10AS048K2F35I1HG - Arria 10 SX SoC FPGA, 480K LE | Altera
Teilenummer: 10AS048K2F35I1HG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4250 | $4.250,00 |
| 10 | $4095 | $40.950,00 |
| 100 | $3875 | $387.500,00 |
| 250 | $3720 | $930.000,00 |
| 500 | $3580 | $1.790.000,00 |
10AS048K2F35I1HG Übersicht
An SoC FPGA is a hybrid device that merges a general-purpose processor subsystem with a programmable logic fabric on a single die. The hard processor system (HPS) runs an operating system (typically Linux or RTOS) and handles control-plane tasks, networking stacks, and user interfaces, while the FPGA fabric executes latency-critical datapath, signal processing, and parallel workloads. Compared with a discrete CPU-plus-FPGA board design, an SoC FPGA reduces board area, latency between HPS and FPGA, and BOM cost while simplifying the memory architecture through shared DDR controllers.
Key features of the 10AS048K2F35I1HG include the dual-core ARM Cortex-A9 MPCore with NEON media engine, CoreSight debug and trace, a multiport SDRAM controller with hardened DDR3/DDR4/LPDDR3 PHY support, integrated peripheral controllers (USB 2.0, Gigabit Ethernet, NAND, SPI, UART, I2C, SD/MMC), and a rich FPGA fabric that includes 28.05 Mbits of embedded M20K memory blocks, 1.46 Mbits of MLAB, variable-precision DSP blocks, and high-speed serial transceivers up to 14.1 Gbps for PCIe Gen3 and 10G Ethernet.
The Arria 10 architecture pairs the HPS with the FPGA logic via a high-bandwidth on-chip coherence fabric (ACP) and multiple FPGA-to-HPS bridges that deliver multi-gigabit per second throughput between the processor subsystem and the programmable fabric. This architecture is optimized for high-throughput DSP pipelines, motor and motion control, and protocol bridging.
Typical applications include high-speed wireless baseband processing, radar and software-defined radio, video broadcast and surveillance, industrial machine vision, motor and motion control, PCIe accelerator cards, and embedded compute nodes for aerospace and defense. The industrial operating temperature range and 20nm low-power process also make it a fit for outdoor and ruggedized deployments.
When designing with this device, ensure the PCB uses a high-layer-count stack-up (typically 12+ layers) with matched-length impedance control for the transceiver and DDR3/4 channels. Plan power sequencing for the HPS and FPGA rails independently, and use the Quartus Prime toolchain for synthesis, place-and-route, and HPS firmware development (DS-5 / SoC EDS).
Drop-in-Alternativen für 10AS048K2F35I1HG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS048K2F35I1HG (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Logic Elements, Mounting Type, Embedded Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS048K1F35I1HG
✅ Drop-In✓ Auf Lager
$3263.87 / Stück
Datenblatt ansehen →10AS048H2F34I1HG
✅ Drop-In✓ Auf Lager
$2520 / Stück
Datenblatt ansehen →10AS048H4F34I3SG
✅ Drop-In✓ Auf Lager
$2580 / Stück
Datenblatt ansehen →10AS048K2F35I1HG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| DSP Performance | Up to 1.5 GHz |
| Maximum Operating Frequency | 1.5 GHz |
| Transceivers Data Rate | Up to 14.1 Gbps |
| Gehäuse | 1152-FBGA, FC (35x35 mm) |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Process Technology | 20 nm |
| Embedded Memory | 28.05 Mbit M20K + 1.46 Mbit MLAB |
| DDR Memory Support | DDR3 / DDR4 / LPDDR3 (hardened PHY) |
| PCIe Hard IP | PCIe Gen3 x8 (hardened IP) |
| Peripheral Interfaces | USB 2.0, GbE, NAND, SD/MMC, SPI, I2C, UART |
| Montageart | Surface Mount |
| Lead-Free / RoHS | Yes (per Altera product page) |
10AS048K2F35I1HG 1152-fbga, fc (35x35 mm) Pinbelegungsleitfaden
Pinbelegung für 10AS048K2F35I1HG (1152-fbga, fc (35x35 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS048K2F35I1HG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS048K2F35I1HG ist geeignet für 7 Anwendungs: Wireless Baseband Processing, Radar and Software-Defined Radio, Video Broadcast and Surveillance, Industrial Machine Vision, Motor and Motion Control, PCIe Accelerator Cards, Embedded Compute for Aerospace and Defense.
