardware FPU, and the 1.25 MB flash stores BMS firmware plus diagnostic libraries. The ePWM trip-zone feature protects against over-current shutdown within microseconds.
Empfohlen
Industrial Safety PLC with EtherCAT
Functional-safety industrial PLCs targeting SIL-3 (IEC 61508) or PL d (ISO 13849) often pair a Cortex-R safety MCU with industrial Ethernet such as EtherCAT or PROFINET. The TMS5701227CPGEQQ1's EMAC peripheral supports 10/100 Mbps Ethernet with deterministic latency suitable for EtherCAT slave nodes, while the dual Cortex-R4F cores implement the safety logic and diagnostics. The 1.25 MB flash accommodates the EtherCAT slave stack plus application logic, and the AEC-Q100 grade provides extended-temperature operation for harsh industrial cabinets. The 144-LQFP package simplifies manufacturing for industrial volumes.
Empfohlen
Automotive Braking Systems (ABS / i-Booster)
Anti-lock braking and integrated electronic brake booster systems need deterministic, fault-tolerant computation of slip and pressure loops. The TMS5701227CPGEQQ1's lockstep dual-core architecture, SECDED ECC memories, and on-chip enhanced PWM with trip-zone protection are tailored to ISO 26262 ASIL-D brake controllers. The FlexRay and CAN-FD connectivity link the brake ECU to chassis and powertrain domains, while the 12-bit MibADC samples pressure transducers at synchronized intervals. The 192 KB SRAM buffers control-loop variables without contention, and the hardware FPU accelerates the slip-control math at 160 MHz.
Empfohlen
Body-Domain Controller with CAN/LIN Gateway
Central body-domain controllers aggregate signals from dozens of ECUs across CAN, LIN, and FlexRay. The TMS5701227CPGEQQ1's multiple CAN controllers, LIN, UART, and FlexRay interfaces let a single MCU act as a gateway between powertrain, chassis, and body networks. The 160 MHz Cortex-R4F cores handle gateway routing with deterministic latency, while the 1.25 MB flash stores routing tables and diagnostic firmware. The AEC-Q100 grade and 144-LQFP package are ideal for under-dash mounting with extended thermal tolerance. The hardware FPU accelerates signal-processing tasks such as CAN-FD payload validation.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für TMS5701227CPGEQQ1 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | TMS5701227BZWTQQ1 | TMS5701225BPGEQQ1 | TMS5702125BPGEQQ1 | TMS5701114CPGEQQ1 | TMX5701227APGEQQ1 |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 144-LQFP (PGE) 20x20 mm | 144-LQFP (PGE) 20x20 mm - same | 144-LQFP (PGE) 20x20 mm - same | 144-LQFP (PGE) 20x20 mm - same | 144-LQFP (PGE) 20x20 mm - same | 144-LQFP (PGE) 20x20 mm - same |
| Core | Dual Cortex-R4F lockstep, 160 MHz | Dual Cortex-R4F lockstep, 160 MHz | Dual Cortex-R4F lockstep, 160 MHz | Dual Cortex-R4F lockstep, 160 MHz | Dual Cortex-R4F lockstep, 160 MHz | Dual Cortex-R4F lockstep, 160 MHz (engineering sample) |
| Flash | 1.25 MB | 1.25 MB | 1.0 MB | 2.0 MB | 1.0 MB | 1.25 MB |
| SRAM | 192 KB | 192 KB | 192 KB | 256 KB | 128 KB | 192 KB |
| AEC-Q100 Qualified | Yes (-40C to +125C) | Yes | Yes | Yes | Yes | No (engineering sample) |
| FlexRay | Yes | Yes | Yes | Yes | Yes | Yes |
| EMAC (Ethernet) | Yes (10/100 Mbps) | Yes | Yes | Yes | Yes | Yes |
| Approx Unit Price (qty-1, USD) | 38.50 | 37.80 | 32.40 | 44.60 | 30.10 | Not for production |
Wichtigste Unterscheidungsmerkmale
- Highest-density flash in TMS570LS1227 family with same footprint (vs. TMS5701225BPGEQQ1)
- Production-qualified AEC-Q100 part rather than engineering sample (vs. TMX5701227APGEQQ1)
- Dual Cortex-R4F lockstep for ASIL-D with FlexRay + EMAC on a single die (vs. RM46L852 (industrial TMS570 cousin))
Designhinweise
Estimated: The TMS5701227CPGEQQ1 requires separate core (1.2 V) and I/O (3.3 V) supply rails per TI Hercules datasheet. Place a 10 uF bulk plus 0.1 uF decoupling capacitor on each VCC pin, with the ceramic caps located within 2 mm of the package. Keep the two ground planes stitched together under the LQFP thermal pad, and bond the thermal pad to the internal ground plane with at least 9 thermal vias to dissipate ~1 W of MCU power.
Route the JTAG/Trace signals to a 14-pin compact header (TI standard 0.05" pitch) with 4.7 kohm pull-ups on TMS, TDI, and TRSTn. The EMAC MII/RMII lines should be impedance-controlled to 50 ohm single-ended with matched-length pairs; isolate the analog AVSS/AVCC pair from the digital ground with a ferrite to reduce MibADC noise coupling. The 20 MHz crystal traces should be guarded by a ground ring on both sides to suppress harmonics.
Do not skip the JTAG TRSTn pull-up - missing TRSTn causes boundary-scan lockouts that lock out the device. The Hercules lockstep cores require software partitions that tolerate both cores reporting diverged diagnostics, and the SECDED flash must use TI's safe-RTI library for ASIL-D workflows. Avoid stacking the ePWM high-side/low-side traces over each other for >5 mm to prevent shoot-through glitches; keep the trip-zone input filtered with an RC of <1 us time constant.
Estimated: At 160 MHz system clock, the FlexRay signals should be routed as 100 ohm differential with <2 mm intra-pair skew and <10 mm inter-pair skew across 50 mm trace length. The EMAC MII/RMII clock should not exceed 50 MHz without series termination to dampen reflections. If using the MibADC at >1 MSPS, sample the analog supply with a separate LDO (e.g. TLV1117-3.3) to prevent digital switching noise from aliasing into the ADC result.
Compliance-Informationen
AEC-Q100 qualified per TI's TMS570LS1227 product page; -40C to +125C automotive grade. RoHS compliance confirmed via TI's compliance disclosure.
