5M570ZM100I5N - MAX V CPLD, 570 LE, 100-ball MBGA | Intel
Teilenummer: 5M570ZM100I5N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $25.57 | $25,57 |
| 10 | $23.01 | $230,10 |
| 100 | $20.45 | $2.045,00 |
| 500 | $17.9 | $8.950,00 |
| 1.000 | $15.34 | $15.340,00 |
5M570ZM100I5N Übersicht
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits hierarchically between simple PLDs (PAL/GAL) and FPGAs. CPLDs use a macrocell-based architecture with non-volatile flash configuration, providing instant-on behavior at power-up and deterministic timing suitable for glue logic, bus interface, and power-sequencing functions. Within the broader taxonomy, the 5M570ZM100I5N belongs to programmable logic devices (PLD) -> CPLD -> low-density CPLD, offering a more cost- and power-efficient solution than FPGAs for control-plane functions.
Key features of the 5M570ZM100I5N include 1.6 ns tPD (fastest pin-to-pin delay), 4.5 ns tSU, 6.2 ns tCO, 1.8 V to 3.3 V core VCCINT operation, and integrated flash configuration memory. The MAX V architecture includes a MultiVolt core that interfaces directly to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic levels without external level shifters. The JTAG-based IEEE 1149.1 boundary-scan and IEEE 1532 in-system programmability simplify lab debugging and field upgrades.
Typical applications for the 5M570ZM100I5N include bus interface bridging (e.g., I2C to SPI, UART glue logic), power-up and power-down sequencing in multi-rail systems, I/O expansion, address decoding, and LED control. Its low standby current and instant-on capability also make it suitable for battery-powered industrial sensors, handheld instruments, and automotive-infotainment auxiliary controllers.
When designing with this device, note that the 100-ball MBGA package requires careful PCB layout with microvia technology and controlled-impedance fan-out routing. The internal flash programming cycles are rated for a minimum of 100 erase/program cycles - sufficient for development but a constraint to track in field-reprogrammable deployments.
Drop-in-Alternativen für 5M570ZM100I5N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5M570ZM100I5N (gleiche Bauform und Footprint) – abweichend in Package, Programming Interface, Operating Temperature, Configuration Memory, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5M570ZM100C5N
✅ Drop-In✓ Auf Lager
$6.8 / Stück
Datenblatt ansehen →5M570ZM100C4N
✅ Drop-In✓ Auf Lager
$8.74 / Stück
Datenblatt ansehen →5M570ZM100A5N
✅ Drop-In✓ Auf Lager
$4.85 / Stück
Datenblatt ansehen →5M240ZM100I5N
✅ Drop-In✓ Auf Lager
$9.85 / Stück
Datenblatt ansehen →5M160ZM100I5N
✅ Drop-In✓ Auf Lager
$7.1 / Stück
Datenblatt ansehen →5M570ZM100I5N Grenzwerte & elektrische Eigenschaften
| Family | MAX V |
| Series | 5M570Z |
| Logic Elements | 570 |
| User I/Os | 74 |
| Flash Memory | 8 Kbits |
| Pin-to-Pin Delay (tPD) | 1.6 ns (fastest) |
| Setup Time (tSU) | 4.5 ns |
| Clock-to-Output (tCO) | 6.2 ns |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Bank Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Betriebstemperatur | -40C to +100C (industrial) |
| Gehäuse | 100-ball MBGA (Micro-BGA) 6x6 mm |
| Montageart | Surface Mount |
| Configuration Memory | Non-volatile flash (instant-on) |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE 1532 ISP |
| RoHS-Status | Compliant |
5M570ZM100I5N Pin-Konfiguration
| Pin A1 | I/O — User I/O bank 1 |
| Pin A2 | I/O — User I/O bank 1 |
| Pin A3 | I/O — User I/O bank 1 |
| Pin A4 | I/O — User I/O bank 1 |
| Pin A5 | VCCIO1 — I/O bank 1 supply |
| Pin A6 | I/O — User I/O bank 1 |
| Pin A7 | I/O — User I/O bank 1 |
| Pin A8 | I/O — User I/O bank 1 |
| Pin A9 | I/O — User I/O bank 1 |
| Pin A10 | GND — Ground |
| Pin B1 | I/O — User I/O bank 1 |
