10CL016YU484I7G - Cyclone 10 LP FPGA 15K LE U484 BGA | Intel
MPN: 10CL016YU484I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $88.42 | $88.42 |
| 10 | $79.58 | $795.80 |
| 100 | $70.74 | $7,074.00 |
| 500 | $61.9 | $30,950.00 |
| 1,000 | $55.27 | $55,270.00 |
Drop-in alternatives for 10CL016YU484I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL016YU484C8G
✅ Drop-In✓ In Stock
$60.8 / Unit
View Datasheet →10CL016YU484C6G
✅ Drop-In✓ In Stock
$47.9 / Unit
View Datasheet →10CL016YU484A7G
✅ Drop-In✓ In Stock
$43.88 / Unit
View Datasheet →10CL016YU484I7G
✅ Drop-In✓ In Stock
$55.27 / Unit
View Datasheet →10CL016YU484I7G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Logic Elements | 15,408 |
| Embedded Memory | 516,096 bits |
| Embedded 18x18 Multipliers | 56 |
| Maximum User I/O | 340 |
| PLLs | 4 (fractional) |
| Package | 484-ball UBGA (U484) |
| Package Code | U484 |
| Speed Grade | 7 |
| Temperature Grade | Industrial (-40C to +100C junction) |
| Process Technology | Low-power CMOS |
| Configuration Modes | JTAG, Active Serial, Active Parallel |
| Design Software | Intel Quartus Prime |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
10CL016YU484I7G u484 Pin Configuration Guide
Complete pinout information for 10CL016YU484I7G (u484 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL016YU484I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL016YU484I7G is suitable for 6 applications: Industrial Motor Control, Video Bridging and Display Aggregation, Industrial Ethernet and Fieldbus Gateways, Low-Cost ASIC Prototyping, Portable Test and Measurement, IoT Edge Sensor Aggregation.
Industrial Motor Control
The 10CL016YU484I7G suits industrial motor drives because its 15,408 logic elements and 56 18x18 multipliers implement field-oriented control (FOC), space-vector PWM, and encoder interfaces in a single chip. The 4 fractional PLLs generate precise PWM carrier frequencies and resolver excitation clocks, while 340 user I/Os handle Hall sensors, QEP decoders, and gate-driver feedback. Industrial temperature grade (-40C to +100C junction) supports factory-floor deployment without additional thermal screening, and the U484 BGA exposes sufficient LVDS pairs for high-speed current-sense ADCs. Designers typically pair this FPGA with a TI C2000 MCU for safety hand-off and use Quartus Prime Qsys to integrate motor IP.
Recommended
Video Bridging and Display Aggregation
The 10CL016YU484I7G aggregates multiple video streams in industrial HMI and digital signage because its 340 user I/Os accept parallel RGB, LVDS, and OpenLDI inputs simultaneously. The 56 embedded 18x18 multipliers accelerate chroma resampling, scaling, and alpha blending at 1080p60 with headroom. Embedded M10K memory blocks (516 Kbits total) buffer scan-line data without external SRAM. The U484 BGA footprint provides ample LVDS channels for dual-link DSI/HDMI bridges. Quartus Prime Video and Image Processing Suite IPs (VIP, scaler, mixer) shorten development time for medical imaging and kiosk displays.
Recommended
Industrial Ethernet and Fieldbus Gateways
The 10CL016YU484I7G implements real-time industrial Ethernet protocols (EtherCAT, PROFINET, EtherNet/IP) because the 56 hardware multipliers and 340 I/Os handle MAC, PHY management, and synchronization jitter below 1 microsecond. The 4 fractional PLLs derive 125 MHz PHY reference clocks and timestamp counters from a single TCXO. Embedded memory buffers PDU fragments before forwarding to a host controller. The industrial temperature grade ensures operation in cabinet environments, and the BGA package supports the LVDS pairs required for MII/RGMII to multi-port PHYs. Designers pair the FPGA with a Micrel KSZ9031 gigabit PHY for line-rate bridging.
Recommended
Low-Cost ASIC Prototyping
The 10CL016YU484I7G provides a sweet-spot prototyping platform for ASICs in the 10K-30K gate-equivalent range because its 15,408 logic elements, 516 Kbits of block RAM, and 56 DSP multipliers are large enough to host representative ASIC subsystems while staying below $90 in unit cost. The U484 BGA exposes enough I/Os to replicate most ASIC pad rings. Quartus Prime TimeQuest timing analysis correlates closely with ASIC sign-off tools, and the same RTL can be migrated to a Cyclone V SoC or Cyclone IV GX for incremental verification. This makes the part popular in academic research and small-volume product bring-up.
