XC6SLX16-2FT256C vs XC6SLX16-3FT256I Vergleich

Detaillierter Direktvergleich von XC6SLX16-2FT256C von AMD und XC6SLX16-3FT256I von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter XC6SLX16-2FT256C XC6SLX16-3FT256I
Marke AMD AMD
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Device Type FPGA Field Programmable Gate Array (FPGA)
FPGA Family Spartan-6 LX Spartan-6 LX (logic-optimized)
Configurable Logic Cells 14,579 cells —
Configurable Logic Blocks 1,139 CLBs —
Internal Frequency 667 MHz —
I/O Count 186 I/O —
Process Technology 45 nm CMOS 45 nm CMOS
Core Supply Voltage 1.2 V 1.2 V
Speed Grade -2 -3 (highest Spartan-6 LX performance grade)
Temperature Grade C, commercial —
Betriebstemperatur 0°C to 85°C 0 C to +85 C (32 F to 185 F)
Gehäuse 256-LBGA 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid
Terminal Count 256 terminals 256 terminals
Montageart Surface Mount Surface Mount
Package Shape Square —
Terminal Form Ball —
Lead-Free Status Lead free Lead-free package construction
RoHS-Status [DATA_NEEDED: RoHS compliance status] —
REACH Status [DATA_NEEDED: REACH compliance status] —
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP Resources [DATA_NEEDED: DSP resource count] —
Logic Cells — 14,579 cells
Configurable Logic Blocks (CLBs) — 1,139 CLBs
User I/O Count — 186 I/O
Max Internal Frequency — 667 MHz
Package Body Size — 17 x 17 mm, 1.0 mm ball pitch
Temperature Grade Marking — Industrial
Package Code — LBGA / FT256
Block RAM Capacity — [DATA_NEEDED: block RAM capacity]
DSP Slice Count — [DATA_NEEDED: DSP slice count]
Configuration Interface Details — [DATA_NEEDED: configuration interface details]

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern