5M570ZM100I5N - MAX V CPLD, 570 LE, 100-ball MBGA | Intel
N.º da peça: 5M570ZM100I5N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $25.57 | $25,57 |
| 10 | $23.01 | $230,10 |
| 100 | $20.45 | $2.045,00 |
| 500 | $17.9 | $8.950,00 |
| 1.000 | $15.34 | $15.340,00 |
5M570ZM100I5N Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits hierarchically between simple PLDs (PAL/GAL) and FPGAs. CPLDs use a macrocell-based architecture with non-volatile flash configuration, providing instant-on behavior at power-up and deterministic timing suitable for glue logic, bus interface, and power-sequencing functions. Within the broader taxonomy, the 5M570ZM100I5N belongs to programmable logic devices (PLD) -> CPLD -> low-density CPLD, offering a more cost- and power-efficient solution than FPGAs for control-plane functions.
Key features of the 5M570ZM100I5N include 1.6 ns tPD (fastest pin-to-pin delay), 4.5 ns tSU, 6.2 ns tCO, 1.8 V to 3.3 V core VCCINT operation, and integrated flash configuration memory. The MAX V architecture includes a MultiVolt core that interfaces directly to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic levels without external level shifters. The JTAG-based IEEE 1149.1 boundary-scan and IEEE 1532 in-system programmability simplify lab debugging and field upgrades.
Typical applications for the 5M570ZM100I5N include bus interface bridging (e.g., I2C to SPI, UART glue logic), power-up and power-down sequencing in multi-rail systems, I/O expansion, address decoding, and LED control. Its low standby current and instant-on capability also make it suitable for battery-powered industrial sensors, handheld instruments, and automotive-infotainment auxiliary controllers.
When designing with this device, note that the 100-ball MBGA package requires careful PCB layout with microvia technology and controlled-impedance fan-out routing. The internal flash programming cycles are rated for a minimum of 100 erase/program cycles - sufficient for development but a constraint to track in field-reprogrammable deployments.
Alternativas drop-in para 5M570ZM100I5N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5M570ZM100I5N (mesmo formato e footprint) — diferindo em Package, Programming Interface, Operating Temperature, Configuration Memory, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5M570ZM100C5N
✅ Drop-In✓ Em estoque
$6.8 / unidade
Ver ficha técnica →5M570ZM100C4N
✅ Drop-In✓ Em estoque
$8.74 / unidade
Ver ficha técnica →5M570ZM100A5N
✅ Drop-In✓ Em estoque
$4.85 / unidade
Ver ficha técnica →5M240ZM100I5N
✅ Drop-In✓ Em estoque
$9.85 / unidade
Ver ficha técnica →5M160ZM100I5N
✅ Drop-In✓ Em estoque
$7.1 / unidade
Ver ficha técnica →5M570ZM100I5N Classificações máximas e características elétricas
| Family | MAX V |
| Series | 5M570Z |
| Logic Elements | 570 |
| User I/Os | 74 |
| Flash Memory | 8 Kbits |
| Pin-to-Pin Delay (tPD) | 1.6 ns (fastest) |
| Setup Time (tSU) | 4.5 ns |
| Clock-to-Output (tCO) | 6.2 ns |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Bank Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Temperatura de operação | -40C to +100C (industrial) |
| Encapsulamento | 100-ball MBGA (Micro-BGA) 6x6 mm |
| Tipo de montagem | Surface Mount |
| Configuration Memory | Non-volatile flash (instant-on) |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE 1532 ISP |
| Status RoHS | Compliant |
Configuração de pinos do 5M570ZM100I5N
| Pino A1 | I/O — User I/O bank 1 |
| Pino A2 | I/O — User I/O bank 1 |
| Pino A3 | I/O — User I/O bank 1 |
| Pino A4 | I/O — User I/O bank 1 |
| Pino A5 | VCCIO1 — I/O bank 1 supply |
| Pino A6 | I/O — User I/O bank 1 |
| Pino A7 | I/O — User I/O bank 1 |
| Pino A8 | I/O — User I/O bank 1 |
| Pino A9 | I/O — User I/O bank 1 |
| Pino A10 | GND — Ground |
| Pino B1 | I/O — User I/O bank 1 |
| Pino B2 | GND — Ground |