Recommended
Portable Test and Measurement
The 10CL016YU484I7G fits handheld oscilloscope and logic-analyzer front-ends because its 56 18x18 multipliers implement real-time FFT, FIR filtering, and trigger detection at sample rates up to 250 MSPS. The 4 PLLs generate multiple synchronized ADC sample clocks from a single TCXO, and the 340 user I/Os accept parallel LVDS data from multi-channel ADCs. Industrial temperature grade and low static power suit battery-powered field instruments. The BGA package keeps the PCB footprint under 25x25 mm, leaving room for battery, display, and isolation barriers in portable form factors.
Recommended
IoT Edge Sensor Aggregation
The 10CL016YU484I7G aggregates and pre-processes sensor data in industrial IoT gateways because its 15,408 logic elements implement multiple I2C/SPI/UART bridges, GPIO expanders, and protocol converters in parallel. The 56 multipliers accelerate on-device anomaly detection (rolling RMS, FFT) before forwarding filtered data to an MCU or radio module. The 4 PLLs derive multiple baud-rate clocks and sensor sampling rates from a single 50 MHz crystal. Industrial temperature grade and the U484 BGA's high I/O count suit DIN-rail mounted edge nodes aggregating dozens of sensors per gateway.
Recommended
Recommended Products Summary
Engineering reference data for 10CL016YU484I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL016YU484C8G | 10CL016YU484C6G | 10CL016YU484A7G |
|---|---|---|---|---|
| Package | 484-ball UBGA (U484) | 484-ball UBGA (U484) - same | 484-ball UBGA (U484) - same | 484-ball UBGA (U484) - same |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 15,408 | 15,408 | 15,408 | 15,408 |
| Embedded Memory | 516,096 bits | 516,096 bits | 516,096 bits | 516,096 bits |
| 18x18 Multipliers | 56 | 56 | 56 | 56 |
| Maximum User I/O | 340 | 340 | 340 | 340 |
| PLLs | 4 fractional | 4 fractional | 4 fractional | 4 fractional |
| Speed Grade | 7 | 8 (slower) | 6 (slowest) | 7 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive/Extended |
Key Differentiators
- Best-in-class drop-in speed/temperature flexibility within the U484 BGA family (vs 10CL016YU484C8G)
- Industrial-grade timing margin vs slower speed grade (vs 10CL016YU484C6G)
- Wider industrial temperature support than the automotive-grade A7G variant (vs 10CL016YU484A7G)
Design Notes
Estimated: The U484 BGA has a typical theta_JA of approximately 12-15 C/W with a 4-layer JEDEC test PCB, depending on via pattern and copper weight. At 1.0 W total power dissipation the junction-to-ambient rise is roughly 12-15 C. Designers targeting industrial -40C to +100C junction must keep total power below approximately 2.0 W at 70C ambient, or use thermal vias under the center BGA balls and a bottom-side copper flood to stay within margin.
The 484-ball UBGA uses 1.0 mm pitch; PCB fabrication must support 0.4 mm laser-drilled micro-vias with filled and plated-copper caps for the BGA pads. Use a 1.0 mm diameter solder mask-defined (SMD) pad with non-solder mask-defined (NSMD) preferred for signal balls to improve joint reliability. Decoupling requires 0.1 uF and 1 uF X7R capacitors placed within 2 mm of each VCC/VCCIO/VCCAUX/VCCPD cluster. Follow the Intel Cyclone 10 LP Board Design Guidelines for stackup and via pattern.
Three common mistakes: (1) Mixing LVCMOS33 and LVCMOS25 in the same VCCIO bank - each bank shares a single I/O voltage. (2) Forgetting to connect all GND balls - unused balls should still be soldered and tied to the ground plane for thermal spreading. (3) Skipping the CONFIG_DONE pull-up or MSEL[3:0] configuration of the boot mode - the device will not enumerate if MSEL does not match the intended configuration scheme (AS, AP, JTAG). Refer to the Cyclone 10 LP Configuration User Guide before tape-out.
Compliance Information
RoHS and REACH compliant per Intel product page; lead-free BGA balls. Not AEC-Q100 qualified - choose 10CL016YU484A7G for automotive. Industrial temperature grade supports -40C to +100C junction.
