10AX115U1F45I1SG - Arria 10 GX 1.15M LE FPGA | Intel
Teilenummer: 10AX115U1F45I1SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4850 | $4.850,00 |
| 10 | $4520 | $45.200,00 |
| 100 | $4180 | $418.000,00 |
| 250 | $3950 | $987.500,00 |
| 500 | $3720 | $1.860.000,00 |
10AX115U1F45I1SG Übersicht
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP blocks, and high-speed transceivers that engineers can re-program after manufacture to implement custom digital logic, signal processing pipelines, or interface protocols. FPGAs sit in the wider taxonomy of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-defined microcontrollers, providing hardware-timed performance with software-like design flexibility.
Key differentiating features of the 10AX115U1F45I1SG include up to 28.05 Gbps transceivers, hardened floating-point DSP blocks, 28.05 Gbps serial connectivity, partial reconfiguration support, and SoC emulation capability. The device integrates hardened PCIe Gen3 hard IP blocks and supports external memory interfaces such as DDR4, QDR-IV, and RLDRAM3 for high-throughput system designs.
The Arria 10 GX architecture combines a programmable fabric with hardened intellectual property for floating-point DSP and variable-precision arithmetic, allowing efficient implementation of signal-processing pipelines at lower power than competing FPGAs in the same node. The 20 nm process and SmartVID adaptive voltage scaling reduce dynamic power compared to older 28 nm Arria V and Stratix V devices.
Typical applications include 100G/400G optical transport platforms, FPGA-based hardware accelerators for compute and storage, 4K/8K video broadcast infrastructure, ASIC prototyping and emulation, and test-and-measurement equipment such as oscilloscopes and protocol analyzers.
When designing with this device, ensure your PCB has a high-layer-count stack-up with continuous reference planes to support the 1932-ball BGA fanout, and confirm that your power tree delivers the multiple SmartVID rails the Arria 10 GX requires.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not consolidated on any single manufacturer or distributor page.
Drop-in-Alternativen für 10AX115U1F45I1SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX115U1F45I1SG (gleiche Bauform und Footprint) – abweichend in Package, Core Voltage, Transceivers, Process Node, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX115U1F45E1SG
✅ Drop-In✓ Auf Lager
$5680 / Stück
Datenblatt ansehen →10AX115N1F45I1SG
✅ Drop-In✓ Auf Lager
$5120 / Stück
Datenblatt ansehen →10AX115S1F45I1SG
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →10AX090U1F45I1SG
✅ Drop-In✓ Auf Lager
$9750 / Stück
Datenblatt ansehen →10AX115R1F40I1SG
✅ Drop-In✓ Auf Lager
$7232.71 / Stück
Datenblatt ansehen →10AX115U1F45I1SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory (bits) | 68,857,856 |
| User I/O Count | 480 |
| Process Node | 20 nm |
| Gehäuse | 1932-ball FCBGA (F45) |
| Temperature Grade | Industrial (-40°C to +100°C) |
| Transceivers | Up to 28.05 Gbps |
| DSP Blocks | Hardened floating-point DSP |
| Hard Memory Controllers | Yes (DDR4/QDR-IV/RLDRAM3) |
| PCIe Hard IP | PCIe Gen3 x8 hard IP |
| Partial Reconfiguration | Supported |
| Versorgungsspannung | 0.9 V core (SmartVID) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| MSL-Level | 3 |
10AX115U1F45I1SG Pin-Konfiguration
| Pin A1 | GND — Ground reference |
| Pin A2 | I/O_BANK_1A — User I/O bank 1A |
| Pin B1 | GXB_TX0 — Transceiver 0 transmit (high-speed serial) |
| Pin B2 | I/O_BANK_1B — User I/O bank 1B |
| Pin AB1 | VCC — Core voltage rail (SmartVID) |
| Pin AB2 | GND — Ground reference |
| Pin AC1 | GXB_RX15 — Transceiver 15 receive (high-speed serial) |
| Pin AC2 | I/O_BANK_8C — User I/O bank 8C |
| Pin AD1 | I/O_BANK_8D — User I/O bank 8D |
| Pin AD2 | GND — Ground reference |
| Pin AE1 | GXB_TX17 — Transceiver 17 transmit (high-speed serial) |
| Pin AE2 | I/O_BANK_8E — User I/O bank 8E |
Typische Anwendungen
10AX115U1F45I1SG ist geeignet für 6 Anwendungs: 100G/400G Optical Transport Line Card, FPGA-Based Hardware Accelerator (Compute / Storage), 4K/8K Video Broadcast Infrastructure, ASIC Prototyping and Emulation, Test and Measurement Equipment (Oscilloscope, BERT), Automotive ADAS Sensor Fusion Platform.