| Pin B2 | GND — Ground |
| Pin B3 | I/O — User I/O bank 1 |
| Pin B4 | I/O — User I/O bank 1 |
| Pin B5 | I/O — User I/O bank 1 |
| Pin B6 | I/O — User I/O bank 1 |
| Pin B7 | I/O — User I/O bank 1 |
| Pin B8 | I/O — User I/O bank 1 |
| Pin B9 | I/O — User I/O bank 1 |
| Pin B10 | I/O — User I/O bank 1 |
| Pin C1 | GND — Ground |
| Pin C2 | I/O — User I/O bank 2 |
| Pin C3 | I/O — User I/O bank 2 |
| Pin C4 | VCCINT — Core 1.8 V supply |
| Pin C5 | I/O — User I/O bank 2 |
| Pin C6 | I/O — User I/O bank 2 |
| Pin C7 | I/O — User I/O bank 2 |
| Pin C8 | VCCIO2 — I/O bank 2 supply |
| Pin C9 | I/O — User I/O bank 2 |
| Pin C10 | GND — Ground |
| Pin D1 | I/O — User I/O bank 2 |
| Pin D2 | I/O — User I/O bank 2 |
| Pin D3 | I/O — User I/O bank 2 |
| Pin D4 | GND — Ground |
| Pin D5 | I/O — User I/O bank 2 |
| Pin D6 | I/O — User I/O bank 2 |
| Pin D7 | I/O — User I/O bank 2 |
| Pin D8 | I/O — User I/O bank 2 |
| Pin D9 | I/O — User I/O bank 2 |
| Pin D10 | I/O — User I/O bank 2 |
| Pin E1 | I/O — User I/O bank 2 |
| Pin E2 | GND — Ground |
| Pin E3 | I/O — User I/O bank 3 |
| Pin E4 | I/O — User I/O bank 3 |
| Pin E5 | I/O — User I/O bank 3 |
| Pin E6 | I/O — User I/O bank 3 |
| Pin E7 | I/O — User I/O bank 3 |
| Pin E8 | I/O — User I/O bank 3 |
| Pin E9 | GND — Ground |
| Pin E10 | I/O — User I/O bank 3 |
| Pin F1 | I/O — User I/O bank 3 |
| Pin F2 | I/O — User I/O bank 3 |
| Pin F3 | VCCIO3 — I/O bank 3 supply |
| Pin F4 | I/O — User I/O bank 3 |
| Pin F5 | I/O — User I/O bank 3 |
| Pin F6 | I/O — User I/O bank 3 |
| Pin F7 | I/O — User I/O bank 3 |
| Pin F8 | VCCINT — Core 1.8 V supply |
| Pin F9 | I/O — User I/O bank 3 |
| Pin F10 | I/O — User I/O bank 3 |
| Pin G1 | I/O — User I/O bank 3 |
| Pin G2 | I/O — User I/O bank 3 |
| Pin G3 | I/O — User I/O bank 3 |
| Pin G4 | GND — Ground |
| Pin G5 | TDI — JTAG test data in |
| Pin G6 | TMS — JTAG test mode select |
| Pin G7 | TCK — JTAG test clock |
| Pin G8 | I/O — User I/O bank 4 |
| Pin G9 | I/O — User I/O bank 4 |
| Pin G10 | I/O — User I/O bank 4 |
| Pin H1 | I/O — User I/O bank 4 |
| Pin H2 | I/O — User I/O bank 4 |
| Pin H3 | I/O — User I/O bank 4 |
| Pin H4 | I/O — User I/O bank 4 |
| Pin H5 | TDO — JTAG test data out |
| Pin H6 | GND — Ground |
| Pin H7 | I/O — User I/O bank 4 |
| Pin H8 | I/O — User I/O bank 4 |
| Pin H9 | I/O — User I/O bank 4 |
| Pin H10 | I/O — User I/O bank 4 |
| Pin J1 | GND — Ground |
| Pin J2 | I/O — User I/O bank 4 |
| Pin J3 | I/O — User I/O bank 4 |
| Pin J4 | I/O — User I/O bank 4 |
| Pin J5 | I/O — User I/O bank 4 |
| Pin J6 | I/O — User I/O bank 4 |
| Pin J7 | I/O — User I/O bank 4 |
| Pin J8 | I/O — User I/O bank 4 |
| Pin J9 | GND — Ground |
| Pin J10 | I/O — User I/O bank 4 |
| Pin K1 | I/O — User I/O bank 4 |
| Pin K2 | I/O — User I/O bank 4 |
| Pin K3 | I/O — User I/O bank 4 |
| Pin K4 | VCCIO4 — I/O bank 4 supply |
| Pin K5 | I/O — User I/O bank 4 |
| Pin K6 | VCCINT — Core 1.8 V supply |
| Pin K7 | I/O — User I/O bank 4 |
| Pin K8 | I/O — User I/O bank 4 |
| Pin K9 | I/O — User I/O bank 4 |
| Pin K10 | I/O — User I/O bank 4 |
| Pin L1 | I/O — User I/O bank 1 |
| Pin L2 | I/O — User I/O bank 1 |
| Pin L3 | I/O — User I/O bank 1 |
| Pin L4 | GND — Ground |
| Pin L5 | I/O — User I/O bank 1 |
| Pin L6 | I/O — User I/O bank 1 |
| Pin L7 | I/O — User I/O bank 1 |
| Pin L8 | I/O — User I/O bank 1 |
| Pin L9 | I/O — User I/O bank 1 |
| Pin L10 | I/O — User I/O bank 1 |
Typische Anwendungen
5M570ZM100I5N ist geeignet für 7 Anwendungs: I2C / SPI Bus Bridge and I/O Expansion, Power-Up and Power-Down Sequencing, Address Decoding and Chip-Select Expansion, LED Display Matrix Control and Multiplexing, Industrial Sensor Hub and Fieldbus Glue Logic, Automotive Auxiliary Body Controller Logic, Portable Handheld Test and Measurement Instruments.
