10AS048H2F34I1HG - Arria 10 SX SoC FPGA, 480K LE, 1152-FBGA | Intel
Teilenummer: 10AS048H2F34I1HG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3488.37 | $3.488,37 |
| 10 | $3295 | $32.950,00 |
| 100 | $2980 | $298.000,00 |
| 500 | $2750 | $1.375.000,00 |
| 1.000 | $2520 | $2.520.000,00 |
10AS048H2F34I1HG Übersicht
A SoC FPGA (System-on-Chip FPGA) is a device that integrates a general-purpose processor subsystem with programmable logic on a single die, allowing hardware accelerators, custom peripherals, and DSP blocks to be tightly coupled to a running operating system. The Arria 10 SX family belongs to Intel's mid-range SoC FPGA portfolio, sitting between the lower-power Cyclone V SoC and the high-performance Stratix 10 SoC devices. Within that family the Arria 10 SX integrates the HPS (ARM Cortex-A9 dual-core with NEON, L1/L2 caches, and peripheral controllers) alongside an FPGA fabric optimized for DSP and transceiver-heavy designs.
Key features include 480K logic elements, 28.6 Mbits of embedded memory, up to 1.5 GHz fabric operation, integrated transceivers (up to 24 channels at 17.4 Gbps), variable-precision DSP blocks, and the hardened HPS with rich peripheral set including USB, EMAC, NAND, SD/SDIO, SPI, I2C, and UART controllers. The 1152-ball FCBGA package supports 492 user I/O pins operating from 0.9 V to 3.3 V LVCMOS/LVDS interfaces. The industrial temperature rating (I1 = -40C to 100C) enables deployment in harsh-environment and outdoor embedded systems.
The device is fabricated on TSMC's 20 nm process, giving a favorable performance-per-watt ratio for DSP-intensive workloads. Integrated transceivers, hard PCIe Gen2/Gen3 IP, and dedicated DDR4/DDR3 memory controllers simplify board design by removing external PHY ICs. The combination of HPS + FPGA fabric plus industrial-grade operation makes it a frequent choice for defense, broadcast, medical imaging, and industrial machine-vision platforms.
Typical applications include software-defined radio (SDR) baseband processing, broadcast video encoders/decoders, industrial machine-vision and video inspection, radar and electronic-warfare signal processing, 5G fronthaul digital pre-distortion, and embedded ARM-Linux controller boards with FPGA acceleration.
When designing with this OPN, engineers should review the Arria 10 SX transceiver reference designs, the HPS pin-mux configuration in Platform Designer, and the Quartus Prime power-estimator early in the schematic phase. The F34 (35x35 mm) 1152-FBGA package requires a multilayer PCB with microvia stack-up; signal-integrity and power-integrity simulations are recommended for SERDES channels above 10 Gbps.
This page synthesizes distributor pricing, same-family drop-in OPN alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für 10AS048H2F34I1HG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS048H2F34I1HG (gleiche Bauform und Footprint) – abweichend in Package, Logic Elements, Mounting Type, Operating Temperature, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS048H1F34I1HG
✅ Drop-In✓ Auf Lager
$2650 / Stück
Datenblatt ansehen →10AS048H2F34E1HG
✅ Drop-In✓ Auf Lager
$3650 / Stück
Datenblatt ansehen →10AS048H2F34E2SG
✅ Drop-In✓ Auf Lager
$3120 / Stück
Datenblatt ansehen →10AS048H2F34E2LG
✅ Drop-In✓ Auf Lager
$2280 / Stück
Datenblatt ansehen →10AS048H1F34E1HG
✅ Drop-In✓ Auf Lager
$3048.91 / Stück
Datenblatt ansehen →10AS048H2F34I1HG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Fabric Frequency | 1.5 GHz |
| Gehäuse | 1152-FBGA, FC (35x35 mm) |
| User I/O Pins | 492 |
| Transceivers | Up to 24 channels |
| Maximum Transceiver Data Rate | 17.4 Gbps |
| Speed Grade | H2 |
| Temperature Grade | Industrial (I1), -40C to 100C |
| Process Technology | 20 nm TSMC |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| I/O Standard Support | LVCMOS / LVDS / LVTTL up to 3.3 V |
10AS048H2F34I1HG Pin-Konfiguration
| Pin 1 | BALL_A1 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 2 | BALL_A2 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 3 | BALL_A3 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 4 | BALL_A4 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 5 | BALL_A5 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 6 | BALL_A6 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 7 | BALL_A7 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 8 | BALL_A8 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 9 | BALL_A9 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 10 | BALL_A10 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 11 | BALL_A11 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 12 | BALL_A12 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 13 | BALL_B1 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 14 | BALL_B2 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 15 | BALL_B3 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 16 | BALL_B4 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 17 | BALL_B5 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 18 | BALL_B6 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 19 | BALL_B7 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Pin 20 | BALL_B8 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
Typische Anwendungen
10AS048H2F34I1HG ist geeignet für 6 Anwendungs: Software-Defined Radio (SDR) Baseband, Broadcast Video Encoder/Decoder, Industrial Machine Vision & Video Inspection, Radar and Electronic-Warfare Signal Processing, 5G Fronthaul Digital Pre-Distortion (DPD), Embedded ARM-Linux Controller with FPGA Acceleration.
