10AX115R1F40I1SG - Arria 10 GX FPGA, 1.15M LE, FCBGA-1517 | Intel
Teilenummer: 10AX115R1F40I1SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $12041.19 | $12.041,19 |
| 10 | $10837.07 | $108.370,70 |
| 100 | $9634.95 | $963.495,00 |
| 500 | $8435.83 | $4.217.915,00 |
| 1.000 | $7232.71 | $7.232.710,00 |
10AX115R1F40I1SG Übersicht
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect that can be reconfigured by the customer after manufacture. FPGAs sit in the hierarchy: programmable logic -> ASIC alternative -> parallel processing accelerator -> semiconductor IC. They trade raw clock speed for massive parallelism and reconfigurability, making them ideal for evolving standards, low-volume ASIC replacement, and hardware-accelerated compute.
Key features include 427,200 adaptive logic modules (ALMs), 1,518 embedded 18x18 multipliers, 24 high-speed transceivers with hardened PCIe Gen3 and 10G Ethernet IP, 1.15M logic elements, and hardware floating-point support. Hardened memory controllers support DDR3/DDR4 with ECC, while on-chip 20 Gbps transceivers reduce BOM cost and board complexity for high-bandwidth links.
The Arria 10 architecture combines a mid-range logic fabric with high-end transceiver performance at lower power than the prior 28 nm generation, targeting 20 nm process advantages and SmartVID dynamic voltage scaling. The device supports partial reconfiguration, design security via bitstream encryption, and Quartus Prime development flow, making it a strong fit for production-grade applications.
Typical applications include high-speed serial backplane bridges, 100G/400G line-card packet processing, FPGA-based hardware accelerators for data-center offload, video broadcast and studio processing, military radar front-end preprocessing, and 4K/8K video capture. Its combination of high logic density, 14.4 Gbps transceivers, and PCI Express Gen3 hard IP makes it a go-to mid-density FPGA for line-rate data planes.
When designing with this device, pay close attention to PCB routing for the 1517-ball FCBGA - escape routing demands high-density interconnects with microvia stack-ups. Power-rail sequencing must respect SmartVID rails, and thermal management must dissipate up to ~30 W at full transceiver utilization. Plan configuration via JTAG, AS, or fast passive parallel (FPP) modes depending on boot-time constraints.
This page synthesizes distributor pricing, drop-in package-compatible Altera/Intel Arria 10 alternatives, and practical design notes that complement the official datasheet for engineers evaluating mid-density FPGA options.
Drop-in-Alternativen für 10AX115R1F40I1SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX115R1F40I1SG (gleiche Bauform und Footprint) – abweichend in Package, DSP Blocks, Embedded Memory, Transceivers, Hard Memory Controllers.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX115R1F40E1SG
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →10AX115N1F40I1SG
✅ Drop-In✓ Auf Lager
$3450 / Stück
Datenblatt ansehen →10AX115N2F40I1SG
✅ Drop-In✓ Auf Lager
$3720 / Stück
Datenblatt ansehen →10AX115N3F40I2SG
✅ Drop-In✓ Auf Lager
$7100 / Stück
Datenblatt ansehen →10AX115R2F40I1SG
✅ Drop-In✓ Auf Lager
$3490 / Stück
Datenblatt ansehen →10AX090R1F40I1SG
✅ Drop-In✓ Auf Lager
$3783 / Stück
Datenblatt ansehen →10AX115R1F40I1SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Device Class | 10AX115 |
| Logic Elements | 1,150,000 |
| Adaptive Logic Modules (ALMs) | 427,200 |
| Embedded Memory | 68,857,856 bits |
| Embedded 18x18 Multipliers | 1,518 |
| User I/O Count | 342 |
| High-Speed Transceivers | 24 channels, up to 14.4 Gbps |
| Hardened Memory Controllers | Yes (DDR3/DDR4 with ECC) |
| Hard PCIe Gen3 IP | Yes |
| Process Technology | TSMC 20 nm |
| Core Voltage | 0.9 V (SmartVID) |
| Gehäuse | 1517-ball FCBGA (F40 package) |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Speed/Power Grade | F40 |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Configuration Modes | JTAG, Active Serial (AS), Fast Passive Parallel (FPP) |
10AX115R1F40I1SG 1517-ball fcbga (f40 package) Pinbelegungsleitfaden
Pinbelegung für 10AX115R1F40I1SG (1517-ball fcbga (f40 package)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AX115R1F40I1SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AX115R1F40I1SG ist geeignet für 7 Anwendungs: 100G Ethernet Line-Card Design, PCIe Gen3 Endpoint Accelerator, 4K/8K Video Broadcast Processing, 5G Wireless Baseband Processing, Military Radar Signal Processing, Data-Center Hardware Accelerator, Test and Measurement Instrumentation.
