XC6SLX75-2FGG676I vs XC6SLX75-2FG676I Vergleich

Detaillierter Direktvergleich von XC6SLX75-2FGG676I von AMD und XC6SLX75-2FG676I von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter XC6SLX75-2FGG676I XC6SLX75-2FG676I
Marke AMD AMD
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Unknown
Device Type Spartan-6 LX field-programmable gate array (FPGA) FPGA
Logic Cells 74,637 cells 74,637 cells
Configurable Logic Blocks 5,831 CLBs 5,831 CLBs
Internal Frequency 667 MHz —
Input/Output Count 408 I/O —
Versorgungsspannung 1 V —
Speed Grade -2 —
Process Technology 45 nm CMOS —
Package Type 676-ball FBGA —
Package Dimensions 27 mm × 27 mm —
Ball Pitch 1 mm —
Montageart Surface mount Surface mount
Betriebstemperatur -40°C to +100°C 0 C to 85 C; conflicting source also reports -40 C to 100 C
Lead-Free Status Lead free —
Device Family Spartan-6 LX —
FPGA Configuration [DATA_NEEDED: FPGA configuration interface and supported configuration modes] —
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP Resources [DATA_NEEDED: DSP slice count] —
RoHS Compliance [DATA_NEEDED: RoHS compliance status] —
REACH Compliance [DATA_NEEDED: REACH compliance status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
FPGA Family — Spartan-6 LX
Stated Internal Frequency — 667 MHz
Maximum Inputs or Outputs — 400 I/O
Gehäuse — 676-BGA
Reported Package Dimensions — 23 mm x 23 mm
Reported Package Pitch — 1 mm
Temperature Designation — I (industrial)
Technology — 45 nm CMOS
Core Supply Voltage — 1.2 V
Programmable Architecture — Field-configurable digital logic
Manufacturer — AMD / Xilinx
RoHS-Status — unknown
REACH Status — unknown
AEC-Q100 Status — unknown

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