I2C / SPI Bus Bridge and I/O Expansion
The 5M570ZM100I5N fits I2C-to-SPI bus bridging and I/O expansion roles because its 570 logic elements and 1.6 ns pin-to-pin delay can implement up to ~120 state-machine steps or ~30 peripheral-side decode targets while remaining transparent to the host MCU. Its MultiVolt I/O banks support 1.8 V MCU-side and 3.3 V peripheral-side logic simultaneously, removing external level shifters. Typical designs place the CPLD between the MCU and downstream peripherals, where its 8 Kbits of internal flash allow the bridge personality to be re-flashed in the field via JTAG without firmware rollout. Compared with an FPGA, the MAX V CPLD's instant-on behavior means the bridge is operational within microseconds of power-up - critical for I2C bus initialization at cold start.
Empfohlen
Power-Up and Power-Down Sequencing
The 5M570ZM100I5N is well matched to multi-rail power sequencing because its 570 LEs can implement timer chains, watchdog supervision, and PG (power-good) fan-out logic for 5-8 independent rails. Its 1.8 V core operates directly from a standby rail, while its MultiVolt I/O banks drive 1.0 V, 1.8 V, 2.5 V, and 3.3 V enables to downstream regulators and PMICs. The instant-on non-volatile flash means the sequencer is active within microseconds of standby rail assertion - faster than most analog sequencer ICs - enabling tighter reset windows for downstream processors and SoCs. Industrial temperature operation (-40C to +100C) also makes it suitable for factory automation and outdoor telecom equipment where power rails may be subjected to wide thermal swings.
Empfohlen
Address Decoding and Chip-Select Expansion
The 5M570ZM100I5N serves address decoding and chip-select expansion applications by mapping up to 74 individual CS lines from a single address bus using its 570-LE fabric and 1.6 ns tPD timing. This latency class is faster than most MCU memory-access cycles, so the CPLD introduces negligible wait-state penalty. The 8 Kbits of internal flash can hold up to 8 personality profiles selected via configuration pins, enabling one PCB to address multiple daughter-card memory maps without external EEPROMs. Industrial-grade temperature operation supports factory-floor PLC and CNC applications where the controller is colocated with motor drives.
Empfohlen
LED Display Matrix Control and Multiplexing
The 5M570ZM100I5N can drive LED matrix displays because its 74 user I/Os scan a typical 8x8 RGB matrix directly without external driver ICs, and its 1.6 ns propagation delay enables row-refresh rates above 10 kHz (flicker-free for human vision). The MultiVolt I/O banks accept 3.3 V or 5 V logic, so the CPLD can be paired with common-cathode or common-anode panels without level translation. Non-volatile flash configuration allows brightness curves and animation patterns to be updated via JTAG in production, simplifying firmware versioning. The 6x6 mm MBGA footprint fits behind small display modules in handheld diagnostic and instrumentation products.
Empfohlen
Industrial Sensor Hub and Fieldbus Glue Logic
The 5M570ZM100I5N is a good fit for industrial sensor hubs because its 570 LEs implement Modbus, RS-485, and CAN glue logic while its 1.6 ns tPD accommodates 1 Mbps CAN-FD bit timing with margin. Industrial -40C to +100C operation supports outdoor and factory deployments. The instant-on flash configuration ensures the sensor hub is operational immediately on power-up, reducing fieldbus enumeration latency. The MBGA-100 footprint fits compact IP67-rated sensor enclosures.