| Pino B3 | I/O — User I/O bank 1 |
| Pino B4 | I/O — User I/O bank 1 |
| Pino B5 | I/O — User I/O bank 1 |
| Pino B6 | I/O — User I/O bank 1 |
| Pino B7 | I/O — User I/O bank 1 |
| Pino B8 | I/O — User I/O bank 1 |
| Pino B9 | I/O — User I/O bank 1 |
| Pino B10 | I/O — User I/O bank 1 |
| Pino C1 | GND — Ground |
| Pino C2 | I/O — User I/O bank 2 |
| Pino C3 | I/O — User I/O bank 2 |
| Pino C4 | VCCINT — Core 1.8 V supply |
| Pino C5 | I/O — User I/O bank 2 |
| Pino C6 | I/O — User I/O bank 2 |
| Pino C7 | I/O — User I/O bank 2 |
| Pino C8 | VCCIO2 — I/O bank 2 supply |
| Pino C9 | I/O — User I/O bank 2 |
| Pino C10 | GND — Ground |
| Pino D1 | I/O — User I/O bank 2 |
| Pino D2 | I/O — User I/O bank 2 |
| Pino D3 | I/O — User I/O bank 2 |
| Pino D4 | GND — Ground |
| Pino D5 | I/O — User I/O bank 2 |
| Pino D6 | I/O — User I/O bank 2 |
| Pino D7 | I/O — User I/O bank 2 |
| Pino D8 | I/O — User I/O bank 2 |
| Pino D9 | I/O — User I/O bank 2 |
| Pino D10 | I/O — User I/O bank 2 |
| Pino E1 | I/O — User I/O bank 2 |
| Pino E2 | GND — Ground |
| Pino E3 | I/O — User I/O bank 3 |
| Pino E4 | I/O — User I/O bank 3 |
| Pino E5 | I/O — User I/O bank 3 |
| Pino E6 | I/O — User I/O bank 3 |
| Pino E7 | I/O — User I/O bank 3 |
| Pino E8 | I/O — User I/O bank 3 |
| Pino E9 | GND — Ground |
| Pino E10 | I/O — User I/O bank 3 |
| Pino F1 | I/O — User I/O bank 3 |
| Pino F2 | I/O — User I/O bank 3 |
| Pino F3 | VCCIO3 — I/O bank 3 supply |
| Pino F4 | I/O — User I/O bank 3 |
| Pino F5 | I/O — User I/O bank 3 |
| Pino F6 | I/O — User I/O bank 3 |
| Pino F7 | I/O — User I/O bank 3 |
| Pino F8 | VCCINT — Core 1.8 V supply |
| Pino F9 | I/O — User I/O bank 3 |
| Pino F10 | I/O — User I/O bank 3 |
| Pino G1 | I/O — User I/O bank 3 |
| Pino G2 | I/O — User I/O bank 3 |
| Pino G3 | I/O — User I/O bank 3 |
| Pino G4 | GND — Ground |
| Pino G5 | TDI — JTAG test data in |
| Pino G6 | TMS — JTAG test mode select |
| Pino G7 | TCK — JTAG test clock |
| Pino G8 | I/O — User I/O bank 4 |
| Pino G9 | I/O — User I/O bank 4 |
| Pino G10 | I/O — User I/O bank 4 |
| Pino H1 | I/O — User I/O bank 4 |
| Pino H2 | I/O — User I/O bank 4 |
| Pino H3 | I/O — User I/O bank 4 |
| Pino H4 | I/O — User I/O bank 4 |
| Pino H5 | TDO — JTAG test data out |
| Pino H6 | GND — Ground |
| Pino H7 | I/O — User I/O bank 4 |
| Pino H8 | I/O — User I/O bank 4 |
| Pino H9 | I/O — User I/O bank 4 |
| Pino H10 | I/O — User I/O bank 4 |
| Pino J1 | GND — Ground |
| Pino J2 | I/O — User I/O bank 4 |
| Pino J3 | I/O — User I/O bank 4 |
| Pino J4 | I/O — User I/O bank 4 |
| Pino J5 | I/O — User I/O bank 4 |
| Pino J6 | I/O — User I/O bank 4 |
| Pino J7 | I/O — User I/O bank 4 |
| Pino J8 | I/O — User I/O bank 4 |
| Pino J9 | GND — Ground |
| Pino J10 | I/O — User I/O bank 4 |
| Pino K1 | I/O — User I/O bank 4 |
| Pino K2 | I/O — User I/O bank 4 |
| Pino K3 | I/O — User I/O bank 4 |
| Pino K4 | VCCIO4 — I/O bank 4 supply |
| Pino K5 | I/O — User I/O bank 4 |
| Pino K6 | VCCINT — Core 1.8 V supply |
| Pino K7 | I/O — User I/O bank 4 |
| Pino K8 | I/O — User I/O bank 4 |
| Pino K9 | I/O — User I/O bank 4 |
| Pino K10 | I/O — User I/O bank 4 |
| Pino L1 | I/O — User I/O bank 1 |
| Pino L2 | I/O — User I/O bank 1 |
| Pino L3 | I/O — User I/O bank 1 |
| Pino L4 | GND — Ground |
| Pino L5 | I/O — User I/O bank 1 |
| Pino L6 | I/O — User I/O bank 1 |
| Pino L7 | I/O — User I/O bank 1 |
| Pino L8 | I/O — User I/O bank 1 |
| Pino L9 | I/O — User I/O bank 1 |
| Pino L10 | I/O — User I/O bank 1 |
Aplicações típicas
5M570ZM100I5N é adequado para 7 aplicaçãos: I2C / SPI Bus Bridge and I/O Expansion, Power-Up and Power-Down Sequencing, Address Decoding and Chip-Select Expansion, LED Display Matrix Control and Multiplexing, Industrial Sensor Hub and Fieldbus Glue Logic, Automotive Auxiliary Body Controller Logic, Portable Handheld Test and Measurement Instruments.