Wireless Baseband Processing
The 10AS048K2F35I1HG is well suited to wireless baseband processing because its FPGA fabric executes multi-antenna DSP pipelines while the dual-core ARM Cortex-A9 HPS runs PHY/MAC stacks. The 28.05 Mbit of M20K memory stores channel coefficients and packet buffers, and transceivers up to 14.1 Gbps handle CPRI or JESD204B links to RF front-ends. With 480K logic elements, designers can implement 4G/5G L1 accelerators, FFT engines, and channel estimators in a single chip. Industrial temperature grade allows outdoor base-station deployment in thermally challenging enclosures.
Empfohlen
Radar and Software-Defined Radio
For radar and software-defined radio (SDR) applications, the 10AS048K2F35I1HG pairs high DSP throughput with the ARM HPS for waveform management and target tracking. Transceivers up to 14.1 Gbps digitize IF signals directly, and the M20K memory blocks act as circular buffers for raw ADC samples. The dual-core ARM Cortex-A9 can host a RTOS or Linux for control-plane tasks, while the FPGA fabric executes pulse compression, CFAR detection, and beamforming. The industrial temperature grade enables deployment in fielded radar systems.
Empfohlen
Video Broadcast and Surveillance
The 10AS048K2F35I1HG's 480K logic elements and embedded memory bandwidth make it suitable for multi-stream video processing, including H.264/H.265 encoding, scaling, and overlay composition. The dual-core ARM Cortex-A9 HPS can run a Linux-based video stack (gstreamer, V4L2) while the FPGA fabric handles pixel-rate processing. PCIe Gen3 hard IP supports frame-capture cards, and the industrial temperature grade suits outdoor surveillance deployments. Hardened memory controllers drive DDR4 buffers for high-resolution streams.
Empfohlen
Industrial Machine Vision
In industrial machine vision, the 10AS048K2F35I1HG executes real-time image processing (filtering, edge detection, geometric measurements) in the FPGA fabric, while the dual-core ARM Cortex-A9 runs classification algorithms and factory-floor networking (EtherCAT, PROFINET). Transceivers up to 14.1 Gbps enable multi-camera CoaXPress or 10 GigE Vision aggregation. With 480K LE and 28 Mbit embedded memory, designers can run multi-camera pipelines at line rate. Industrial temperature grade and long-term availability support factory-floor product lifecycles.
Empfohlen
Motor and Motion Control
The 10AS048K2F35I1HG is an excellent fit for multi-axis motor control: the dual-core ARM Cortex-A9 executes motion control loops (FOC, PID) and fieldbus stacks (EtherCAT, CAN), while the FPGA fabric implements high-resolution PWM generation, encoder decoding, and safety logic. Transceivers support high-speed encoder protocols (EnDat 2.2, BISS-C) over serial interfaces. The integrated HPS eliminates the need for a separate MCU, reducing BOM and latency between control loops and commutation logic. Industrial temperature grade ensures reliable operation in factory environments.
Empfohlen
PCIe Accelerator Cards
The 10AS048K2F35I1HG's hardened PCIe Gen3 x8 IP enables drop-in accelerator card designs for servers. The FPGA fabric can implement compute kernels (FFT, encryption, compression, ML inference), and the dual-core ARM Cortex-A9 HPS can manage host-to-card DMA, flash boot, and housekeeping. With 28 Mbit embedded memory and high transceiver bandwidth, low-latency data movement between host and FPGA fabric is straightforward. Industrial temperature grade supports edge-server deployments.
