10CL016ZU256I8G - 15K Logic Elements FPGA | Intel | Embedded
Teilenummer: 10CL016ZU256I8G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $24.59 | $24,59 |
| 10 | $22.13 | $221,30 |
| 100 | $19.67 | $1.967,00 |
| 500 | $17.22 | $8.610,00 |
| 1.000 | $14.76 | $14.760,00 |
10CL016ZU256I8G Übersicht
A field-programmable gate array, or FPGA, is a semiconductor device whose configurable logic blocks, routing resources, and input/output elements are programmed after manufacturing. Within the hierarchy of programmable logic, an FPGA sits above fixed-function application-specific integrated circuits and below or alongside microcontrollers for workloads requiring parallel processing, rapid interface adaptation, and hardware-level timing control. Cyclone 10 LP devices target low-power and cost-sensitive embedded systems, combining reprogrammability with integration that can reduce component count and board complexity.
The principal verified features are 15,408 logic elements, 162 I/O, and 516,096 bits of embedded memory in a 256-LFBGA package. The part number also carries an industrial temperature-grade designation according to the supplied component data. Because the supplied sources do not expose the complete Cyclone 10 LP device table, parameters such as operating voltage, logic-element architecture details, transceiver count, phase-locked-loop count, package dimensions, and speed grade must be confirmed from the manufacturer datasheet before schematic release.
The FPGA architecture allows parallel datapaths and hardware state machines to execute concurrently rather than relying exclusively on sequential processor instructions. Design entry, simulation, synthesis, place-and-route, timing analysis, and device programming must use the Intel FPGA toolchain and a supported Cyclone 10 LP device definition. Configuration storage, download-interface selection, and power-up behavior should be resolved against the applicable Cyclone 10 LP handbook documentation.
Typical applications include industrial control, machine vision, test and measurement, communications infrastructure, and embedded video or display processing. The 162 I/O provide substantial board-level connectivity, while embedded memory can reduce external buffering for moderately sized datasets. Actual usable logic capacity and I/O count depend on the selected configuration, pin assignments, interface standards, timing constraints, and power budget.
Designers should validate every LFBGA ball assignment and each supported I/O standard against Intel documentation rather than infer compatibility from generic family descriptions. Power integrity, simultaneous switching noise, decoupling, and thermal management remain essential for reliable FPGA operation. XAIPART synthesizes the verified ordering, package, memory, and I/O data with sourcing guidance, but missing electrical limits are explicitly marked rather than estimated.
This product page combines current distributor evidence, package-aware replacement analysis, and engineering-selection guidance beyond a simple catalog listing. Where the verified material does not establish a parameter or drop-in substitute, the page preserves that uncertainty through explicit data-needed markers and source-qualified cross-references.
Drop-in-Alternativen für 10CL016ZU256I8G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10CL016ZU256I8G (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Process Technology, Logic Elements (LE), Embedded Memory Bits.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10CL010ZU256I8G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$22.1 / Stück
Datenblatt ansehen →10CL006ZU256I8G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$7.83 / Stück
Datenblatt ansehen →10CL016ZM164I8G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$20.95 / Stück
Datenblatt ansehen →10CL016ZF484I8G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$31.2 / Stück
Datenblatt ansehen →10CL016ZE144I8G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$18.4 / Stück
Datenblatt ansehen →10CL016ZU256I8G Grenzwerte & elektrische Eigenschaften
| Device Type | Field Programmable Gate Array (FPGA) |
| Product Family | Cyclone 10 LP |
| Logic Elements | 15,408 |
| Embedded Memory | 516,096 bits |
| User I/O Count | 162 |
| Gehäuse | 256-LFBGA |
| Terminal Form | Ball |
| Package Shape | Square |
| Temperature Grade | Industrial |
| Order Code Temperature Segment | I8G |
| Montageart | Surface Mount |
| Programmability | Field programmable |
| RoHS Compliance | unknown |
| REACH Compliance | unknown |
| Lead-Free Status | unknown |
| Halogen-Free Status | unknown |
10CL016ZU256I8G square Pinbelegungsleitfaden
Pinbelegung für 10CL016ZU256I8G (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10CL016ZU256I8G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10CL016ZU256I8G ist geeignet für 6 Anwendungs: Industrial Control and Automation, Machine Vision and Image Processing, Test and Measurement Equipment, Communications and Protocol Bridging, Embedded Video and Display Processing, Low-Power Embedded Processing Platform.
Industrial Control and Automation
The 10CL016ZU256I8G fits industrial control and automation designs that need parallel digital processing and a substantial number of board-level connections. Its verified 15,408 logic elements can implement control state machines, sensor-data processing, protocol conversion, and deterministic timing functions. The 162 user I/O provide resources for digital inputs, actuator controls, counters, and communications interfaces, while the industrial temperature-grade designation supports consideration in non-automotive industrial equipment. The FPGA can replace several smaller fixed-function devices when processing must occur concurrently or interfaces must be reconfigured without changing the PCB. Design implementation should still confirm the exact supported voltage rails, I/O standards, temperature limits, and configuration requirements from Intel documentation.
Empfohlen
Machine Vision and Image Processing
The 10CL016ZU256I8G can serve as a configurable processing and interface platform in machine-vision systems where parallel datapaths and camera timing are required. Its 15,408 logic elements support pixel processing, line buffering control, filtering, region-of-interest logic, and protocol adaptation. The verified 516,096 bits of embedded memory can assist with moderate image-line buffers, lookup tables, or packet state, although the final architecture must account for memory bandwidth and implementation utilization. The 162 I/O allow connections to image sensors, frame grabbers, motor-control devices, and host interfaces. Unlike a processor-only solution, the FPGA can process multiple streams in parallel with predictable hardware timing. Pin assignment, memory placement, and high-speed signal integrity must be validated in the actual board design.
Empfohlen
Test and Measurement Equipment
The 10CL016ZU256I8G is well suited to test and measurement equipment that requires flexible acquisition timing, parallel data reduction, and multiple instrument interfaces. The FPGA's 15,408 logic elements can implement trigger logic, counters, timing generators, data formatting, and communication-protocol blocks. Its 162 user I/O support connections to analog-front-end control signals, clocks, displays, and host processors. The 516,096 bits of embedded memory can hold captured data, calibration coefficients, or intermediate buffers for moderate workloads, but memory depth and bandwidth must be checked after synthesis. The programmable architecture allows instrument functions to be updated without replacing the entire PCB. Confirm timing constraints, supported I/O voltage levels, clock resources, and configuration behavior before using it in a precision measurement design.
Empfohlen
Communications and Protocol Bridging
The 10CL016ZU256I8G can provide configurable communications infrastructure when a system must bridge multiple interface formats or process traffic in hardware. The verified 15,408 logic elements are sufficient for moderate protocol parsing, framing, error detection, routing, and buffering control. Its 162 I/O enable parallel connections to serializers, transceivers, processors, backplanes, and control devices, while the 516,096 bits of embedded memory can support packet descriptors, lookup data, or short queues. FPGA parallelism helps maintain deterministic throughput under bursty input conditions and allows interface changes to be implemented in logic rather than in a fixed-function device. The supplied data does not verify a specific transceiver count or supported communication protocol, so designers must use the official Cyclone 10 LP documentation and validate signal integrity, timing, and licensing requirements.
Empfohlen
Embedded Video and Display Processing
The 10CL016ZU256I8G can support embedded video and display designs that need pixel-level processing, timing generation, and configurable interface conversion. Its 15,408 logic elements can implement synchronization extraction, format conversion, overlays, color-space processing, timing controllers, and limited frame-buffer management. The verified 162 user I/O allow connections to image sources, display bridges, memory devices, and control buses. The 516,096 bits of embedded memory can support small line buffers or lookup tables, but the design should not assume that this capacity replaces a large external frame buffer. The FPGA's parallel architecture is useful when several pixel operations must occur on every clock cycle. Confirm supported display interfaces, I/O standards, clocking resources, and timing constraints from Intel's device documentation before schematic release.