I2C / SPI Bus Bridge and I/O Expansion
The 5M570ZM100I5N fits I2C-to-SPI bus bridging and I/O expansion roles because its 570 logic elements and 1.6 ns pin-to-pin delay can implement up to ~120 state-machine steps or ~30 peripheral-side decode targets while remaining transparent to the host MCU. Its MultiVolt I/O banks support 1.8 V MCU-side and 3.3 V peripheral-side logic simultaneously, removing external level shifters. Typical designs place the CPLD between the MCU and downstream peripherals, where its 8 Kbits of internal flash allow the bridge personality to be re-flashed in the field via JTAG without firmware rollout. Compared with an FPGA, the MAX V CPLD's instant-on behavior means the bridge is operational within microseconds of power-up - critical for I2C bus initialization at cold start.
Recomendado
Power-Up and Power-Down Sequencing
The 5M570ZM100I5N is well matched to multi-rail power sequencing because its 570 LEs can implement timer chains, watchdog supervision, and PG (power-good) fan-out logic for 5-8 independent rails. Its 1.8 V core operates directly from a standby rail, while its MultiVolt I/O banks drive 1.0 V, 1.8 V, 2.5 V, and 3.3 V enables to downstream regulators and PMICs. The instant-on non-volatile flash means the sequencer is active within microseconds of standby rail assertion - faster than most analog sequencer ICs - enabling tighter reset windows for downstream processors and SoCs. Industrial temperature operation (-40C to +100C) also makes it suitable for factory automation and outdoor telecom equipment where power rails may be subjected to wide thermal swings.
Recomendado
Address Decoding and Chip-Select Expansion
The 5M570ZM100I5N serves address decoding and chip-select expansion applications by mapping up to 74 individual CS lines from a single address bus using its 570-LE fabric and 1.6 ns tPD timing. This latency class is faster than most MCU memory-access cycles, so the CPLD introduces negligible wait-state penalty. The 8 Kbits of internal flash can hold up to 8 personality profiles selected via configuration pins, enabling one PCB to address multiple daughter-card memory maps without external EEPROMs. Industrial-grade temperature operation supports factory-floor PLC and CNC applications where the controller is colocated with motor drives.
Recomendado
LED Display Matrix Control and Multiplexing
The 5M570ZM100I5N can drive LED matrix displays because its 74 user I/Os scan a typical 8x8 RGB matrix directly without external driver ICs, and its 1.6 ns propagation delay enables row-refresh rates above 10 kHz (flicker-free for human vision). The MultiVolt I/O banks accept 3.3 V or 5 V logic, so the CPLD can be paired with common-cathode or common-anode panels without level translation. Non-volatile flash configuration allows brightness curves and animation patterns to be updated via JTAG in production, simplifying firmware versioning. The 6x6 mm MBGA footprint fits behind small display modules in handheld diagnostic and instrumentation products.
Recomendado
Industrial Sensor Hub and Fieldbus Glue Logic
The 5M570ZM100I5N is a good fit for industrial sensor hubs because its 570 LEs implement Modbus, RS-485, and CAN glue logic while its 1.6 ns tPD accommodates 1 Mbps CAN-FD bit timing with margin. Industrial -40C to +100C operation supports outdoor and factory deployments. The instant-on flash configuration ensures the sensor hub is operational immediately on power-up, reducing fieldbus enumeration latency. The MBGA-100 footprint fits compact IP67-rated sensor enclosures.
