XC6SLX75-2FGG676I vs XC6SLX75-2FG676I 对比
详细并排对比 XC6SLX75-2FGG676I 出自 AMD 和 XC6SLX75-2FG676I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX75-2FGG676I | XC6SLX75-2FG676I |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | Unknown |
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) | FPGA |
| Logic Cells | 74,637 cells | 74,637 cells |
| Configurable Logic Blocks | 5,831 CLBs | 5,831 CLBs |
| Internal Frequency | 667 MHz | — |
| Input/Output Count | 408 I/O | — |
| 电源电压 | 1 V | — |
| Speed Grade | -2 | — |
| Process Technology | 45 nm CMOS | — |
| Package Type | 676-ball FBGA | — |
| Package Dimensions | 27 mm × 27 mm | — |
| Ball Pitch | 1 mm | — |
| 安装类型 | Surface mount | Surface mount |
| 工作温度 | -40°C to +100°C | 0 C to 85 C; conflicting source also reports -40 C to 100 C |
| Lead-Free Status | Lead free | — |
| Device Family | Spartan-6 LX | — |
| FPGA Configuration | [DATA_NEEDED: FPGA configuration interface and supported configuration modes] | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Resources | [DATA_NEEDED: DSP slice count] | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance status] | — |
| REACH Compliance | [DATA_NEEDED: REACH compliance status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| FPGA Family | — | Spartan-6 LX |
| Stated Internal Frequency | — | 667 MHz |
| Maximum Inputs or Outputs | — | 400 I/O |
| 封装 | — | 676-BGA |
| Reported Package Dimensions | — | 23 mm x 23 mm |
| Reported Package Pitch | — | 1 mm |
| Temperature Designation | — | I (industrial) |
| Technology | — | 45 nm CMOS |
| Core Supply Voltage | — | 1.2 V |
| Programmable Architecture | — | Field-configurable digital logic |
| Manufacturer | — | AMD / Xilinx |
| RoHS 状态 | — | unknown |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |