XC6SLX16-2FTG256C vs XC6SLX16-3FT256I Comparaison
Comparaison détaillée côte à côte de XC6SLX16-2FTG256C par AMD et XC6SLX16-3FT256I par AMD. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | XC6SLX16-2FTG256C | XC6SLX16-3FT256I |
|---|---|---|
| Marque | AMD | AMD |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | — |
| Prix unitaire (USD) | $16,41 | — |
| Family | Spartan-6 LX | — |
| Logic Cells | 14,579 | 14,579 cells |
| Configurable Logic Blocks (CLBs) | 1,139 | 1,139 CLBs |
| Slices | 2,278 | — |
| Block RAM Bits | 589,824 bits | — |
| Block RAM Blocks (18 Kb) | 32 | — |
| DSP Slices (18×18 multipliers) | 32 | — |
| Maximum User I/Os | 186 | — |
| Maximum Single-Ended I/O Banks | 4 | — |
| Process Node | 45 nm CMOS, 9-metal layer | — |
| Speed Grade | -2 | -3 (highest Spartan-6 LX performance grade) |
| Supply Voltage (Core) | 1.2 V nominal | — |
| Boîtier | 256-ball Fine-Pitch Thin BGA (FTG256), 17×17 mm, 1.0 mm pitch | 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | 0 °C to +85 °C (Commercial) | 0 C to +85 C (32 F to 185 F) |
| Lead-Free / RoHS | Yes (compliant) | — |
| Configuration Modes | JTAG, SPI (x1/x2/x4), BPI (x8/x16), Slave-Parallel | — |
| Clock Management Tiles (CMTs) | 2 (each with PLL + MMCM) | — |
| PCIe Support | Soft IP only (no integrated PCIe hard cores) | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Spartan-6 LX (logic-optimized) |
| User I/O Count | — | 186 I/O |
| Max Internal Frequency | — | 667 MHz |
| Process Technology | — | 45 nm CMOS |
| Core Supply Voltage | — | 1.2 V |
| Package Body Size | — | 17 x 17 mm, 1.0 mm ball pitch |
| Terminal Count | — | 256 terminals |
| Temperature Grade Marking | — | Industrial |
| Lead-Free Status | — | Lead-free package construction |
| Package Code | — | LBGA / FT256 |
| Block RAM Capacity | — | [DATA_NEEDED: block RAM capacity] |
| DSP Slice Count | — | [DATA_NEEDED: DSP slice count] |
| Configuration Interface Details | — | [DATA_NEEDED: configuration interface details] |