10AX090U3F45I2SG - Arria 10 GX FPGA 900K LE | Intel | 1932-BGA
Teilenummer: 10AX090U3F45I2SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9025.49 | $9.025,49 |
| 10 | $8650 | $86.500,00 |
| 100 | $8200 | $820.000,00 |
| 500 | $7800 | $3.900.000,00 |
| 1.000 | $7450 | $7.450.000,00 |
10AX090U3F45I2SG Übersicht
Key features include 28.05 Gbps transceivers, 3,733 18x19 multipliers (variable-precision DSP blocks), 1,518 LVDS-capable user I/O, integrated hard memory controllers, and partial reconfiguration support. The device targets mid- to high-performance transceiver-based designs where high logic density, abundant DSP, and high-speed serial connectivity must coexist in a single FPGA.
A field-programmable gate array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as DSP slices, block RAM, PLLs, and high-speed transceivers. FPGAs sit within the broader category of programmable logic devices (PLDs) and, in modern system hierarchies, are often co-classified with processors as parallel computing fabrics. Arria 10 specifically targets transceiver-rich applications in the wireless, broadcast, and high-performance computing segments.
The 10AX090U3F45I2SG utilizes TSMC's 20nm process with a hard-core PCIe Gen2/Gen3 controller, multi-protocol memory interface support (DDR3, DDR4, QDR II+, RLDRAM 3), and 28.05 Gbps backplane-capable transceivers. The F45 package designation indicates a 45mm body FCBGA optimized for high-pin-count line cards.
Typical applications include 4K video processing and broadcast equipment, 100G/400G Ethernet line cards, wireless baseband processing, military radar prototyping, and test and measurement ASIC prototyping. The industrial temperature grade (-40C to +100C) supports deployment in non-extreme environments including outdoor telecom and industrial imaging.
When designing with this device, ensure that Quartus Prime software targeting the 20nm node is used, verify transceiver reference clock architecture against the relevant Arria 10 Transceiver PHY User Guide, and confirm power delivery supports up to approximately 40W peak dissipation with proper heatsinking.
This page synthesizes distributor pricing, drop-in same-package speed-grade and logic-density variants, and practical design considerations drawn from Intel/Altera documentation not aggregated on standard distributor listings.
Drop-in-Alternativen für 10AX090U3F45I2SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX090U3F45I2SG (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, DSP Blocks, Speed Grade, Transceivers.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX090U3F45I2LG
✅ Drop-In✓ Auf Lager
$9750 / Stück
Datenblatt ansehen →10AX090U3F45E2SG
✅ Drop-In✓ Auf Lager
$3295 / Stück
Datenblatt ansehen →10AX090U2F45I2SG
✅ Drop-In✓ Auf Lager
$3640 / Stück
Datenblatt ansehen →10AX090U2F45I2LG
✅ Drop-In✓ Auf Lager
$7957.34 / Stück
Datenblatt ansehen →10AX090U2F45I1SG
✅ Drop-In✓ Auf Lager
$6895.59 / Stück
Datenblatt ansehen →10AX090U3F45I2SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Logic Elements | 900000 |
| Embedded Memory Bits | 59234304 |
| Number of User I/O | 480 |
| Process Technology | 20nm |
| Core Voltage | 0.9 V |
| Gehäuse | 1932-BBGA, FCBGA (F45) |
| Number of Terminals | 1932 |
| Terminal Form | BALL |
| Package Shape | SQUARE |
| Operating Temperature Grade | INDUSTRIAL |
| Transceivers | Up to 28.05 Gbps |
| DSP Blocks | Variable-precision multipliers |
| Montageart | Surface Mount (BGA) |
| Compliance | RoHS compliant per Altera product page |
10AX090U3F45I2SG square Pinbelegungsleitfaden
Pinbelegung für 10AX090U3F45I2SG (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AX090U3F45I2SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AX090U3F45I2SG ist geeignet für 6 Anwendungs: 4K Video Processing and Broadcast Equipment, 100G/400G Ethernet Line Cards, Wireless Baseband and Radio Processing, Test and Measurement Instrumentation, Military Radar and Signal Processing Prototyping, ASIC Prototyping and Emulation.
