10AS032E4F27E3LG - Arria 10 SX 320K SoC FPGA, 672-FBGA | Intel
Teilenummer: 10AS032E4F27E3LG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2620 | $26.200,00 |
| 25 | $2410 | $60.250,00 |
| 100 | $2180 | $218.000,00 |
| 500 | $1950 | $975.000,00 |
10AS032E4F27E3LG Übersicht
An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that merges a traditional FPGA fabric with one or more hard processor cores on a single silicon die. Within the broader hierarchy, SoC FPGAs sit at the intersection of programmable logic devices (FPGAs, CPLDs) and application processors, offering the parallel processing flexibility of programmable hardware with the deterministic software execution of embedded CPUs. Arria 10 SX belongs to Intel's mid-range FPGA portfolio, positioned between low-power Cyclone and high-performance Stratix families.
The 10AS032E4F27E3LG delivers 320K logic elements, 1.5 GHz dual-core ARM Cortex-A9 MPCore with CoreSight debug, integrated high-speed transceivers, and 20 nm process technology enabling industry-leading performance-per-watt for mid-range applications. The 672-FBGA package supports high-pin-count transceiver, memory, and I/O connectivity, making it suitable for designs requiring both signal processing bandwidth and software control.
Typical applications for this Arria 10 SX variant include wireless infrastructure baseband processing, military radar and electronic warfare, medical imaging accelerators, broadcast video processing, and industrial machine vision systems. The dual ARM cores handle control-plane tasks and protocol stacks while the FPGA fabric accelerates DSP, packet processing, or image-pipeline workloads in parallel.
When designing with the 10AS032E4F27E3LG, plan the power delivery network for the multi-rail 0.9 V core and transceiver supplies, and validate thermal management against the flip-chip BGA's 27x27 mm footprint. The SoC boot sequence requires both the FPGA fabric and HPS (Hard Processor System) configuration images, typically loaded from QSPI flash or SD card.
This page synthesizes authorized distributor pricing, drop-in alternative FPGAs, and practical SoC FPGA design considerations not found in the standalone Intel datasheet.
Drop-in-Alternativen für 10AS032E4F27E3LG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS032E4F27E3LG (gleiche Bauform und Footprint) – abweichend in Package, Mounting Type, Operating Temperature, Operating Temperature Grade, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS032E3F29I2LG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1390 / Stück
Datenblatt ansehen →10AS032E3F29I2SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1295 / Stück
Datenblatt ansehen →10AS032E4F27I3LG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1085.1 / Stück
Datenblatt ansehen →10AS032E4F27E3LG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX |
| Logic Elements | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Frequency | 1.5 GHz |
| Process Technology | 20 nm |
| Supply Voltage (Core) | 0.9 V |
| Package Type | 672-FBGA, FC (flip-chip) |
| Package Dimensions | 27 x 27 mm |
| Montageart | Surface Mount |
| Number of Terminals | 672 (BGA) |
| Terminal Form | Ball |
| Package Shape | Square |
| Operating Temperature Grade | Industrial / Extended |
| RoHS-Status | Compliant |
| Configuration Memory | SRAM-based (volatile) |
10AS032E4F27E3LG square Pinbelegungsleitfaden
Pinbelegung für 10AS032E4F27E3LG (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS032E4F27E3LG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS032E4F27E3LG ist geeignet für 6 Anwendungs: Wireless Baseband Processing, Military Radar and Electronic Warfare, Medical Imaging Accelerator, Broadcast Video Processing, Industrial Machine Vision, Test and Measurement Instrumentation.
Wireless Baseband Processing
The 10AS032E4F27E3LG is well suited for 4G LTE and sub-6 GHz 5G baseband PHY-layer processing. Its 320K logic elements provide the DSP throughput required for channel estimation, FFT/iFFT, and MIMO decoding, while the integrated transceivers up to 17.4 Gbps handle the radio interface. The dual-core ARM Cortex-A9 at 1.5 GHz executes the MAC scheduler and protocol stack. Compared with a discrete CPU+FPGA architecture, this SoC FPGA reduces board area by ~40% and simplifies timing closure between the processor and fabric. Power budget is typically 15-25 W with appropriate heatsinking on the 27x27 mm BGA.
Empfohlen
Military Radar and Electronic Warfare
For radar signal processing and electronic countermeasures, the 10AS032E4F27E3LG delivers the deterministic latency needed for pulse-Doppler, SAR, and digital-RF memory (DRFM) applications. The 320K logic fabric supports wide-bandwidth beamforming and channelized receiver chains, while the dual ARM cores handle control-plane tasks such as track management and threat-library updates. The 672-FBGA F27 package supports high-pin-count transceiver connectivity for multi-channel antenna arrays. Extended temperature screening (E-grade) makes the device suitable for ruggedized defense platforms operating from -40C to +100C ambient.
Empfohlen
Medical Imaging Accelerator
In ultrasound beamformers, CT reconstruction, and MRI gradient control, the 10AS032E4F27E3LG accelerates image-processing pipelines while the dual ARM cores manage the user interface and DICOM stack. The 320K logic elements support real-time FIR filtering, Hilbert transforms, and back-projection kernels required for sub-millisecond image latency. The SoC architecture eliminates a discrete processor chip, reducing system bill-of-materials and EMC profile. Industrial temperature grade and Intel's long-term FPGA roadmap support medical OEM platforms with 10-15 year lifecycle requirements, critical for FDA-cleared devices.
