XC6SLX16-3FTG256C vs XC6SLX16-3FT256I Vergleich
Detaillierter Direktvergleich von XC6SLX16-3FTG256C von AMD und XC6SLX16-3FT256I von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | XC6SLX16-3FTG256C | XC6SLX16-3FT256I |
|---|---|---|
| Marke | AMD | AMD |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Family | Spartan-6 LX | — |
| Series | XC6SLX16 | — |
| Logic Cells | 14,579 | 14,579 cells |
| Configurable Logic Blocks (CLBs) | 1139 | 1,139 CLBs |
| Distributed RAM | 256 kbit | — |
| Block RAM | [DATA_NEEDED: total Kbits] | — |
| DSP48A1 Slices | 32 | — |
| Maximum User I/Os | 186 | — |
| User I/O Banks | [DATA_NEEDED: count] | — |
| Number of CMTs | 2 | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V | — |
| Auxiliary Voltage (VCCAUX) | 2.5 V to 3.3 V | — |
| Speed Grade | -3 | -3 (highest Spartan-6 LX performance grade) |
| Gehäuse | 256-LBGA / FTBGA-256, 17 x 17 mm, 1.0 mm pitch | 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid |
| Betriebstemperatur | 0 C to +85 C (Commercial) | 0 C to +85 C (32 F to 185 F) |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Spartan-6 LX (logic-optimized) |
| User I/O Count | — | 186 I/O |
| Max Internal Frequency | — | 667 MHz |
| Core Supply Voltage | — | 1.2 V |
| Package Body Size | — | 17 x 17 mm, 1.0 mm ball pitch |
| Terminal Count | — | 256 terminals |
| Temperature Grade Marking | — | Industrial |
| Lead-Free Status | — | Lead-free package construction |
| Package Code | — | LBGA / FT256 |
| Block RAM Capacity | — | [DATA_NEEDED: block RAM capacity] |
| DSP Slice Count | — | [DATA_NEEDED: DSP slice count] |
| Configuration Interface Details | — | [DATA_NEEDED: configuration interface details] |