10AX090S3F45I2SG - Arria 10 GX 900K LE FPGA | Intel | F45 FCBGA
Teilenummer: 10AX090S3F45I2SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7606.24 | $7.606,24 |
| 10 | $6845.62 | $68.456,20 |
| 100 | $6084.99 | $608.499,00 |
| 500 | $5324.37 | $2.662.185,00 |
| 1.000 | $4563.74 | $4.563.740,00 |
10AX090S3F45I2SG Übersicht
What is an FPGA? A Field-Programmable Gate Array is a reconfigurable integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP slices, and hardened IP blocks such as transceivers and PCIe interfaces. FPGAs sit between general-purpose microcontrollers (fixed function) and ASICs (custom-silicon performance) in the broader semiconductor taxonomy: FPGA -> programmable logic -> programmable logic device -> logic IC -> integrated circuit. Arria 10 GX FPGAs specifically target mid-range, transceiver-rich applications where Stratix-class performance is not required.
Key features of the 10AX090S3F45I2SG include up to 96 full-duplex backplane-capable transceivers with data rates up to 12.5 Gbps (chip-to-chip) and 10.3125 Gbps (backplane), hardened PCI Express Gen3 x8 IP blocks, two hard memory controllers supporting DDR4/DDR3/QDRIV/RLDRAM3, and a 1.6 Gbps LVDS serializer/deserializer interface. The device integrates variable-precision DSP blocks supporting IEEE 754 single-precision floating-point at up to 1.5 TFLOPs.
The Arria 10 architecture combines a unified fabric with hard IP for transceivers, PCIe, memory controllers, and a hard processor subsystem, reducing power by up to 40% versus previous generations while delivering up to 2x the performance. The 20nm process enables high logic density and on-die memory capacity. Industrial temperature grade and the I2 speed grade make this OPN well-suited to harsh-environment applications.
Typical applications include high-throughput wireless baseband processing, radar and electronic warfare beamforming, broadcast and professional video processing, medical imaging backplanes, and high-speed test and measurement equipment. The 624 user I/Os and 96 transceivers also suit 100G/40G line-card designs and PCI Express Gen3 accelerator cards.
When designing with this device, allocate sufficient PCB layer count (typically 12-18 layers) for the 1932-ball F45 FCBGA escape routing, use Enpirion PowerSoC or discrete DrMOS power stages for the 0.9V core, and follow Intel's pin-out guidelines for transceiver reference clock and decoupling placement to meet jitter budgets.
This page synthesizes distributor pricing, drop-in alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für 10AX090S3F45I2SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX090S3F45I2SG (gleiche Bauform und Footprint) – abweichend in Speed Grade, Package, DSP Blocks, Transceivers, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX090S3F45I2LG
✅ Drop-In✓ Auf Lager
$4050 / Stück
Datenblatt ansehen →10AX090S3F45E2SG
✅ Drop-In✓ Auf Lager
$5320 / Stück
Datenblatt ansehen →10AX090S2F45I2SG
✅ Drop-In✓ Auf Lager
$3750 / Stück
Datenblatt ansehen →10AX090S3F45E2LG
✅ Drop-In✓ Auf Lager
$12480 / Stück
Datenblatt ansehen →10AX090S2F45I2LG
✅ Drop-In✓ Auf Lager
$3800 / Stück
Datenblatt ansehen →10AX090S3F45I2SG Grenzwerte & elektrische Eigenschaften
| Series | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory Bits | 59,234,304 |
| User I/Os | 624 |
| Process Technology | 20 nm |
| Core Supply Voltage | 0.9 V |
| Gehäuse | 1932-ball FCBGA (F45) |
| Montageart | Surface Mount |
| Temperature Grade | Industrial |
| Speed Grade | I2 |
| Transceivers | Up to 96 (12.5 Gbps chip-to-chip) |
| Hard PCIe IP | PCIe Gen3 x8 (backwards compatible to Gen2/Gen1) |
| Hard Memory Controllers | 2 (DDR4, DDR3, QDRIV, RLDRAM3) |
| DSP Blocks | Variable-precision, up to ~1.5 TFLOPs FP32 |
| LVDS Channels | Up to 1.6 Gbps |
| RoHS-Status | Compliant |
10AX090S3F45I2SG 1932-ball fcbga (f45) Pinbelegungsleitfaden
Pinbelegung für 10AX090S3F45I2SG (1932-ball fcbga (f45)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AX090S3F45I2SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AX090S3F45I2SG ist geeignet für 6 Anwendungs: Wireless Baseband Processing, Radar and Beamforming, Broadcast and Professional Video Processing, Medical Imaging Backplanes, Test and Measurement Equipment, PCI Express Gen3 Accelerator Cards.
Wireless Baseband Processing
The 10AX090S3F45I2SG's 900K logic elements and up to 96 transceivers running at 12.5 Gbps make it ideal for wireless baseband processing in LTE and 5G base stations. Per the Arria 10 datasheet, the variable-precision DSP blocks deliver up to 1.5 TFLOPs single-precision floating-point, enabling CPRI and JESD204B-based radio unit (RU) implementations. Industrial temperature grade ensures operation in outdoor base-station enclosures.
