XC6SLX16-2FTG256C vs XC6SLX16-3FT256I 对比

详细并排对比 XC6SLX16-2FTG256C 出自 AMD 和 XC6SLX16-3FT256I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 XC6SLX16-2FTG256C XC6SLX16-3FT256I
品牌 AMD AMD
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 有效
库存状态 有库存 —
单价(USD) $16.41 —
Family Spartan-6 LX —
Logic Cells 14,579 14,579 cells
Configurable Logic Blocks (CLBs) 1,139 1,139 CLBs
Slices 2,278 —
Block RAM Bits 589,824 bits —
Block RAM Blocks (18 Kb) 32 —
DSP Slices (18×18 multipliers) 32 —
Maximum User I/Os 186 —
Maximum Single-Ended I/O Banks 4 —
Process Node 45 nm CMOS, 9-metal layer —
Speed Grade -2 -3 (highest Spartan-6 LX performance grade)
Supply Voltage (Core) 1.2 V nominal —
封装 256-ball Fine-Pitch Thin BGA (FTG256), 17×17 mm, 1.0 mm pitch 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid
安装类型 Surface Mount Surface Mount
工作温度 0 °C to +85 °C (Commercial) 0 C to +85 C (32 F to 185 F)
Lead-Free / RoHS Yes (compliant) —
Configuration Modes JTAG, SPI (x1/x2/x4), BPI (x8/x16), Slave-Parallel —
Clock Management Tiles (CMTs) 2 (each with PLL + MMCM) —
PCIe Support Soft IP only (no integrated PCIe hard cores) —
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Spartan-6 LX (logic-optimized)
User I/O Count — 186 I/O
Max Internal Frequency — 667 MHz
Process Technology — 45 nm CMOS
Core Supply Voltage — 1.2 V
Package Body Size — 17 x 17 mm, 1.0 mm ball pitch
Terminal Count — 256 terminals
Temperature Grade Marking — Industrial
Lead-Free Status — Lead-free package construction
Package Code — LBGA / FT256
Block RAM Capacity — [DATA_NEEDED: block RAM capacity]
DSP Slice Count — [DATA_NEEDED: DSP slice count]
Configuration Interface Details — [DATA_NEEDED: configuration interface details]

数据手册与资源

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