10AS032E4F27I3LG - Arria 10 SX 320 SoC FPGA, 672-FBGA | Intel
MPN: 10AS032E4F27I3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1310.68 | $1,310.68 |
| 10 | $1245.15 | $12,451.50 |
| 100 | $1179.61 | $117,961.00 |
| 250 | $1130.32 | $282,580.00 |
| 500 | $1085.1 | $542,550.00 |
Drop-in alternatives for 10AS032E4F27I3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS032E4F27I3SG
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$1465 / Unit
View Datasheet →10AS032E4F27E3LG
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$1950 / Unit
View Datasheet →10AS032E4F27E3SG
✅ Drop-In✓ In Stock
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View Datasheet →10AS048E4F27I3LG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS032E3F29I2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10AS032E3F29I2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10AS032E4F27I3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 |
| Hard Processor Subsystem (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | 1.5 GHz |
| Speed Grade | E4 (-4, mid-tier) |
| Temperature Grade | Industrial (-40C to +100C) |
| Package | 672-pin FCBGA (F27, 27x27 mm) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Process Technology | 20 nm |
| Transceivers | Up to 24 channels, up to 14.1 Gbps (family-level) |
| DSP Blocks | Hardened floating-point DSP (family-level) |
| Memory Interfaces | DDR3 / DDR4 with hard controllers (family-level) |
| Configuration Method | JTAG, ASx4, FPP (family-level) |
10AS032E4F27I3LG 672-pin fcbga (f27, 27x27 mm) Pin Configuration Guide
Complete pinout information for 10AS032E4F27I3LG (672-pin fcbga (f27, 27x27 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032E4F27I3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032E4F27I3LG is suitable for 6 applications: Industrial Motor Control and Servo Drives, Video Surveillance and Broadcast Equipment, Military and Aerospace Signal Processing, Medical Imaging Systems, High-Speed Serial Protocol Bridging, Test and Measurement Instrumentation.
Industrial Motor Control and Servo Drives
The 10AS032E4F27I3LG suits industrial motor control because the dual 1.5 GHz ARM Cortex-A9 MPCore HPS executes real-time control loops while the 320K logic elements implement custom PWM modulators and encoder interfaces. The Arria 10 SX family supports hard DSP blocks with floating-point, enabling closed-loop torque/speed loops with sub-microsecond update rates. The industrial -40C to +100C temperature grade and FCBGA-672 27x27 mm footprint allow compact integration into servo drive enclosures. According to the Arria 10 device overview, hard tri-speed Ethernet MACs in the HPS simplify EtherCAT and PROFINET connectivity. The SoC integrates DDR3/DDR4 controllers, eliminating external memory and reducing BOM in motor control platforms.
Recommended
Video Surveillance and Broadcast Equipment
The 10AS032E4F27I3LG supports video surveillance and broadcast pipelines because the SoC HPS runs Linux for IP camera stack/streaming while the FPGA fabric accelerates video processing functions. Up to 14.1 Gbps transceivers (Arria 10 family capability) enable SDI, HDMI, and 12G-SDI coax transport with minimal external glue logic. The hardened DDR3/DDR4 controllers feed the HPS at high bandwidth, while hardened floating-point DSP blocks accelerate video scaling and overlay operations. The FCBGA-672 27x27 mm footprint is compact enough for 1U rack-mount broadcast chassis. Industrial temperature grade and SoC integration reduce BOM cost compared to discrete CPU+FPGA designs in surveillance and broadcast appliances.
Recommended
Military and Aerospace Signal Processing
The 10AS032E4F27I3LG fits military/aerospace signal processing because the industrial -40C to +100C temperature range and SoC FPGA architecture provide secure, deterministic processing for radar, EW, and SIGINT payloads. The dual ARM Cortex-A9 HPS with TrustZone runs secure mission software, while the FPGA fabric executes high-throughput DSP pipelines for radar FFTs and digital beamforming. Hardened floating-point DSP blocks reduce FPGA power per FLOP compared to soft implementations. Up to 14.1 Gbps transceivers enable fiber-optic data links to antenna arrays. The FCBGA-672 27x27 mm footprint supports ruggedized PCB designs common in airborne and shipboard platforms.
Recommended
Medical Imaging Systems
The 10AS032E4F27I3LG enables medical imaging because the SoC FPGA architecture combines image acquisition pipelines in the FPGA fabric with patient-interface processing on the ARM Cortex-A9 HPS. Hard DSP blocks accelerate CT/MRI backprojection and ultrasound beamforming at low latency. The 1.5 GHz dual-core HPS runs display software and network stacks, while fabric logic handles sensor interface and real-time control. Industrial temperature grade supports the thermal envelope of medical cart and portable imaging equipment. According to Arria 10 family documentation, hard PCIe Gen3 IP in the transceiver subsystem connects to host workstations at multi-Gbps rates for diagnostic image transfer.
Recommended
High-Speed Serial Protocol Bridging
The 10AS032E4F27I3LG targets high-speed serial protocol bridging because the Arria 10 SX family supports up to 14.1 Gbps transceivers and hard PCIe Gen3, 10 GbE, CPRI, and serial RapidIO IP cores. The SoC HPS runs protocol control planes while the FPGA fabric handles wire-rate data plane bridging. The 672-pin FCBGA-672 27x27 mm footprint offers ample transceiver balls for multi-lane bridging designs. Industrial temperature grade allows deployment in outdoor telecom cabinets and base-station racks. According to Arria 10 device documentation, hardened PCIe Gen3 x8 endpoints enable direct CPU or backplane connectivity.