Software-Defined Radio (SDR) Baseband
The 10AS048H2F34I1HG fits SDR baseband processing because its dual ARM Cortex-A9 HPS runs the real-time OS and protocol stack while the FPGA fabric executes wideband DDC/DUC, channelization, and FFT kernels. With up to 24 transceivers at 17.4 Gbps, the same die can host multi-band RF aggregation for cellular, defense, or airborne SDRs; the industrial -40C to 100C grade supports outdoor and vehicular deployments. Companion parts include the AD9361 RF transceiver, HMC7044 clock generator, and DDR3/LPDDR3 memory for waveform buffers.
Empfohlen
Broadcast Video Encoder/Decoder
Broadcast 4K/UHD video codecs and contribution encoders benefit from the 10AS048H2F34I1HG's 480K logic elements plus variable-precision DSP for HEVC/H.264 motion estimation and deblocking filtering. The HPS runs the transport stream, scrambling, and IP/ASI mux while the FPGA fabric handles real-time video processing at 60 fps. The 1152-FBGA F34 package provides the 492 user I/Os needed for multiple SDI/HDMI/DisplayPort interfaces. Companion parts include the ADV7511 HDMI transmitter, M25P flash for boot, and Ethernet PHYs for IP transport.
Empfohlen
Industrial Machine Vision & Video Inspection
The 10AS048H2F34I1HG's parallel logic resources and DSP blocks accelerate industrial machine-vision pipelines: image rectification, color-space conversion, defect detection, and CNN inference at line rates. The industrial temperature range (-40C to 100C) supports factory-floor and outdoor installations, while the HPS can run Linux with GigE Vision drivers and OPC-UA connectivity. With 24 transceivers, multiple CoaXPress or GigE Vision cameras can be aggregated. Companion parts include PoE+ controllers, image sensors, and DDR4 memory for high-throughput buffering.
Empfohlen
Radar and Electronic-Warfare Signal Processing
The 10AS048H2F34I1HG is suited for radar and EW systems where wide instantaneous bandwidth and high throughput matter; the 24 transceivers up to 17.4 Gbps handle A/D data capture while the 480K logic elements plus DSP blocks run pulse compression, CFAR detection, and jammer cancellation in real time. The hardened HPS hosts Linux for situational-awareness software and tracks the operator interface. Industrial temperature grade supports airborne, shipboard, and ground-vehicle platforms. Companion parts include the AD9208 wideband ADC, HMC830 PLL, and signal-conditioning amplifiers.
Empfohlen
5G Fronthaul Digital Pre-Distortion (DPD)
In 5G massive-MIMO and fronthaul links, the 10AS048H2F34I1HG runs wideband DPD and CFR (crest-factor reduction) on the FPGA fabric while the HPS handles CPRI/eCPRI MAC, Ethernet, and management. Up to 24 transceivers support multi-radio aggregation and the variable-precision DSP blocks accelerate matrix inversions and LUT updates. The industrial temperature range covers outdoor radio units. Companion parts include the AD9371 transceiver, PoE controllers, and PTP/SyncE clock devices for fronthaul timing.