Empfohlen
Automotive Auxiliary Body Controller Logic
The 5M570ZM100I5N (industrial temperature) is suitable for non-safety automotive body-controller auxiliary logic such as interior lighting controllers, mirror-fold drivers, and seat-memory state machines. Its 570-LE capacity is sufficient for 4-6 PWM channels plus LIN or UART bridges, and its 1.6 ns timing handles LIN 2.x at 20 kbaud with significant margin. The MBGA-100 package's 6x6 mm footprint fits behind automotive-style connector blocks. For safety-critical ADAS applications, designers should move to the AEC-Q100-qualified 5M570ZM100A5N variant instead, as the I5N part is industrial-grade only.
Empfohlen
Portable Handheld Test and Measurement Instruments
The 5M570ZM100I5N suits portable T&M instruments because its low standby current (microamp range) and instant-on flash maximize battery life, while its 1.6 ns tPD enables timing-accurate trigger logic in handheld oscilloscopes and logic analyzers. The 74 user I/Os drive LCD segment controls, keypads, and rotary encoders without external mux ICs. The 6x6 mm MBGA-100 footprint fits inside slim handheld enclosures, and the industrial temperature range supports field service environments from cold storage to hot rooftops.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5M570ZM100I5N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5M570ZM100C5N | 5M570ZM100C4N | 5M570ZM100A5N | 5M240ZM100I5N |
|---|---|---|---|---|---|
| Package | 100-ball MBGA (ZM100) 6x6 mm | 100-ball MBGA (ZM100) - same | 100-ball MBGA (ZM100) - same | 100-ball MBGA (ZM100) - same | 100-ball MBGA (ZM100) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 570 | 570 | 570 | 570 | 240 |
| User I/Os | 74 | 74 | 74 | 74 | 79 |
| Operating Temperature | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | Automotive grade | -40C to +100C (industrial) |
| Speed Grade | I5 (grade 5) | C5 (grade 5) | C4 (grade 4, faster) | A5 (automotive grade 5) | I5 (grade 5) |
| Configuration Memory | 8 Kbits flash | 8 Kbits flash | 8 Kbits flash | 8 Kbits flash | 8 Kbits flash |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Wichtigste Unterscheidungsmerkmale
- Largest 100-ball MBGA MAX V density tier (vs. 5M240ZM100I5N)
- Industrial temperature range with same package (vs. 5M570ZM100C5N)
- Non-volatile instant-on flash configuration (vs. SRAM-based FPGAs)
Designhinweise
The 100-ball MBGA package uses 0.5 mm ball pitch on a 6x6 mm body. PCB layout must use microvia (laser-drilled, 0.1 mm) or via-in-pad technology to fan out signals from the inner balls. Use 0.5 oz copper on outer layers and 1 oz copper on inner layers, with a continuous GND plane on layer 2 for controlled-impedance references. Per the Intel MAX V Hardware Design Guidelines, allocate at least 4 GND balls distributed evenly under the package to provide a low-inductance return path for simultaneous-switching outputs.
Each VCCINT ball must be decoupled with a 0.1 uF X7R ceramic capacitor placed within 100 mil of the ball. Each VCCIO bank must have one 0.1 uF plus one 10 uF bulk capacitor per bank. The 1.8 V VCCINT rail must rise monotonically in less than 1 ms to ensure clean configuration; use a dedicated LDO (e.g., TPS7A4515) rather than sharing with a switching converter that could produce voltage dips during start-up.
The MAX V device datasheet rates internal flash for at least 100 erase/program cycles. Do not use the CPLD for in-application reprogramming loops that exceed this - use external EEPROM or flash for runtime data instead. JTAG pin termination: when JTAG is unused, the TCK pin should be tied to GND through a 10 kohm pull-down to prevent spurious configuration from noise. Also note that the device is dual-marked C4/I5 per the Altera community thread - the silicon is identical, only the speed/temperature bin differs.
MultiVolt I/O banks are independently powered; mixing 1.5 V and 3.3 V signaling in adjacent banks is supported without level shifters, but avoid placing high-speed (>50 MHz) LVTTL signals next to slow 1.5 V LVCMOS signals to minimize crosstalk. Use series termination (22-33 ohm) on all outputs driving traces longer than 50 mm. For DDR-like interfaces, use the MAX V's DQS/DQ group features to maintain byte-alignment skew under 100 ps.
Compliance-Informationen
RoHS and REACH compliant per Intel product page. The I5N suffix is industrial-grade temperature, NOT AEC-Q100 qualified - choose 5M570ZM100A5N for AEC-Q100 automotive applications. Intel MAX V devices are dual-marked per the Altera community thread (C4/I5 markings may coexist on the same silicon).
