XC6SLX16-2FT256C vs XC6SLX16-3FT256I 对比
详细并排对比 XC6SLX16-2FT256C 出自 AMD 和 XC6SLX16-3FT256I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX16-2FT256C | XC6SLX16-3FT256I |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| Device Type | FPGA | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX | Spartan-6 LX (logic-optimized) |
| Configurable Logic Cells | 14,579 cells | — |
| Configurable Logic Blocks | 1,139 CLBs | — |
| Internal Frequency | 667 MHz | — |
| I/O Count | 186 I/O | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Speed Grade | -2 | -3 (highest Spartan-6 LX performance grade) |
| Temperature Grade | C, commercial | — |
| 工作温度 | 0°C to 85°C | 0 C to +85 C (32 F to 185 F) |
| 封装 | 256-LBGA | 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid |
| Terminal Count | 256 terminals | 256 terminals |
| 安装类型 | Surface Mount | Surface Mount |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Lead-Free Status | Lead free | Lead-free package construction |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | — |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Resources | [DATA_NEEDED: DSP resource count] | — |
| Logic Cells | — | 14,579 cells |
| Configurable Logic Blocks (CLBs) | — | 1,139 CLBs |
| User I/O Count | — | 186 I/O |
| Max Internal Frequency | — | 667 MHz |
| Package Body Size | — | 17 x 17 mm, 1.0 mm ball pitch |
| Temperature Grade Marking | — | Industrial |
| Package Code | — | LBGA / FT256 |
| Block RAM Capacity | — | [DATA_NEEDED: block RAM capacity] |
| DSP Slice Count | — | [DATA_NEEDED: DSP slice count] |
| Configuration Interface Details | — | [DATA_NEEDED: configuration interface details] |