10CL016YU484I7G - Cyclone 10 LP FPGA 15K LE U484 BGA | Intel
Teilenummer: 10CL016YU484I7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $88.42 | $88,42 |
| 10 | $79.58 | $795,80 |
| 100 | $70.74 | $7.074,00 |
| 500 | $61.9 | $30.950,00 |
| 1.000 | $55.27 | $55.270,00 |
10CL016YU484I7G Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks (memory, multipliers, PLLs, transceivers) that can be reconfigured by the customer after manufacture. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs) in the design hierarchy, offering hardware-level parallelism for signal processing, glue logic, and protocol bridging without the NRE cost of an ASIC.
Key features include up to 340 user I/O pins, 56 hardware 18x18 multipliers for DSP operations, 4 fractional PLLs for clock management, and a low-power core architecture suitable for battery-powered and thermally constrained designs. The device supports configuration via JTAG, Active Serial, and Active Parallel modes, and is compatible with Intel Quartus Prime design software.
The Cyclone 10 LP family is fabricated on a low-power process and delivers significantly lower static power than the prior-generation Cyclone IV family while maintaining pin-to-pin compatibility with selected Cyclone IV packages, simplifying power-sensitive redesigns.
Typical applications include industrial motor control, video processing and display bridging, industrial Ethernet and fieldbus interfaces, low-cost ASIC prototyping, and portable test and measurement equipment where low static power and moderate logic density are required.
When designing with this device, engineers should select the appropriate speed/temperature grade for the end environment (I7 = industrial, speed grade 7) and ensure PCB thermal management supports the BGA package within the recommended junction temperature envelope.
This page synthesizes distributor pricing, drop-in same-family alternatives from the XAIPART catalog, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für 10CL016YU484I7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10CL016YU484I7G (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Process Technology, Core Voltage, Logic Elements (LE).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10CL016YU484C8G
✅ Drop-In✓ Auf Lager
$60.8 / Stück
Datenblatt ansehen →10CL016YU484C6G
✅ Drop-In✓ Auf Lager
$47.9 / Stück
Datenblatt ansehen →10CL016YU484A7G
✅ Drop-In✓ Auf Lager
$43.88 / Stück
Datenblatt ansehen →10CL016YU484I7G
✅ Drop-In✓ Auf Lager
$55.27 / Stück
Datenblatt ansehen →10CL016YU484I7G Grenzwerte & elektrische Eigenschaften
| Family | Cyclone 10 LP |
| Logic Elements | 15,408 |
| Embedded Memory | 516,096 bits |
| Embedded 18x18 Multipliers | 56 |
| Maximum User I/O | 340 |
| PLLs | 4 (fractional) |
| Gehäuse | 484-ball UBGA (U484) |
| Package Code | U484 |
| Speed Grade | 7 |
| Temperature Grade | Industrial (-40C to +100C junction) |
| Process Technology | Low-power CMOS |
| Configuration Modes | JTAG, Active Serial, Active Parallel |
| Design Software | Intel Quartus Prime |
| RoHS-Status | Compliant |
| Montageart | Surface Mount (BGA) |
10CL016YU484I7G u484 Pinbelegungsleitfaden
Pinbelegung für 10CL016YU484I7G (u484-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10CL016YU484I7G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10CL016YU484I7G ist geeignet für 6 Anwendungs: Industrial Motor Control, Video Bridging and Display Aggregation, Industrial Ethernet and Fieldbus Gateways, Low-Cost ASIC Prototyping, Portable Test and Measurement, IoT Edge Sensor Aggregation.
Industrial Motor Control
The 10CL016YU484I7G suits industrial motor drives because its 15,408 logic elements and 56 18x18 multipliers implement field-oriented control (FOC), space-vector PWM, and encoder interfaces in a single chip. The 4 fractional PLLs generate precise PWM carrier frequencies and resolver excitation clocks, while 340 user I/Os handle Hall sensors, QEP decoders, and gate-driver feedback. Industrial temperature grade (-40C to +100C junction) supports factory-floor deployment without additional thermal screening, and the U484 BGA exposes sufficient LVDS pairs for high-speed current-sense ADCs. Designers typically pair this FPGA with a TI C2000 MCU for safety hand-off and use Quartus Prime Qsys to integrate motor IP.
Empfohlen
Video Bridging and Display Aggregation
The 10CL016YU484I7G aggregates multiple video streams in industrial HMI and digital signage because its 340 user I/Os accept parallel RGB, LVDS, and OpenLDI inputs simultaneously. The 56 embedded 18x18 multipliers accelerate chroma resampling, scaling, and alpha blending at 1080p60 with headroom. Embedded M10K memory blocks (516 Kbits total) buffer scan-line data without external SRAM. The U484 BGA footprint provides ample LVDS channels for dual-link DSI/HDMI bridges. Quartus Prime Video and Image Processing Suite IPs (VIP, scaler, mixer) shorten development time for medical imaging and kiosk displays.
Empfohlen
Industrial Ethernet and Fieldbus Gateways
The 10CL016YU484I7G implements real-time industrial Ethernet protocols (EtherCAT, PROFINET, EtherNet/IP) because the 56 hardware multipliers and 340 I/Os handle MAC, PHY management, and synchronization jitter below 1 microsecond. The 4 fractional PLLs derive 125 MHz PHY reference clocks and timestamp counters from a single TCXO. Embedded memory buffers PDU fragments before forwarding to a host controller. The industrial temperature grade ensures operation in cabinet environments, and the BGA package supports the LVDS pairs required for MII/RGMII to multi-port PHYs. Designers pair the FPGA with a Micrel KSZ9031 gigabit PHY for line-rate bridging.
Empfohlen
Low-Cost ASIC Prototyping
The 10CL016YU484I7G provides a sweet-spot prototyping platform for ASICs in the 10K-30K gate-equivalent range because its 15,408 logic elements, 516 Kbits of block RAM, and 56 DSP multipliers are large enough to host representative ASIC subsystems while staying below $90 in unit cost. The U484 BGA exposes enough I/Os to replicate most ASIC pad rings. Quartus Prime TimeQuest timing analysis correlates closely with ASIC sign-off tools, and the same RTL can be migrated to a Cyclone V SoC or Cyclone IV GX for incremental verification. This makes the part popular in academic research and small-volume product bring-up.
Empfohlen
Portable Test and Measurement
The 10CL016YU484I7G fits handheld oscilloscope and logic-analyzer front-ends because its 56 18x18 multipliers implement real-time FFT, FIR filtering, and trigger detection at sample rates up to 250 MSPS. The 4 PLLs generate multiple synchronized ADC sample clocks from a single TCXO, and the 340 user I/Os accept parallel LVDS data from multi-channel ADCs. Industrial temperature grade and low static power suit battery-powered field instruments. The BGA package keeps the PCB footprint under 25x25 mm, leaving room for battery, display, and isolation barriers in portable form factors.
Empfohlen
IoT Edge Sensor Aggregation
The 10CL016YU484I7G aggregates and pre-processes sensor data in industrial IoT gateways because its 15,408 logic elements implement multiple I2C/SPI/UART bridges, GPIO expanders, and protocol converters in parallel. The 56 multipliers accelerate on-device anomaly detection (rolling RMS, FFT) before forwarding filtered data to an MCU or radio module. The 4 PLLs derive multiple baud-rate clocks and sensor sampling rates from a single 50 MHz crystal. Industrial temperature grade and the U484 BGA's high I/O count suit DIN-rail mounted edge nodes aggregating dozens of sensors per gateway.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10CL016YU484I7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10CL016YU484C8G | 10CL016YU484C6G | 10CL016YU484A7G |
|---|---|---|---|---|
| Package | 484-ball UBGA (U484) | 484-ball UBGA (U484) - same | 484-ball UBGA (U484) - same | 484-ball UBGA (U484) - same |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 15,408 | 15,408 | 15,408 | 15,408 |
| Embedded Memory | 516,096 bits | 516,096 bits | 516,096 bits | 516,096 bits |
| 18x18 Multipliers | 56 | 56 | 56 | 56 |
| Maximum User I/O | 340 | 340 | 340 | 340 |
| PLLs | 4 fractional | 4 fractional | 4 fractional | 4 fractional |
| Speed Grade | 7 | 8 (slower) | 6 (slowest) | 7 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive/Extended |
Wichtigste Unterscheidungsmerkmale
- Best-in-class drop-in speed/temperature flexibility within the U484 BGA family (vs. 10CL016YU484C8G)
- Industrial-grade timing margin vs slower speed grade (vs. 10CL016YU484C6G)
- Wider industrial temperature support than the automotive-grade A7G variant (vs. 10CL016YU484A7G)
Designhinweise
Estimated: The U484 BGA has a typical theta_JA of approximately 12-15 C/W with a 4-layer JEDEC test PCB, depending on via pattern and copper weight. At 1.0 W total power dissipation the junction-to-ambient rise is roughly 12-15 C. Designers targeting industrial -40C to +100C junction must keep total power below approximately 2.0 W at 70C ambient, or use thermal vias under the center BGA balls and a bottom-side copper flood to stay within margin.
The 484-ball UBGA uses 1.0 mm pitch; PCB fabrication must support 0.4 mm laser-drilled micro-vias with filled and plated-copper caps for the BGA pads. Use a 1.0 mm diameter solder mask-defined (SMD) pad with non-solder mask-defined (NSMD) preferred for signal balls to improve joint reliability. Decoupling requires 0.1 uF and 1 uF X7R capacitors placed within 2 mm of each VCC/VCCIO/VCCAUX/VCCPD cluster. Follow the Intel Cyclone 10 LP Board Design Guidelines for stackup and via pattern.
Three common mistakes: (1) Mixing LVCMOS33 and LVCMOS25 in the same VCCIO bank - each bank shares a single I/O voltage. (2) Forgetting to connect all GND balls - unused balls should still be soldered and tied to the ground plane for thermal spreading. (3) Skipping the CONFIG_DONE pull-up or MSEL[3:0] configuration of the boot mode - the device will not enumerate if MSEL does not match the intended configuration scheme (AS, AP, JTAG). Refer to the Cyclone 10 LP Configuration User Guide before tape-out.
Compliance-Informationen
RoHS and REACH compliant per Intel product page; lead-free BGA balls. Not AEC-Q100 qualified - choose 10CL016YU484A7G for automotive. Industrial temperature grade supports -40C to +100C junction.