100G Ethernet Line-Card Design
The 10AX115R1F40I1SG fits 100G Ethernet line cards because it integrates 24 transceivers at up to 14.4 Gbps, sufficient to aggregate 10 lanes of 10.3125 Gbps (CAUI-10) or 4 lanes of 25.78 Gbps via on-chip gearbox logic. The 1.15M LE capacity is enough to instantiate full 100G MAC, PCS, and packet processing pipelines with room for QoS shaping and telemetry. Hardened 100G Ethernet IP in Quartus Prime accelerates time-to-market. Operating at industrial temperature and SmartVID-managed 0.9 V core, the device delivers predictable power across deployment scenarios.
Empfohlen
PCIe Gen3 Endpoint Accelerator
The 10AX115R1F40I1SG is ideal for PCIe Gen3 x8 endpoint accelerator cards due to its hardened Gen3 PCIe IP block, eliminating soft-IP overhead and saving ~50K LEs. The 14.4 Gbps transceivers carry PCIe Gen3 line rate directly without external PHY, and 1,518 18x18 multipliers accelerate DSP workloads such as encryption, compression, or AI inference. With 68.86 Mbit embedded memory and DDR4 controller support, the device buffers large DMA payloads while maintaining deterministic latency. Quartus Prime PCIe reference designs shorten integration timelines.
Empfohlen
4K/8K Video Broadcast Processing
The 10AX115R1F40I1SG fits 4K/8K video broadcast pipelines because its 1,518 DSP blocks handle real-time 12G-SDI deserializers, HDR tone mapping, and multi-stream scaling simultaneously. The 24 transceivers accept quad-link 12G-SDI or SMPTE 2110 IP streams at 10 Gbps each, while 342 GPIOs interface to mezzanine cards, front-panel controls, and timing references. SmartVID reduces power during lower-resolution segments, extending rack thermal headroom in broadcast studios.
Empfohlen
5G Wireless Baseband Processing
The 10AX115R1F40I1SG fits 5G wireless baseband and CPRI fronthaul designs thanks to 14.4 Gbps transceivers that support CPRI Option 7 (9.83 Gbps) and Option 8 (24.33 Gbps via aggregation) with headroom. The 1.15M LE logic capacity hosts LDPC/turbo decoders, FFT/iFFT engines, and beamforming weight calculations for massive MIMO. Industrial temperature rating supports outdoor small-cell deployments, and SmartVID reduces idle power between scheduling slots.
Empfohlen
Military Radar Signal Processing
The 10AX115R1F40I1SG suits military radar front-end processing because its 24 transceivers at 14.4 Gbps aggregate ADC outputs from multi-channel phased-array antennas. The 1,518 DSP blocks run pulse compression, MTI filtering, and FFT-based Doppler processing at real-time rates, while industrial temperature rating meets MIL-STD-810 environmental profiles with appropriate PCB hardening. Hardware floating-point support accelerates beamforming weight computation.
Empfohlen
Data-Center Hardware Accelerator
The 10AX115R1F40I1SG is a strong fit for data-center hardware accelerator cards because its 1.15M LE capacity maps large AI inference graphs, encryption pipelines, or storage offload engines. With PCIe Gen3 x8 hard IP and 24 transceivers, a single card delivers ~50 Gbps host-to-FPGA bandwidth. 68.86 Mbit embedded memory plus DDR4 controller support multi-megabyte weight buffers, while Quartus Prime OpenCL/HLS flows let software teams port algorithms without RTL expertise.