Empfohlen
Broadcast Video Processing
The 10AS032E4F27E3LG supports 4K/UHD video processing workflows including multi-format conversion, HDR tone mapping, and real-time frame-rate conversion for broadcast studio equipment. The 320K logic elements implement parallel video pipelines at 12G-SDI data rates, while the dual ARM cores manage ancillary data, audio embedding, and IP-based control protocols such as NMOS IS-04/IS-05. Transceivers on the 672-FBGA package interface directly to 12G-SDI serializers/deserializers, eliminating external PHY chips. Typical power consumption is 12-20 W under full video load.
Empfohlen
Industrial Machine Vision
For high-speed automated optical inspection and robotic vision systems, the 10AS032E4F27E3LG provides parallel image-processing throughput with deterministic latency. The 320K logic elements support real-time defect detection algorithms, while the dual ARM Cortex-A9 cores run the OPC-UA industrial protocol stack and coordinate multi-axis robot motion. The integrated transceivers handle CoaXPress or GigE Vision camera interfaces at line rates up to 10 Gbps. The SoC FPGA's single-chip architecture reduces PCB footprint by ~50% compared with discrete CPU+FPGA+DRAM designs common in machine vision controllers.
Empfohlen
Test and Measurement Instrumentation
The 10AS032E4F27E3LG is ideal for high-end oscilloscopes, logic analyzers, and protocol analyzers requiring deep trace memory and real-time signal integrity analysis. The 320K logic elements implement multi-gigasample ADC interface logic and trigger engines, while the dual ARM cores execute the user interface and LXI/USBTMC instrument control. The 672-FBGA package supports high-density probe connections, and the SoC architecture eliminates the latency between display updates and FPGA-accelerated measurements. Extended temperature E-grade suits benchtop and laboratory deployment scenarios.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS032E4F27E3LG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS032E3F29I2LG | 10AS032E3F29I2SG | 10AS032E4F27I3LG |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 672-FBGA, FC (27x27 mm) | F29 (different BGA variant) | F29 (different BGA variant) | 672-FBGA F27 (same) |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz |
| Speed Grade | E4 | E3 | E3 | E4 |
| Temperature Grade | E (Extended) | I (Industrial) | I (Industrial) | I (Industrial) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm |
| Configuration Memory | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) |
Wichtigste Unterscheidungsmerkmale
- Integrated dual ARM Cortex-A9 hard processor system (vs. Pure-logic Arria 10 GX variants)
- 20 nm process technology for power efficiency (vs. Older 28 nm Cyclone V SoC FPGAs)
- 320K logic element capacity at mid-range price point (vs. Stratix 10 SX with same SoC architecture)
Designhinweise
The 10AS032E4F27E3LG requires a multi-rail power distribution network: 0.9 V core (typically 8-15 A), 1.8 V HPS, transceiver supplies at 1.0 V/1.2 V depending on data rate, and 3.3 V I/O. Use Intel's PowerPlay early power estimator before PCB layout to size the regulator stages. Decoupling requires 100 nF X7R capacitors on every power pin placed within 2 mm, plus bulk polymer capacitors adjacent to each supply island. Estimated: a typical wireless baseband design consumes 18 W total power.
The 672-ball flip-chip BGA (27x27 mm) has a theta_JA of approximately 8 C/W with a properly designed thermal vias array. The E4 speed grade at full utilization can dissipate 15-25 W. A 6x6 thermal via array under the package center, connected to internal copper planes, is mandatory for production designs. Estimated: at 20 W dissipation, junction-to-ambient thermal rise is approximately 160 C above ambient, requiring active airflow or a heatsink. Always validate with the Intel Thermal Modeling Tool.
PCB layout for the 672-FBGA package requires high-density interconnect (HDI) stack-up with 0.4 mm pitch escape routing, microvias, and 1 oz copper on signal layers. Use 8-12 layer stack-up with dedicated ground and power planes. Place the 100 MHz HPS reference clock source within 5 mm of the CLK pin with controlled-impedance routing. Match-length tuning is critical for DDR4 interfaces - follow Intel's external memory interface layout guidelines exactly. Do not route signal traces beneath BGA balls; use dog-bone fanout.
Three common pitfalls: (1) Failing to program the dual boot images - the FPGA fabric bitstream AND the HPS bootloader must both be loaded, typically from QSPI flash with proper sector mapping; (2) Incorrect transceiver reference clock termination causing BER failures - follow Intel's pin termination guide; (3) Underestimating configuration time during boot - the 320K logic element SRAM-based configuration takes ~200 ms, which affects system power-on sequencing. Reference the Arria 10 SoC Boot User Guide for the correct sequence.
Compliance-Informationen
RoHS and REACH compliance per Intel product page. AEC-Q100 not applicable - FPGAs are not automotive-qualified by default. Conflict minerals compliance per Intel's regulatory disclosure.
