10AS048H4F34I3SG - Arria 10 SX 480K SoC FPGA | Intel | 1152-FBGA
Teilenummer: 10AS048H4F34I3SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3200 | $3.200,00 |
| 10 | $3050 | $30.500,00 |
| 50 | $2890 | $144.500,00 |
| 100 | $2740 | $274.000,00 |
| 500 | $2580 | $1.290.000,00 |
10AS048H4F34I3SG Übersicht
An SoC FPGA is a hybrid device that combines a programmable FPGA fabric with one or more hard processor cores on a single die, eliminating the need for a discrete companion processor and reducing board area, BOM cost, and inter-chip latency. Within the broader taxonomy, the Arria 10 SX family sits under Intel's mid-range FPGA portfolio (positioned between Cyclone and Stratix families) and is intended for mid-to-high-performance signal processing and embedded compute workloads where both logic density and deterministic ARM Cortex-A9 processing are required in the same chip.
Key features of the 10AS048H4F34I3SG include 480K logic elements, embedded ARM Cortex-A9 cores with CoreSight debug, on-chip floating-point DSP blocks, integrated transceivers, and high-speed memory interfaces. The device supports DDR4 external memory and offers flexible configuration via serial or parallel flash. Built on TSMC's 20 nm process, it achieves an attractive balance of static and dynamic power versus performance, suiting applications that demand DSP throughput, low-latency serial links, and software-defined control simultaneously.
Architecture-wise, the Arria 10 SX integrates a coherent interconnect between the FPGA fabric and the ARM Cortex-A9 subsystem through a high-bandwidth system interconnect, allowing the hard processor to access FPGA-allocated memory and peripherals with predictable latency. The 1.5 GHz core clock combined with floating-point-enabled DSP blocks enables efficient processing of high-sample-rate baseband or video streams directly in hardware.
Typical applications include software-defined radio (SDR), wireless baseband processing, industrial machine vision, real-time video transcoding, medical imaging front-ends, and high-performance industrial control. Designers select this part when the workload requires both deterministic ARM Cortex-A9 control and FPGA-accelerated datapaths in a single package.
Designers should plan thermal dissipation carefully given the 35 mm x 35 mm FCBGA package and the device's 1.5 GHz core activity; a multi-layer PCB with adequate via array under the exposed die region and, in many cases, an attached heatsink is recommended. Power sequencing must follow Intel's Arria 10 SX power-up guidelines to avoid inrush damage to the SoC subsystem. Pin compatibility within the Arria 10 family simplifies migration between density grades.
This page synthesizes distributor pricing and stock data, drop-in same-package alternatives from the Arria 10 SX family, and design considerations not found in the manufacturer datasheet.
Drop-in-Alternativen für 10AS048H4F34I3SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS048H4F34I3SG (gleiche Bauform und Footprint) – abweichend in Package, Mounting Type, Operating Temperature, Logic Elements, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS048H4F34I3LG
✅ Drop-In✓ Auf Lager
$3920 / Stück
Datenblatt ansehen →10AS048H4F34E3SG
✅ Drop-In✓ Auf Lager
$2250 / Stück
Datenblatt ansehen →10AS048H4F34E3LG
✅ Drop-In✓ Auf Lager
$2295 / Stück
Datenblatt ansehen →10AS048H3F34I2SG
✅ Drop-In✓ Auf Lager
$3450 / Stück
Datenblatt ansehen →10AS048H3F34I2LG
✅ Drop-In✓ Auf Lager
$2960 / Stück
Datenblatt ansehen →10AS032H4F34I3SG
✅ Drop-In✓ Auf Lager
$3150 / Stück
Datenblatt ansehen →10AS048H4F34I3SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Maximum Clock | 1.5 GHz |
| Process Technology | TSMC 20 nm |
| Gehäuse | 1152-pin FCBGA (FineLine BGA), 35 mm x 35 mm |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| RoHS-Status | Compliant |
| External Memory Support | DDR4 (per Arria 10 family) |
| Configuration Scheme | Serial or parallel flash |
| Montageart | Surface Mount (BGA) |
10AS048H4F34I3SG 1152-pin fcbga (fineline bga), 35 mm x 35 mm Pinbelegungsleitfaden
Pinbelegung für 10AS048H4F34I3SG (1152-pin fcbga (fineline bga), 35 mm x 35 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS048H4F34I3SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS048H4F34I3SG ist geeignet für 7 Anwendungs: Software-Defined Radio (SDR) Baseband, Industrial Machine Vision and Video Processing, Medical Imaging Front-End Processing, 5G and Wireless Baseband Processing, Real-Time Industrial Control and Motion, High-Performance Test and Measurement, Aerospace Avionics and Unmanned Systems.
Software-Defined Radio (SDR) Baseband
The 10AS048H4F34I3SG's 480K logic elements and floating-point DSP blocks deliver the parallel multiply-accumulate throughput required for wideband SDR baseband processing, while the dual ARM Cortex-A9 cores at 1.5 GHz run the host stack, MAC layer, and control plane. Designers instantiate digital up/down converters, FFT pipelines, and channelizers in the FPGA fabric, then hand decoded symbols to the HPS over the coherent interconnect with deterministic latency. The industrial temperature range suits outdoor small-cell and tactical radio deployments.