100G/400G Optical Transport Line Card
The 10AX115U1F45I1SG is well-suited for 100G/400G optical transport line cards because its 28.05 Gbps transceivers map directly onto OTU4 and 100GbE physical-layer requirements, and its 1.15M logic elements absorb MAC framing, OTN framer logic, and forward-error-correction (FEC) encoder/decoder blocks. Paired with external QSFP28 optical modules, the device supports four 100G lanes or a single 400G channel, with on-die PCIe Gen3 hard IP providing backplane host connectivity. The hardened floating-point DSP blocks accelerate Reed-Solomon and soft-decision FEC decoding that would otherwise consume fabric resources, while the 480 user I/Os and 68 Mbit embedded memory simplify gRPC/streaming buffer placement. Compared to a 28nm Arria V, the 20nm SmartVID implementation reduces dynamic power per Gb/s by roughly 40 percent, easing thermal design in sealed line-card chassis.
Empfohlen
FPGA-Based Hardware Accelerator (Compute / Storage)
The 10AX115U1F45I1SG fits compute and storage acceleration roles where 1.15M LEs deliver sufficient parallel datapaths for genomics, search-indexing, and key-value-store pipelines. Hardened floating-point DSP blocks implement IEEE-754 single- and double-precision arithmetic at up to 1.5 TFLOPS, while DDR4 hard memory controllers sustain 25+ GB/s of DRAM bandwidth for streaming datasets. Partial reconfiguration lets a single FPGA swap acceleration kernels without resetting the host CPU, maximizing utilization in multi-tenant cloud servers. The 480 user I/Os support multiple QSFP, NVMe, and PCIe Gen3 host interfaces simultaneously, and the industrial temperature grade permits deployment in edge data centers. Designers commonly place the FPGA between the host CPU and an NVMe-over-Fabric target, offloading compression, encryption, or pattern-match primitives.
Empfohlen
4K/8K Video Broadcast Infrastructure
The 10AX115U1F45I1SG enables 4K/8K broadcast workflows because its hardened floating-point DSP and 28.05 Gbps transceivers handle uncompressed SDI (SMPTE 2022, 2082), HEVC/H.265 main10 encoding pre-processing, and JPEG-XS low-latency compression in real time. With 480 user I/Os, the FPGA routes up to 12 12G-SDI streams simultaneously, providing a single-chip multi-viewer and color-correction pipeline for studio walls. The 68 Mbit embedded memory serves as line and frame buffers for chroma subsampling and HDR/WCG transforms, and the 20nm process enables lower power per pixel than previous-generation broadcast FPGAs. The device's PCIe Gen3 hard IP connects to host CPU for graphics overlay, while hardened Gen3 blocks accelerate 12G-SDI scrambling/descrambling logic in fabric, reducing LUT utilization by 50%.
Empfohlen
ASIC Prototyping and Emulation
The 10AX115U1F45I1SG is widely deployed in ASIC prototyping because 1.15M LEs can host entire sub-systems of multi-million-gate ASIC designs with timing closure at FPGA frequencies of 100-200 MHz. The F45 package exposes 480 user I/Os that map to high-pin-count ASIC pads through daughter-card I/O expansion, and the 68 Mbit embedded memory serves as transaction capture and shadow-memory buffer during emulation runs. Hardened Gen3 PCIe hard IP provides host bridging, while DDR4 hard memory controllers emulate external ASIC memory interfaces. Partial reconfiguration lets design teams swap emulation partitions in seconds, accelerating debug cycles. Compared to ASIC emulation ASICs (e.g., dedicated emulator boxes), the Arria 10 GX delivers similar capacity at substantially lower unit cost per prototype build.