4K Video Processing and Broadcast Equipment
The 10AX090U3F45I2SG's 900,000 logic elements and high-speed 28.05 Gbps transceivers make it ideal for 4K/UHD video processing pipelines where multi-stream uncompressed video must be ingested, color-corrected, and routed out. The device's variable-precision DSP blocks accelerate chroma upsampling, scaling, and HDR tone-mapping kernels in real time. Placed on broadcast mainboards with multiple 12G-SDI or HDMI 2.1 interfaces, this FPGA consolidates what would otherwise require multiple mid-range FPGAs. The F45 1932-BGA package's high pin count accommodates the dense transceiver and memory interface routing these designs require.
Empfohlen
100G/400G Ethernet Line Cards
The 10AX090U3F45I2SG's 28.05 Gbps transceivers enable direct interfacing with CFP/CFP2/CFP4 optical modules and QSFP28 ports for 100G Ethernet line cards, with multiple transceivers supporting 400G configurations via aggregation. Its hard PCIe Gen2/Gen3 controller simplifies host interface to network processors, while 59 Mbits of embedded memory provide packet buffering headroom. Placed as the MAC/PCS bridge on telecom line cards, the device handles 100G/400G PHY layer functions and L2/L3 forwarding acceleration. The F45 1932-BGA package supports the dense high-speed SERDES routing required for multi-port 100G line cards.
Empfohlen
Wireless Baseband and Radio Processing
The 10AX090U3F45I2SG's combination of high logic density, abundant variable-precision DSP, and 28.05 Gbps transceivers is well-suited to wireless baseband processing for LTE-Advanced and 5G prototype systems. Its DSP blocks accelerate FFT/iFFT, channel coding/decoding, and MIMO matrix operations at the throughput required for multi-antenna radio units. The integrated memory controllers support high-bandwidth DDR4 interfacing to baseband sample buffers. Placed between RF front-end ADCs/DACs and the host processor, this FPGA functions as the real-time baseband engine. The industrial temperature grade supports outdoor small-cell deployments.
Empfohlen
Test and Measurement Instrumentation
The 10AX090U3F45I2SG enables high-channel-count oscilloscopes, logic analyzers, and protocol analyzers that require simultaneous high-speed sampling across many channels. The 480 user I/Os can be partitioned into multiple parallel test interfaces, while 28.05 Gbps transceivers support high-speed serial protocol testing (PCIe, USB 3.1, SATA, DisplayPort). The 900K LE fabric provides real-time pattern matching and triggering logic that off-the-shelf processors cannot match in latency. The F45 1932-BGA package accommodates the dense mixed-signal routing typical of high-end test equipment front ends.
Empfohlen
Military Radar and Signal Processing Prototyping
The 10AX090U3F45I2SG's high logic density and DSP block count serve as a development platform for radar digital signal processing chains (pulse compression, MTI, Doppler processing, SAR focusing). Its industrial temperature grade (-40C to +100C) supports ruggedized prototype deployment for field testing of new radar algorithms. The 28.05 Gbps transceivers enable high-bandwidth RF data capture from modern A/D converters in radar receivers. Placed as the central processing element in radar prototypes, this FPGA accelerates the iterative algorithm development that is impractical on GPU-based systems due to latency and power constraints.
