10CL010ZU256I8G - Cyclone 10 LP FPGA 10K LE 256-UBGA | Intel
Teilenummer: 10CL010ZU256I8G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.75 | $2.875,00 |
| 500 | $24.9 | $12.450,00 |
| 1.000 | $22.1 | $22.100,00 |
10CL010ZU256I8G Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as multipliers, memory blocks, and SERDES. Within the broader programmable logic taxonomy, the Cyclone 10 LP family sits below high-performance Stratix and mid-range Arria devices, targeting cost- and power-sensitive applications that still need parallel DSP, custom I/O bridging, and in-system reconfigurability. The "10 LP" suffix indicates the low-power variant of Intel's Cyclone 10 generation, optimized for static and dynamic power efficiency.
Key features include 10,320 logic elements, 56 (18x18) hardware multipliers for DSP, 423 Kbits of embedded RAM, 176 maximum user I/Os, and integrated phase-locked loops (PLLs). The device supports LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards, and is fabricated on a low-power 60 nm process. The 256-ball UFBGA package provides high-density board integration for industrial applications.
Typical applications include industrial motor control and factory automation, video processing and display bridging, low-cost ASIC prototyping, I/O expansion and protocol bridging (UART/SPI/I2C to parallel), and portable or battery-powered embedded systems. The low static power suits energy-constrained designs such as handheld test equipment and IoT edge nodes.
Design considerations: PCB layout must follow Intel's decoupling and routing guidelines for BGA packages, with matched-length traces for LVDS pairs and proper thermal vias under the package. The device requires a configuration memory (typically EPCQ or a similar quad-SPI flash) and a clock source for the PLLs. Quartus Prime (Lite or Standard edition) is the supported design toolchain.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers select and source the part quickly.
Drop-in-Alternativen für 10CL010ZU256I8G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10CL010ZU256I8G (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Embedded Memory Bits, Logic Elements (LE), Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10CL010YU256I8G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10CL010YU256I7G
✅ Drop-In✓ Auf Lager
$27.18 / Stück
Datenblatt ansehen →10CL006ZU256I8G
✅ Drop-In✓ Auf Lager
$7.83 / Stück
Datenblatt ansehen →10CL010ZU256I8G Grenzwerte & elektrische Eigenschaften
| Family | Cyclone 10 LP |
| Logic Elements | 10,320 |
| Embedded Memory Bits | 423,936 |
| Maximum User I/Os | 176 |
| DSP Blocks (18x18 Multipliers) | 56 |
| PLLs | 4 |
| Global Clocks | 20 |
| Gehäuse | 256-ball UFBGA (UBGA) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | 8 |
| Process Technology | Low-power 60 nm |
| Configuration | Serial/Parallel via EPCQ or compatible flash |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| MSL-Level | 3 (168 hours) |
| Supply Voltage (Core) | 1.0 V to 1.1 V (typical 1.05 V) |
| Supply Voltage (I/O) | 1.2 V to 3.3 V (bank-dependent) |
10CL010ZU256I8G 256-ball ufbga (ubga) Pinbelegungsleitfaden
Pinbelegung für 10CL010ZU256I8G (256-ball ufbga (ubga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10CL010ZU256I8G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10CL010ZU256I8G ist geeignet für 6 Anwendungs: Industrial Motor Control and Factory Automation, Video Processing and Display Bridging, ASIC Prototyping and Design Validation, I/O Expansion and Protocol Bridging, Portable and Battery-Powered Embedded Systems, IoT Edge Nodes and Smart Sensors.
Industrial Motor Control and Factory Automation
The 10CL010ZU256I8G is well-suited to industrial motor control and PLC-style factory automation designs because it delivers 10,320 logic elements with 56 hardware 18x18 multipliers, 176 user I/Os, and industrial-grade -40C to +100C operation in a 256-ball UFBGA package. Designers typically place the device between encoder inputs and the power-stage gate driver, using the multipliers for closed-loop vector control math and the embedded RAM for state-machine buffering. The low static power (around 25-50 mW typical in Cyclone 10 LP) simplifies thermal design in sealed enclosures, and the LVDS-capable I/O banks directly interface to industrial encoders without external translation.
Empfohlen
Video Processing and Display Bridging
For video format conversion and panel bridging, the 10CL010ZU256I8G offers 423 Kbits of embedded RAM (enough for one or two line buffers), 56 DSP blocks (sufficient for chroma interpolation and scaling), and true-LVDS I/O for direct panel connection. A typical design uses the FPGA to convert DVI/HDMI input into LVDS panel output, with the PLL generating pixel clocks from 25 MHz to 148.5 MHz. The 176 user I/Os cover full RGB888 plus control signals, and the low-power 60 nm process keeps the device cool without a heatsink in small-form-factor displays.