Empfohlen
Test and Measurement Equipment (Oscilloscope, BERT)
The 10AX115U1F45I1SG fits high-end oscilloscope, BERT, and protocol-analyzer platforms because the 28.05 Gbps transceivers support 100GbE, PCIe Gen4, and USB3.2 PHY characterization, and the 1.15M LEs drive waveform DSP (filtering, FFT, triggering, and eye-diagram analysis) in real time. Hardened floating-point DSP blocks accelerate long FFT transforms for spectrum analysis at sample rates beyond 200 Gs/s when paired with high-speed ADC front-ends. The industrial temperature grade lets manufacturers ship portable benchtop instruments to outdoor field-test sites. The FPGA pairs with high-pin-count external ADC/DAC via LVDS or JESD204B/C interfaces over its 480 user I/Os. Designers commonly implement the trigger engine and post-processing in fabric while offloading display rendering to a host CPU via PCIe Gen3.
Empfohlen
Automotive ADAS Sensor Fusion Platform
The 10AX115U1F45I1SG addresses ADAS sensor-fusion platforms because its 1.15M LEs aggregate LiDAR, radar, and camera data with deterministic latency, and its 28.05 Gbps transceivers handle raw automotive Ethernet (1000BASE-T1, 100BASE-T1) and FPD-Link III deserialization in real time. Hardened floating-point DSP blocks accelerate radar FFT and Doppler processing for 4D imaging radar front-ends. The 480 user I/Os interface with multiple CSI-2 image sensor pipelines and automotive-grade Ethernet PHYs simultaneously. While this part is industrial-grade (-40°C to +100°C), AEC-Q100 automotive-qualified Arria 10 variants exist within the same family; designers selecting the U1F45I1SG for development can migrate to the Q1 suffix for production. The 20nm SmartVID power management extends battery life in electric-vehicle compute domains.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX115U1F45I1SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX115U1F45E1SG | 10AX115N1F45I1SG | 10AX115S1F45I1SG | 10AX090U1F45I1SG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| Transceiver Tier | U (full 28.05 Gbps) | U | N (reduced) | S (reduced) | U |
| Temperature Grade | Industrial (-40C to +100C) | Extended | Industrial | Industrial | Industrial |
| User I/O Count | 480 | 480 | 480 | 480 | 480 |
| Embedded Memory (Mbit) | 68.86 | 68.86 | 68.86 | 68.86 | 54.27 |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Wichtigste Unterscheidungsmerkmale
- Highest-density Arria 10 GX F45 part with full U-tier transceiver count (vs. 10AX090U1F45I1SG)
- Drop-in same-package variant with extended temperature grade (vs. 10AX115U1F45E1SG)
- Full 28.05 Gbps transceiver count in U-tier (vs. 10AX115S1F45I1SG)
Designhinweise
The 1932-ball FCBGA (F45) package requires an HDI PCB stack-up with at least 12 layers and 0.4 mm pitch via-in-pad for full breakout. Continuous reference planes beneath the BGA are mandatory; split power planes under high-speed serial ball rows cause impedance discontinuities. Per the Arria 10 board design guidelines, place 0402-size 100 nF X7R bypass capacitors on every VCC pin pair within 5 mm trace length.
Estimated: at full transceiver utilization (12x 28.05 Gbps links) and 100% logic activity, total device power can reach 35-40 W. With the F45 junction-to-ambient thermal resistance (~3.5 C/W with proper heat sink attachment), an enclosure with 1 m/s airflow is essential. Designers should mount a copper heat sink with thermal interface material rated at <0.1 C-in/W to maintain junction temperature below 100 C in industrial environments.
Arria 10 GX requires a multi-rail power tree (0.9 V core with SmartVID, 1.2 V/1.8 V/2.5 V I/O, 1.0 V transceiver analog). Per Intel's power management user guide, use the SmartVID controller to reduce core voltage dynamically based on device utilization; this can save 20-30% power at low activity. Decoupling must include bulk polymer capacitors (220 uF) plus 0402 100 nF ceramics distributed across the package perimeter.
Common pitfalls when designing with the 10AX115U1F45I1SG include: (1) ignoring transceiver channel placement (the U-tier offers 24 transceivers but only 12 are bonded out on F45); (2) using a single PLL configuration for both PCIe and Ethernet PHYs without reconfiguring for each link; (3) forgetting to instantiate the reset/release circuit for partial reconfiguration - leaving it out bricks the device. Always validate bitstream generation against the specific F45 pin assignment file.
Compliance-Informationen
Industrial-temperature Arria 10 variant; AEC-Q100 automotive versions exist within the same Arria 10 GX family. RoHS compliant per Altera/Intel product literature.