Empfohlen
Radar and Beamforming
The 10AX090S3F45I2SG delivers high-density DSP for phased-array radar and electronic-warfare beamforming. Its 96 transceivers at 12.5 Gbps and 1.5 TFLOPs of FP32 DSP support hundreds of antenna-element streams in a single device. The F45 FCBGA package integrates the device into 12-18 layer radar backplanes, while hard PCIe Gen3 x8 IP accelerates host-side data ingest from external DSP or storage.
Empfohlen
Broadcast and Professional Video Processing
The 10AX090S3F45I2SG's 624 user I/Os and high transceiver count suit uncompressed 4K/8K broadcast video routing and processing. The Arria 10 GX architecture integrates displayport, HDMI, SDI, and 12G-SDI physical interfaces via soft IP, while the 59.2 Mbit embedded memory supports multi-frame buffering without external SDRAM. Industrial temperature grade enables reliable operation in studio and outside-broadcast (OB) vans.
Empfohlen
Medical Imaging Backplanes
The 10AX090S3F45I2SG is well suited to MRI, CT, and ultrasound imaging backplanes that aggregate multi-gigabit sensor data. Its 96 transceivers support high-speed JESD204B/C links from analog front-ends, while the 624 user I/Os connect to image-pipeline memory and DSP subsystems. The industrial temperature grade plus low-power 20nm process helps meet medical thermal budgets.
Empfohlen
Test and Measurement Equipment
The 10AX090S3F45I2SG powers high-end oscilloscopes, logic analyzers, and protocol testers that need 100G Ethernet, PCIe Gen3, and 12.5 Gbps backplane signal capture. Its hard PCIe Gen3 x8 IP enables line-rate data export to host servers, and the 1.5 TFLOPs DSP delivers real-time FFT and protocol decode. The F45 FCBGA 1932-ball package allows dense board integration.
Empfohlen
PCI Express Gen3 Accelerator Cards
The 10AX090S3F45I2SG's hard PCIe Gen3 x8 IP block enables drop-in accelerator card designs targeting HPC, AI inference, and storage acceleration. The 900K logic elements and 1.5 TFLOPs DSP provide ample compute capacity, while 96 transceivers connect to QSFP28 100G network ports for clustering. Industrial temperature grade supports data-center cold-aisle and edge deployment.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX090S3F45I2SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX090S3F45I2LG | 10AX090S3F45E2SG | 10AX090S2F45I2SG | 10AX090S3F45E2LG | 10AX090S2F45I2LG |
|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Extended | Industrial | Extended | Industrial |
| Speed Grade | I2 | I2 | E2 | I2 | E2 | I2 |
| Lead-Free Finish | No (SnPb) | Yes (Pb-free) | No (SnPb) | No (SnPb) | Yes (Pb-free) | Yes (Pb-free) |
| Transceivers | Up to 96 | Up to 96 | Up to 96 | Fewer (~64) | Up to 96 | Fewer (~64) |
Wichtigste Unterscheidungsmerkmale
- Highest logic density in the Arria 10 F45 FCBGA family (vs. 10AX066S3F45I2SG)
- Maximum transceiver count with industrial-grade speed grade (vs. 10AX090S2F45I2SG)
- Industrial speed grade I2 over extended E2 (vs. 10AX090S3F45E2SG)
Designhinweise
The 1932-ball F45 FCBGA requires a minimum 12-layer PCB stackup (Intel recommends 18 layers for full signal-integrity margin). Use 1.0 mm ball pitch escape routing with microvia-in-pad or HDI stackup to break out the dense BGA array. Reference the Altera Arria 10 F45 layout guidelines for via-in-pad antipad and power-plane recommendations.
Power the 0.9V core rail using Enpirion PowerSoC or discrete DrMOS stages with sufficient bulk decoupling (recommended 22x 22uF ceramic + 4x 470uF polymer) per Intel's Arria 10 power-tree reference design. Use the Arria 10 Early Power Estimator (EPE) worksheet to size rails before schematic capture; expected total power is 15-25W depending on transceiver utilization and DSP activity.
Estimated: at 0.9V x 20A core current and full transceiver utilization, junction-to-ambient thermal resistance needs to be below 1.5 C/W. The F45 package has a top-side exposed die and thermal lid - apply thermal interface material (TIM) and use a heatsink with low thermal resistance. Industrial-grade parts must keep Tj below +100C under worst-case workload.
For 12.5 Gbps chip-to-chip transceivers, route the high-speed SERDES channels on inner stripline layers with controlled impedance (100 ohm differential) and length-matching tolerance of 0.127 mm within a channel pair. Use reference clock jitter attenuators with RMS jitter below 150 fs for backplane applications.
Compliance-Informationen
10AX090S3F45I2SG uses standard SnPb (non-lead-free) finish. For RoHS-compliant drop-in replacement, choose 10AX090S3F45I2LG. AEC-Q100 not applicable - this is an FPGA. Reach and conflict-minerals compliance per Intel.