Empfohlen
ASIC Prototyping and Design Validation
Engineers prototyping mid-density ASIC designs often use the 10CL010ZU256I8G as a low-cost, low-power functional validation platform. With 10,320 LEs and 56 DSP blocks, the device comfortably fits RTL blocks up to roughly 30K equivalent ASIC gates plus bounded verification IP. Quartus Prime's incremental compile flow lets designers iterate on individual modules without full re-synthesis, and the industrial temperature grade supports lab bring-up in uncontrolled thermal environments. Migration to ASIC is straightforward because Cyclone 10 LP synthesis maps predictably to standard-cell libraries.
Empfohlen
I/O Expansion and Protocol Bridging
A common use for the 10CL010ZU256I8G is bridging legacy microcontrollers to modern high-speed buses - for example, expanding a host MCU's UART/I2C/SPI into a parallel bus, USB 2.0, or RGMII Ethernet interface. The 176 user I/Os accommodate both the slow-speed legacy side and the fast serial side, and the dedicated PLL provides the precise clocking needed for RGMII (125 MHz) or USB (48 MHz). Drop-in compatibility with the 10CL006ZU256I8G lets designers ship cost-reduced variants when bridging logic fits in 6K LEs.
Empfohlen
Portable and Battery-Powered Embedded Systems
Low static power is the defining characteristic that makes the 10CL010ZU256I8G appropriate for handheld test equipment, portable medical peripherals, and battery-powered industrial sensors. Cyclone 10 LP typical static power is in the 25-50 mW range - an order of magnitude lower than mid-range FPGAs - so the device can run continuously from a small lithium cell. Designers commonly use the FPGA to consolidate discrete glue logic, perform sensor pre-processing with the 56 DSP blocks, and wake the host processor only on threshold crossings.
Empfohlen
IoT Edge Nodes and Smart Sensors
For IoT edge aggregation, the 10CL010ZU256I8G provides enough logic to perform sensor fusion across multiple I2C/SPI sensors, run a lightweight MAC or protocol stack, and drive a low-power wireless modem. The 176 user I/Os handle 4-8 sensor buses plus a parallel RGB or MIPI bridge to a small local display, while the DSP blocks accelerate FIR filtering of accelerometer or microphone data. The Cyclone 10 LP low-power profile matches the duty-cycled sleep pattern typical of battery-powered edge nodes, and Intel's long-term product longevity commitment supports 10+ year industrial deployments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10CL010ZU256I8G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10CL010YU256I8G | 10CL010YU256I7G | 10CL006ZU256I8G |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 256-ball UFBGA (UBGA) | 256-ball UFBGA (UBGA) - same | 256-ball UFBGA (UBGA) - same | 256-ball UFBGA (UBGA) - same |
| Logic Elements | 10,320 | 10,320 (identical) | 10,320 (identical) | 6,272 (-39%) |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 270,336 bits |
| Maximum User I/Os | 176 | 176 | 176 | 176 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +125C) | Industrial (-40C to +100C) |
| DSP Blocks (18x18) | 56 | 56 | 56 | 36 |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible across Cyclone 10 LP family density variants (vs. 10CL006ZU256I8G)
- Industrial temperature grade with extended operating range (vs. 10CL010YU256C8G)
- Lowest static power in Cyclone 10 LP family (vs. Cyclone 10 GX (10CX series))
Designhinweise
The 256-ball UFBGA requires 0.8 mm pitch fan-out with at least 4 routing layers. Use Intel's Cyclone 10 LP pin connection guidelines for proper power-pin and GND-ball placement. Place decoupling capacitors (0.1 uF + 10 uF) within 100 mils of each VCCIO/VCC ball, and stitch the GND plane with vias on every other GND ball for thermal dissipation. BGA escape routing must use 4 mil traces with 4 mil spaces for reliable fabrication.
Estimate: Cyclone 10 LP static current is typically 25-50 mW at 1.05 V core, plus per-bank VCCIO current proportional to switching I/O. For a 176-IO design switching LVCMOS 3.3 V at 50 MHz, total power is typically 200-500 mW. Use a switching regulator with a 1.0 V LDO post-regulation stage for the core supply to optimize efficiency and noise. Decoupling bulk capacitance (47 uF) is required near the device to handle simultaneous switching output (SSO) transients.
Do not leave unused I/O banks floating; tie unused I/Os to a defined logic level via Quartus Pin Planner to prevent configuration failure. The CONF_DONE, nSTATUS, and nCONFIG pins must be pulled up to VCCIO of the configuration bank per Intel's guidelines. Configuration failures often trace to missing pull-ups on MSEL[3..0] selection pins - these must be hard-wired to match the chosen configuration mode (AS, PS, JTAG, or FPP).
Compliance-Informationen
RoHS and REACH compliant per Intel product page. Not AEC-Q100 qualified - choose automotive-qualified Cyclone 10 LP variants for automotive deployments.