Recomendado
Automotive Auxiliary Body Controller Logic
The 5M570ZM100I5N (industrial temperature) is suitable for non-safety automotive body-controller auxiliary logic such as interior lighting controllers, mirror-fold drivers, and seat-memory state machines. Its 570-LE capacity is sufficient for 4-6 PWM channels plus LIN or UART bridges, and its 1.6 ns timing handles LIN 2.x at 20 kbaud with significant margin. The MBGA-100 package's 6x6 mm footprint fits behind automotive-style connector blocks. For safety-critical ADAS applications, designers should move to the AEC-Q100-qualified 5M570ZM100A5N variant instead, as the I5N part is industrial-grade only.
Recomendado
Portable Handheld Test and Measurement Instruments
The 5M570ZM100I5N suits portable T&M instruments because its low standby current (microamp range) and instant-on flash maximize battery life, while its 1.6 ns tPD enables timing-accurate trigger logic in handheld oscilloscopes and logic analyzers. The 74 user I/Os drive LCD segment controls, keypads, and rotary encoders without external mux ICs. The 6x6 mm MBGA-100 footprint fits inside slim handheld enclosures, and the industrial temperature range supports field service environments from cold storage to hot rooftops.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5M570ZM100I5N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5M570ZM100C5N | 5M570ZM100C4N | 5M570ZM100A5N | 5M240ZM100I5N |
|---|---|---|---|---|---|
| Package | 100-ball MBGA (ZM100) 6x6 mm | 100-ball MBGA (ZM100) - same | 100-ball MBGA (ZM100) - same | 100-ball MBGA (ZM100) - same | 100-ball MBGA (ZM100) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 570 | 570 | 570 | 570 | 240 |
| User I/Os | 74 | 74 | 74 | 74 | 79 |
| Operating Temperature | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | Automotive grade | -40C to +100C (industrial) |
| Speed Grade | I5 (grade 5) | C5 (grade 5) | C4 (grade 4, faster) | A5 (automotive grade 5) | I5 (grade 5) |
| Configuration Memory | 8 Kbits flash | 8 Kbits flash | 8 Kbits flash | 8 Kbits flash | 8 Kbits flash |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Principais diferenciais
- Largest 100-ball MBGA MAX V density tier (vs 5M240ZM100I5N)
- Industrial temperature range with same package (vs 5M570ZM100C5N)
- Non-volatile instant-on flash configuration (vs SRAM-based FPGAs)
Notas de projeto
The 100-ball MBGA package uses 0.5 mm ball pitch on a 6x6 mm body. PCB layout must use microvia (laser-drilled, 0.1 mm) or via-in-pad technology to fan out signals from the inner balls. Use 0.5 oz copper on outer layers and 1 oz copper on inner layers, with a continuous GND plane on layer 2 for controlled-impedance references. Per the Intel MAX V Hardware Design Guidelines, allocate at least 4 GND balls distributed evenly under the package to provide a low-inductance return path for simultaneous-switching outputs.
Each VCCINT ball must be decoupled with a 0.1 uF X7R ceramic capacitor placed within 100 mil of the ball. Each VCCIO bank must have one 0.1 uF plus one 10 uF bulk capacitor per bank. The 1.8 V VCCINT rail must rise monotonically in less than 1 ms to ensure clean configuration; use a dedicated LDO (e.g., TPS7A4515) rather than sharing with a switching converter that could produce voltage dips during start-up.
The MAX V device datasheet rates internal flash for at least 100 erase/program cycles. Do not use the CPLD for in-application reprogramming loops that exceed this - use external EEPROM or flash for runtime data instead. JTAG pin termination: when JTAG is unused, the TCK pin should be tied to GND through a 10 kohm pull-down to prevent spurious configuration from noise. Also note that the device is dual-marked C4/I5 per the Altera community thread - the silicon is identical, only the speed/temperature bin differs.
MultiVolt I/O banks are independently powered; mixing 1.5 V and 3.3 V signaling in adjacent banks is supported without level shifters, but avoid placing high-speed (>50 MHz) LVTTL signals next to slow 1.5 V LVCMOS signals to minimize crosstalk. Use series termination (22-33 ohm) on all outputs driving traces longer than 50 mm. For DDR-like interfaces, use the MAX V's DQS/DQ group features to maintain byte-alignment skew under 100 ps.
Informações de conformidade
RoHS and REACH compliant per Intel product page. The I5N suffix is industrial-grade temperature, NOT AEC-Q100 qualified - choose 5M570ZM100A5N for AEC-Q100 automotive applications. Intel MAX V devices are dual-marked per the Altera community thread (C4/I5 markings may coexist on the same silicon).
