XC6SLX16-2FTG256C vs XC6SLX16-3FT256I Vergleich
Detaillierter Direktvergleich von XC6SLX16-2FTG256C von AMD und XC6SLX16-3FT256I von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | XC6SLX16-2FTG256C | XC6SLX16-3FT256I |
|---|---|---|
| Marke | AMD | AMD |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | — |
| Stückpreis (USD) | $16,41 | — |
| Family | Spartan-6 LX | — |
| Logic Cells | 14,579 | 14,579 cells |
| Configurable Logic Blocks (CLBs) | 1,139 | 1,139 CLBs |
| Slices | 2,278 | — |
| Block RAM Bits | 589,824 bits | — |
| Block RAM Blocks (18 Kb) | 32 | — |
| DSP Slices (18×18 multipliers) | 32 | — |
| Maximum User I/Os | 186 | — |
| Maximum Single-Ended I/O Banks | 4 | — |
| Process Node | 45 nm CMOS, 9-metal layer | — |
| Speed Grade | -2 | -3 (highest Spartan-6 LX performance grade) |
| Supply Voltage (Core) | 1.2 V nominal | — |
| Gehäuse | 256-ball Fine-Pitch Thin BGA (FTG256), 17×17 mm, 1.0 mm pitch | 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0 °C to +85 °C (Commercial) | 0 C to +85 C (32 F to 185 F) |
| Lead-Free / RoHS | Yes (compliant) | — |
| Configuration Modes | JTAG, SPI (x1/x2/x4), BPI (x8/x16), Slave-Parallel | — |
| Clock Management Tiles (CMTs) | 2 (each with PLL + MMCM) | — |
| PCIe Support | Soft IP only (no integrated PCIe hard cores) | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Spartan-6 LX (logic-optimized) |
| User I/O Count | — | 186 I/O |
| Max Internal Frequency | — | 667 MHz |
| Process Technology | — | 45 nm CMOS |
| Core Supply Voltage | — | 1.2 V |
| Package Body Size | — | 17 x 17 mm, 1.0 mm ball pitch |
| Terminal Count | — | 256 terminals |
| Temperature Grade Marking | — | Industrial |
| Lead-Free Status | — | Lead-free package construction |
| Package Code | — | LBGA / FT256 |
| Block RAM Capacity | — | [DATA_NEEDED: block RAM capacity] |
| DSP Slice Count | — | [DATA_NEEDED: DSP slice count] |
| Configuration Interface Details | — | [DATA_NEEDED: configuration interface details] |