Empfohlen
Embedded Compute for Aerospace and Defense
For aerospace and defense applications, the 10AS048K2F35I1HG integrates the ARM Cortex-A9 HPS for secure boot, RTOS-based mission management, and cryptographic housekeeping, while the FPGA fabric executes signal processing, sensor fusion, and safety-critical logic. The industrial temperature grade supports avionics and ground-vehicle platforms. Designers benefit from the FPGA's deterministic timing for safety-critical paths combined with the HPS's flexibility for software upgrades. Long-term supply and Intel FPGA toolchain maturity support defense program lifecycles.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS048K2F35I1HG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS048K1F35I1HG | 10AS048H2F34I1HG | 10AS048H4F34I3SG |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FBGA (35x35 mm) | 1152-FBGA (35x35 mm) | 1152-FBGA (35x35 mm) | 1152-FBGA (35x35 mm) |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 + CoreSight | Dual ARM Cortex-A9 + CoreSight | Dual ARM Cortex-A9 + CoreSight | Dual ARM Cortex-A9 + CoreSight |
| Speed Grade | K2 (faster) | K1 (slower) | H2 (transceiver variant) | H4 (transceiver variant, I3 speed) |
| Transceiver Count | K (lower count) | K (lower count) | H2 (mid count) | H4 (highest count) |
| Operating Temperature | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Pinout Compatibility | F35 (baseline) | F35 (pin-compatible) | F34 (different ball map) | F34 (different ball map) |
| RoHS Compliance | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible F35 footprint across the K speed grade family (vs. 10AS048K1F35I1HG)
- Same SoC feature set across H-transceiver variants with different pinouts (vs. 10AS048H2F34I1HG)
- Integrated ARM Cortex-A9 HPS eliminates external MCU (vs. Cyclone 10 GX (non-SoC))
Designhinweise
Estimated: The 1152-ball FCBGA at 35x35 mm requires a high-layer-count PCB stack-up (typically 12+ layers) with laser-drilled microvias or HDI construction for the inner ball rows. Maintain Z-matched impedance (100 ohm differential for transceivers, 50 ohm single-ended) and length-matching within the device's transceiver specs. Use via-in-pad with filled and plated-over microvias for the BGA escape pattern to minimize stub effects on 14.1 Gbps transceivers.
Estimated: The Arria 10 SX requires multiple voltage rails (HPS core, FPGA core, transceivers, I/O banks) with strict sequencing requirements. Use a dedicated power management IC from Intel's recommended list with POR and sequencing, and place bulk decoupling (220 uF polymer + 10 uF ceramic) at each rail input. Typical worst-case power consumption is on the order of tens of watts; design the thermal solution (heatsink, airflow) accordingly. Independent sequencing of HPS and FPGA rails prevents latch-up and inrush faults during hot-plug or brownout events.
The industrial temperature grade is rated to 100C junction, but in practice the package should run cooler than 90C to maximize MTBF. Use a thermal interface material and an aluminum or copper heatsink with sufficient airflow (200 LFM or more recommended). The Arria 10 SX exposes a thermal diode for in-system monitoring via the SmartVID interface. Run Quartus Prime's PowerPlay power analysis early in the design to estimate junction temperature under realistic switching activity.
Common pitfalls with Arria 10 SX designs include ignoring HPS boot configuration (boot source, clock, MSEL settings), failing to lock pin assignments to dedicated HPS pins (which are limited), and underestimating transceiver channel reach at the highest data rates. Always validate DDR3/DDR4 topologies with the Quartus Prime EMIF toolkit and run IBIS-AMI simulations for 14.1 Gbps links before PCB fabrication.
Compliance-Informationen
RoHS and lead-free per Altera (Intel) product page. Industrial temperature grade per device suffix. AEC-Q100 not applicable for this FPG