Empfohlen
Test and Measurement Instrumentation
The 10AX115R1F40I1SG suits high-end T&M instrumentation because its logic density and DSP count handle real-time FFT, vector signal analysis, and protocol decoding for oscilloscopes and BERT testers. The 14.4 Gbps transceivers accept high-speed ADC/DAC data streams, while 342 GPIOs interface to display controllers, front-panel buttons, and trigger logic. Industrial temperature support extends bench-to-field use, and Quartus Prime signal integrity toolkits simplify timing closure at high Fmax.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX115R1F40I1SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX115R1F40E1SG | 10AX115N1F40I1SG | 10AX115N2F40I1SG | 10AX115R2F40I1SG |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same |
| Device Class / Logic Elements | 10AX115 / 1,150,000 LE | 10AX115 / 1,150,000 LE | 10AX115 / 1,150,000 LE | 10AX115 / 1,150,000 LE | 10AX115 / 1,150,000 LE |
| Speed Grade | R1 (highest Fmax) | R1 (same as this product) | N1 (lower Fmax, lower power) | N2 (lower Fmax) | R2 (slightly lower Fmax, lower power) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Transceiver Count / Rate | 24 ch / 14.4 Gbps | 24 ch / 14.4 Gbps | 24 ch / 14.4 Gbps | 24 ch / 14.4 Gbps | 24 ch / 14.4 Gbps |
| User I/O | 342 | 342 | 342 | 342 | 342 |
| Hard PCIe Gen3 IP | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Highest Fmax speed grade in the 10AX115 F40 FCBGA family (vs. 10AX115N1F40I1SG (N1 grade))
- Industrial temperature range for harsh-environment deployments (vs. 10AX115R1F40E1SG (E1 commercial grade))
- Same F40 FCBGA footprint across speed grades for power-only redesign (vs. 10AX115N3F40I2SG (N3 grade, I2 temp))
Designhinweise
The 1517-ball FCBGA package demands a high-density PCB stack-up with microvias (laser-drilled) for breakout. Use a 1-2-1 or 1-3-1 stack-up with at least 4-6 routing layers beneath the BGA. Escape routing for the 1.0 mm ball pitch requires HDI (High-Density Interconnect) processes; standard through-via PCBs cannot escape the inner balls. Plan for impedance-controlled 85-ohm differential pairs for transceiver channels and 50-ohm single-ended for GPIO.
Estimated: At full utilization (24 transceivers active, ~70% logic toggle rate, 1.15M LE), power dissipation can reach 25-35 W. The 1517-ball FCBGA has a junction-to-ambient thermal resistance theta_JA of approximately 8-12 C/W with a 4-layer JEDEC test board. To maintain industrial-grade junction temperature below 100C, attach a heatsink with thermal interface material and ensure airflow of at least 200 LFM across the device. Use Quartus Prime Early Power Estimator (EPE) for design-specific budgeting.
Transceiver channels at 14.4 Gbps require strict signal-integrity practices: matched-length differential pairs within 5 mil tolerance, AC-coupled interconnects (per the datasheet), reference plane continuity for every via transition, and isolation from noisy digital return paths. Use the Arria 10 GX Transceiver Toolkit in Quartus Prime to validate channel margins after PCB fab. Place decoupling connectors within 100 mil of every power pin, with a mix of bulk, mid-frequency, and high-frequency MLCCs.
Common pitfalls: (1) omitting SmartVID controller support - the device expects an external SmartVID regulator for dynamic voltage scaling; (2) ignoring MSEL pin strapping - wrong MSEL values cause configuration failure; (3) underestimating configuration time - 1.15M LE bitstreams approach 35-40 Mbit, requiring fast AS or FPP modes for sub-second boot; (4) forgetting JTAG chain integrity - check TCK pull-ups and TMS/TDI sequencing per IEEE 1149.1; (5) not validating transceiver reference clock jitter - use a low-jitter clock source meeting the datasheet mask.
Power-rail sequencing must follow the Arria 10 GX power-up guide: VCC, VCCP, VCCPT, VCCERAM, VCCBAT ramp in the documented order with monotonic edges. SmartVID rails (VCC, VCCPT) communicate with the external regulator over an I2C/SVID bus - pull-ups on the SVC/SVD pins must be sized per I2C standard. Decoupling must include 0603-size MLCCs immediately adjacent to every power pin plus bulk polymer/tantalum capacitors at board edges for transient current demand during transceiver PLLs locking.
Compliance-Informationen
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified (not an automotive-grade part). Halogen-free status not stated in verified web data - marked unknown.