Empfohlen
ASIC Prototyping and Emulation
The 10AX090U3F45I2SG serves as an in-circuit emulator for ASIC designs during pre-silicon validation, with the 900K LE fabric mapping complex SoC logic partitions. Multi-FPGA prototyping boards can be built by interconnecting several Arria 10 GX FPGAs via their 28.05 Gbps transceivers to achieve multi-million-ASIC-gate capacity. The hard memory controllers and abundant block RAM accelerate memory-mapped subsystem prototyping. Placed on ASIC prototyping boards alongside test stimulus generation, this FPGA enables software bring-up and hardware-software co-validation months before silicon availability. The F45 1932-BGA package supports the high-density interconnect typical of multi-FPGA partition boards.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX090U3F45I2SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX090U3F45I2LG | 10AX090U3F45E2SG | 10AX090U2F45I2SG | 10AX090U2F45I2LG | 10AX090U2F45I1SG |
|---|---|---|---|---|---|---|
| Package | 1932-BBGA, FCBGA (F45) | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | -3 | -3 | -2 | -2 | -2 | -1 |
| Temperature Grade | Industrial | Industrial | Extended | Industrial | Industrial | Industrial |
| Logic Elements | 900000 | 900000 | 900000 | 900000 | 900000 | 900000 |
| User I/O Count | 480 | 480 | 480 | 480 | 480 | 480 |
| Embedded Memory | 59234304 bits | 59234304 bits | 59234304 bits | 59234304 bits | 59234304 bits | 59234304 bits |
| Process Node | 20nm | 20nm | 20nm | 20nm | 20nm | 20nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Terminal Finish | SnPb (non-leaded per ordering code I2SG) | Lead-free (LG suffix) | SnPb (E2SG) | SnPb (I2SG) | Lead-free (LG) | SnPb (I1SG) |
Wichtigste Unterscheidungsmerkmale
- Highest speed grade (-3) with full F45 1932-BGA compatibility (vs. 10AX090U2F45I2SG)
- Industrial temperature grade (-40C to +100C) with full 900K LE density (vs. 10AX090U3F45E2SG)
- Lead-free variant available in identical F45 footprint (vs. 10AX090U3F45I2LG)
Designhinweise
The Arria 10 GX 10AX090 at full utilization with all transceivers active can dissipate up to approximately 40W peak per Altera thermal modeling. The 1932-BGA F45 package requires either a high-performance heatsink with thermal interface material or a cold-plate solution for sustained workloads. Estimated: at 25C ambient and 40W dissipation with a properly mounted heatsink rated at theta_SA = 0.5 C/W, junction-to-ambient thermal resistance of approximately 1.5 C/W yields a junction temperature rise of about 60C, well within the industrial 100C limit. Without active cooling, the device will throttle or exceed temperature limits under full load.
The 1932-ball FCBGA F45 package requires a high-layer-count PCB (typically 14+ layers) with microvia (uVia) construction and 0.4mm or finer pitch escape routing. BGA break-out must use dog-bone or via-in-pad designs depending on the PCB fabricator's capabilities. High-speed transceiver channels require matched-length routing and controlled impedance per the Arria 10 Transceiver PHY User Guide. Power delivery requires low-impedance planes for 0.9V core with decoupling capacitors placed within the BGA escape region.
Do not confuse speed grade ordering codes: U3 = speed grade -3, U2 = speed grade -2, U1 = speed grade -1; the I/E prefix denotes industrial vs extended temperature, and SG/LG denotes SnPb vs lead-free terminal finish. Mixing speed grades can lead to timing closure failures because Fmax specifications differ. Always verify the Arria 10 ordering code matches the Quartus Prime device selection before board bring-up. Estimated: design impact of using speed grade -2 vs -3 typically limits transceiver data rates by approximately 10-15% at the same VCC.
Transceiver channel placement in the F45 package must follow the bank architecture defined in the Arria 10 GX Device Family Pin Connection Guidelines. Each transceiver bank has dedicated reference clock inputs that must be routed with matched lengths and proper isolation. Differential pair lengths within a transceiver channel must be matched within 0.127mm (5 mil) per Arria 10 documentation. Power pin decoupling must follow the recommended capacitor network from the Arria 10 Hardware Reference Manual to suppress simultaneous switching noise.
Compliance-Informationen
The I2SG suffix indicates SnPb terminal finish (not lead-free per ordering code conventions). RoHS compliance per Altera product page. Lead-free LG suffix variants (e.g. 10AX090U3F45I2LG) are available as drop-in same-package alternatives for RoHS-compliant end products. AEC-Q100 not applicable - this is a commercial/industrial FPGA. REACH, halogen-free, and conflict minerals status not specified in the verified data.