Empfohlen
Industrial Machine Vision and Video Processing
Machine vision pipelines need both pixel-rate processing and a Linux-capable host to run OpenCV or customer analytics. The 10AS048H4F34I3SG fits this role with 480K LE for Bayer demosaicing, HDR merging, and CNN inference accelerators in the fabric, plus an ARM Cortex-A9 subsystem running the application layer. The 1.5 GHz HPS clock keeps frame-to-decision latency low. The 1152-FCBGA package supports MIPI CSI-2 receive and HDMI output bridges in the same device.
Empfohlen
Medical Imaging Front-End Processing
Ultrasound beamforming, CT reconstruction pre-processing, and endoscopy video pipelines all demand deterministic high-throughput DSP coupled with a regulatory-friendly embedded host. The 10AS048H4F34I3SG's 480K LE plus floating-point DSP blocks perform delay-and-sum beamforming or back-projection in real time, while the ARM Cortex-A9 subsystem manages the user interface and DICOM stack. The 20 nm process keeps per-channel power low enough for cart-mounted diagnostic equipment.
Empfohlen
5G and Wireless Baseband Processing
Small-cell and picocell baseband cards need real-time OFDM processing at hundreds of MHz of occupied bandwidth. The 10AS048H4F34I3SG places the FFT/iFFT, channel coding, and crest-factor-reduction blocks in FPGA fabric running at high DSP block count, while the dual ARM Cortex-A9 cores handle L2/L3 protocol layers. The integrated transceivers (per Arria 10 family) support CPRI or eCPRI backhaul links to a central unit without a companion chip.
Empfohlen
Real-Time Industrial Control and Motion
Multi-axis motion controllers require deterministic microsecond-class loop times for servo regulation. The 10AS048H4F34I3SG's FPGA fabric runs the position, velocity, and current control loops in parallel hardware, while the ARM Cortex-A9 subsystem handles EtherCAT master, OPC UA, and the HMI stack. The industrial temperature grade and 1.5 GHz HPS clock make the device suitable for factory-floor controllers with no active cooling.
Empfohlen
High-Performance Test and Measurement
Vector signal analyzers, protocol testers, and arbitrary waveform generators need simultaneous wideband DSP and an embedded controller for the user interface. The 10AS048H4F34I3SG implements FFT-based spectrum analysis, digital pre-distortion, and trigger logic in fabric while the ARM Cortex-A9 subsystem runs Linux with the test application. The 20 nm device delivers the dynamic range required for lab-grade instruments in a single chip.
Empfohlen
Aerospace Avionics and Unmanned Systems
Unmanned aerial vehicles and avionics subsystems benefit from consolidating guidance, navigation, and control into a single SoC FPGA. The 10AS048H4F34I3SG runs the INS/GPS fusion filter and sensor I/O in the FPGA fabric while the dual ARM Cortex-A9 cores handle flight management and telemetry. The industrial temperature range, high DSP throughput, and integrated ARM subsystem enable SWaP-C-optimized avionics boxes in a 35 mm x 35 mm package footprint.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS048H4F34I3SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS048H4F34I3LG | 10AS048H4F34E3SG | 10AS048H3F34I2SG | 10AS032H4F34I3SG |
|---|---|---|---|---|---|
| Package | 1152-FCBGA (35x35 mm) | 1152-FCBGA (35x35 mm) | 1152-FCBGA (35x35 mm) | 1152-FCBGA (35x35 mm) | 1152-FCBGA (35x35 mm) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 320,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Processor Max Clock | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Temperature Grade | Industrial (-40C to +100C) | Extended industrial | Commercial (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | 3 (mid) | 3 (mid) | 3 (mid) | 2 (faster) | 3 (mid) |
| Approx. Unit Price (qty 1) | USD 3200 | USD 3300 | USD 3000 | USD 3450 | USD 2400 |
Wichtigste Unterscheidungsmerkmale
- Integrated dual ARM Cortex-A9 MPCore with CoreSight (vs. 10AS032H4F34I3SG)
- Speed grade 3 optimized for power efficiency (vs. 10AS048H3F34I2SG)
- Industrial temperature grade for harsh environments (vs. 10AS048H4F34E3SG)
Designhinweise
Estimated: at full fabric utilization with the dual ARM Cortex-A9 cores active at 1.5 GHz and sustained DSP usage, the 10AS048H4F34I3SG can dissipate 15-25 W. The 35 mm x 35 mm FCBGA package requires a multi-layer PCB with a dense via array under the exposed die region plus, in most chassis environments, an attached heatsink or thermal interface material. Use Intel's PowerPlay Early Power Estimator (EPE) tool with your activity factors for a design-specific number.
The 1152-ball FCBGA requires a high-density PCB stack-up with microvia or laser-drilled vias to break out the inner rows of the BGA. Maintain 50 ohm controlled impedance on high-speed transceiver and DDR4 routes. Reference Intel's Arria 10 SX board design guidelines for stack-up recommendations, decoupling capacitor placement, and length-matching tolerances for the FPGA-HPS bridge signals.
Do not assume configuration from flash will succeed on first power-up: Intel recommends a known-good configuration image plus a watchdog fallback. Use the Arria 10 HPS boot flow from SD card or QSPI flash, with the FPGA fabric bitstream stored separately if you need conditional FPGA configuration. Confirm pull-up resistor values on JTAG, MSEL, and nCONFIG pins per Intel's configuration user guide.
Compliance-Informationen
RoHS and lead-free per AiPCBA product listing and distributor data. REACH, halogen-free, and conflict-mineral statements not explicitly listed in retrieved data and marked unknown. AEC-Q100 not applicable to FPGAs in this class.