Empfohlen
Embedded ARM-Linux Controller with FPGA Acceleration
The 10AS048H2F34I1HG is an excellent choice for industrial controllers that must combine a full Linux operating system on the HPS with custom FPGA accelerators - for example, deterministic real-time EtherCAT motion controllers, predictive-maintenance vibration processors, or factory-edge AI gateways. The HPS runs Linux + Docker with OPC-UA, MQTT, and TLS; the FPGA handles high-speed I/O (EtherCAT, Profinet, RS-485) and time-critical DSP. Industrial temperature grade enables deployment in unshielded enclosures. Companion parts include the TPS7A4701 LDO, Ethernet PHYs, and industrial flash.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS048H2F34I1HG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS048H1F34I1HG | 10AS048H2F34E1HG | 10AS048H2F34E2SG | 10AS048H2F34E2LG | 10AS048H1F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same |
| Logic Elements | 480K | 480K - same | 480K - same | 480K - same | 480K - same | 480K - same |
| Speed Grade | H2 | H1 (slower) | H2 - same | H2 - same | H2 - same | H1 (slower) |
| Temperature Grade | Industrial -40C to 100C (I1) | Industrial -40C to 100C (I1) | Enhanced 0C to 100C (E1) | Enhanced 0C to 100C (E2) | Enhanced 0C to 100C (E2) | Enhanced 0C to 100C (E1) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Maximum Transceiver Data Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade (-40C to 100C) with H2 speed (vs. 10AS048H2F34E1HG)
- Highest H2 speed grade within the 10AS048 F34 industrial family (vs. 10AS048H1F34I1HG)
- 1152-ball FCBGA package supports maximum transceiver count (vs. 10AS048H2F34E1HG)
Designhinweise
The 1152-ball FCBGA (35x35 mm) F34 package has a relatively high theta_JB (junction-to-board) of approximately 0.5 C/W and theta_JC (junction-to-case) of 0.05 C/W; designers MUST mount the exposed die-attached pad over a high-layer-count PCB with a thermal via array under the package center to dissipate up to ~20 W of fabric + HPS power. Recommended stack-up is 12+ layers with continuous inner-plane copper under the BGA and a heat sink or top-side heat-spreader for industrial deployments above 8 W total power. Estimated: at 15 W dissipation and 70 C/W theta_JA, junction rises 150 C above ambient; refer to Quartus Prime Power Analyzer early in the design.
The 35x35 mm 1152-FBGA F34 package requires microvia (laser-drilled) stack-up with 1 mm or 0.8 mm pitch escape routing; do NOT attempt 0.5 mm-pitch fan-out without 0.1 mm microvias. Per Intel pin connection guidelines, 0.4 mm-pitch escape is recommended. Decoupling capacitors (0.1 uF, 1 uF, 10 uF) must be placed within 2 mm of the BGA on the BOTTOM side to minimize inductance. Power-plane cuts under the BGA can cause simultaneous switching noise (SSN); keep at least 0.5 mm clearance and stitch with GND vias every 2-3 mm.
Three common pitfalls with the 10AS048H2F34I1HG: (1) do NOT omit MSEL configuration-pin pull resistors - incorrect MSEL setting will prevent configuration; (2) when designing HPS boot, ensure JTAG pins (TCK, TMS, TDI, TDO) are correctly pulled to known logic levels to prevent HPS entering test mode; (3) DDR3/DDR4 routes to the HPS must be length-matched within the stringent tDS/tDH budgets in Quartus Prime - use the DDR pin-macro assignments tool. Also be aware that transceiver reference clocks must be AC-coupled with 100 nF capacitors at the XCVR pins, otherwise CDR locking will fail.
Compliance-Informationen
RoHS compliant per Altera/Intel product page. AEC-Q100 not applicable (FPGA, not automotive discrete). Halogen-free status not explicitly confirmed in verified data. Conflict-minerals compliance inferred from Intel supply-chain program.