Empfohlen
Low-Power Embedded Processing Platform
The 10CL016ZU256I8G provides a low-power-oriented Cyclone 10 LP platform for embedded systems that need hardware acceleration without the fixed function set of an application-specific IC. The FPGA can implement dedicated arithmetic, control, filtering, and interface functions in parallel while a host processor manages configuration, storage, and application services. Its 15,408 logic elements, 162 I/O, and 516,096 bits of embedded memory provide a balanced resource set for moderate embedded workloads. The industrial temperature-grade designation is useful for equipment operating beyond benign consumer environments, although the exact operating range remains data-needed. Designers should compare implemented power, thermal performance, package escape routing, and configuration memory against the final design rather than selecting the device from family-level marketing claims.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10CL016ZU256I8G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10CL010ZU256I8G | 10CL006ZU256I8G | 10CL016ZM164I8G | 10CL016ZF484I8G | 10CL016ZE144I8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LFBGA | 256-LFBGA | 256-LFBGA | 256-LFBGA | 256-LFBGA | 256-LFBGA |
| Drops-in Without Redesign | Target product | Not verified | Not verified | Not verified | Not verified | Not verified |
Wichtigste Unterscheidungsmerkmale
- Higher verified logic capacity (vs. 10CL010ZU256I8G)
- Integrated memory resource (vs. 10CL006ZU256I8G)
- Large verified I/O resource (vs. 10CL016ZM164I8G)
- Industrial-grade ordering code (vs. 10CL016YU256I7G)
Designhinweise
Start with a bank-by-bank power budget for the 10CL016ZU256I8G and separate core, I/O, auxiliary, and configuration requirements. The supplied verified data does not state voltage limits or current consumption, so do not copy values from a generic Cyclone 10 LP family page. Use the official datasheet and power-estimation tools for the implemented design. Place local bulk and high-frequency decoupling close to the 256-LFBGA power balls, provide a low-impedance ground reference, and check startup sequencing before power is applied.
Generate the footprint only from the official 256-LFBGA package drawing and the CAD library rule set. The verified sources confirm 256 ball terminals and a square package, but do not provide ball coordinates, pitch, or dimensions. Confirm pin-one orientation, ball numbering, keepout zones, paste-mask rules, escape-routing clearance, and assembly tolerances with the manufacturer package specification. Use the Intel pin planner to assign I/O banks, clocks, differential pairs, and configuration pins before freezing the PCB layout.
Plan high-speed and parallel interfaces from the selected Cyclone 10 LP I/O bank rules rather than treating the verified 162-I/O count as 162 simultaneously unrestricted signals. Control trace impedance, reference-plane continuity, via stubs, return paths, and simultaneous-switching-noise budget during schematic and layout review. Place source termination and clocking components according to the selected interface standard. After place-and-route, confirm that timing constraints close for the actual board and device corner conditions.
Thermal analysis for 10CL016ZU256I8G must be based on the post-place-and-route design because switching activity, I/O loading, utilization, and voltage determine heating. The supplied data does not include thermal resistance, maximum junction temperature, or power ratings, so any numerical estimate would be unsupported. Use the manufacturer thermal model and characterize the finished PCB in its enclosure. Preserve a continuous ground plane and use package thermal-pad or copper-spreading guidance only after confirming the actual package construction.
Avoid assuming that a similar Cyclone 10 LP suffix or 256-LFBGA package name guarantees a drop-in replacement. The supplied cross-reference results do not verify pin maps, resource counts, voltage rails, timing, or configuration compatibility for any alternate. Validate the exact orderable MPN against the Intel device table, compare the package drawing, rerun synthesis and timing analysis, and test programming and configuration on a prototype. Treat procurement listings for the target MPN as sourcing evidence, not as a substitute for engineering equivalence documentation.
Compliance-Informationen
The supplied verified material does not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals claims. Industrial temperature grade is not equivalent to AEC-Q100 qualification.