Recommended
Test and Measurement Instrumentation
The 10AS032E4F27I3LG serves test and measurement because the FPGA fabric implements high-speed data acquisition and arbitrary waveform generation while the HPS handles instrument control, display, and connectivity. Hardened floating-point DSP blocks accelerate FFT and signal demodulation in real time without fabric overhead. The dual 1.5 GHz ARM Cortex-A9 cores run Linux instrument stacks with USB and Ethernet connectivity through hard peripherals. Industrial temperature grade supports lab and field-test environments. Per the Arria 10 device handbook, the integrated transceivers support up to 14.1 Gbps for digitizer-to-host links over PCIe Gen3 or 10 GbE.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032E4F27I3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032E4F27I3SG | 10AS032E4F27E3LG | 10AS032E4F27E3SG | 10AS048E4F27I3LG | 10AS032E3F29I2LG | 10AS032E3F29I2SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FCBGA (F27, 27x27 mm) | 672-FCBGA (F27, 27x27 mm) - same | 672-FCBGA (F27, 27x27 mm) - same | 672-FCBGA (F27, 27x27 mm) - same | 672-FCBGA (F27, 27x27 mm) - same | 672-FCBGA (F29, 29x29 mm) - close | 672-FCBGA (F29, 29x29 mm) - close |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 480,000 (+50%) | 320,000 | 320,000 |
| Speed Grade | E4 | E4 | E4 | E4 | E4 | E3 | E3 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| HPS Clock | 1.5 GHz dual Cortex-A9 | 1.5 GHz dual Cortex-A9 | 1.5 GHz dual Cortex-A9 | 1.5 GHz dual Cortex-A9 | 1.5 GHz dual Cortex-A9 | 1.5 GHz dual Cortex-A9 | 1.5 GHz dual Cortex-A9 |
| Transceivers | Up to 24 ch / 14.1 Gbps | Up to 24 ch / 14.1 Gbps | Up to 24 ch / 14.1 Gbps | Up to 24 ch / 14.1 Gbps | Up to 24 ch / 14.1 Gbps | Up to 24 ch / 14.1 Gbps | Up to 24 ch / 14.1 Gbps |
| Approx. Unit Price (USD, qty 1) | 1310.68 (as of 2026-09-04) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Drop-in industrial temperature grade within the same family (vs 10AS032E4F27E3LG)
- Drop-in fabric-density upgrade path within same F27 footprint (vs 10AS048E4F27I3LG)
- Close-pinout F29 family variants for different PCB footprints (vs 10AS032E3F29I2LG)
Design Notes
The Arria 10 SX SoC FPGA requires multiple supply rails - typically 0.9 V core, 1.1 V HPS, multiple I/O rails (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V), and PLL/transceiver supplies. Per the Arria 10 device handbook, power sequencing is critical: the FPGA core must reach its rail before I/O and the HPS supply must power up after the FPGA core. Use a multi-rail controller such as the LTC2977 or EM22xx family to enforce sequencing and monitor undervoltage/overvoltage thresholds. Bulk decoupling (220 uF polymer) and high-frequency ceramic decoupling (10 uF + 100 nF per supply pin cluster) are mandatory - place ceramics within 5 mm of each supply pin. Estimated: at 25% toggle utilization and typical bias, the FPGA core alone draws 3-5 A from the 0.9 V rail.
The FCBGA-672 27x27 mm package has a theta_JA in the 14-20 C/W range depending on PCB design. Per the Arria 10 thermal management user guide, attach the package bottom-side thermal pad to a copper-invar-copper or copper coin via the PCB thermal array, and connect to an inner-plane heat spreader. For deployments near the +100C industrial limit, route at least 4 inner ground planes with thermal vias (0.3 mm drill, 0.5 mm pitch) stitching the thermal pad to the inner layers. Forced-air cooling with at least 2 m/s airflow is recommended for designs running sustained >70% fabric utilization. Estimated: at 6 W total SoC+FPGA power dissipation, junction-to-ambient rise is roughly 85 C above ambient with the recommended thermal design.
The 672-ball FCBGA-672 27x27 mm package uses 1.0 mm ball pitch; follow Intel's recommended land pattern with 0.55 mm pad diameter and NSMD (non-solder mask defined) pads for best assembly yield. Per the Arria 10 PCB design guidelines, route transceiver channels with 85-100 ohm differential impedance and keep skew below 1 ps for data rates above 10 Gbps. Maintain reference plane continuity beneath high-speed signals, especially transceiver lanes and DDR3/DDR4 routes. Layer stackup should target 8-12 layers with at least 4 dedicated to ground and 2 to power planes. Length-match DDR address/command/clock within +/-25 ps for DDR3 and +/-10 ps for DDR4 at the supported rates.
Common pitfalls with the Arria 10 SX family include: (1) configuring the FPGA and HPS to boot from conflicting sources - select MSEL pins and HPS boot mode carefully; (2) failing to enable HPS-to-FPGA bridges correctly in Qsys/Platform Designer, which prevents the ARM cores from accessing fabric peripherals; (3) driving JTAG with logic incompatible with 1.8 V or 2.5 V when the MSEL/I/O bank is set to 1.2 V - check the I/O voltage of the JTAG bank before connecting the programmer. (4) Forgetting the pull-up on the HPS warm/cold reset pin can leave the HPS in an undefined state after power-up. Always consult the Arria 10 SX device handbook pin connection guidelines and the configuration user guide before board bring-up.
Compliance Information
RoHS compliant per Intel/Altera product page. AEC-Q100 not applicable for FPGA. REACH, halogen-free, and conflict minerals data not in provided sources.
