XC6SLX16-3FTG256C vs XC6SLX16-3FT256I Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX16-3FTG256C sa pamamagitan ng AMD at XC6SLX16-3FT256I sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro XC6SLX16-3FTG256C XC6SLX16-3FT256I
Brand AMD AMD
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Spartan-6 LX —
Series XC6SLX16 —
Logic Cells 14,579 14,579 cells
Configurable Logic Blocks (CLBs) 1139 1,139 CLBs
Distributed RAM 256 kbit —
Block RAM [DATA_NEEDED: total Kbits] —
DSP48A1 Slices 32 —
Maximum User I/Os 186 —
User I/O Banks [DATA_NEEDED: count] —
Number of CMTs 2 —
Process Technology 45 nm CMOS 45 nm CMOS
Core Voltage (VCCINT) 1.2 V —
Auxiliary Voltage (VCCAUX) 2.5 V to 3.3 V —
Speed Grade -3 -3 (highest Spartan-6 LX performance grade)
Packhaging 256-LBGA / FTBGA-256, 17 x 17 mm, 1.0 mm pitch 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid
Temperature na Operasyon 0 C to +85 C (Commercial) 0 C to +85 C (32 F to 185 F)
Uri ng Pagpapasok Surface Mount Surface Mount
Tindminan RoHS Compliant —
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Spartan-6 LX (logic-optimized)
User I/O Count — 186 I/O
Max Internal Frequency — 667 MHz
Core Supply Voltage — 1.2 V
Package Body Size — 17 x 17 mm, 1.0 mm ball pitch
Terminal Count — 256 terminals
Temperature Grade Marking — Industrial
Lead-Free Status — Lead-free package construction
Package Code — LBGA / FT256
Block RAM Capacity — [DATA_NEEDED: block RAM capacity]
DSP Slice Count — [DATA_NEEDED: DSP slice count]
Configuration Interface Details — [DATA_NEEDED: configuration interface details]

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