A3P400-FG256I - 400K Gate ProASIC3 FPGA, 178 I/O | Microchip
Teilenummer: A3P400-FG256I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $68.5 | $68,50 |
| 10 | $62.4 | $624,00 |
| 100 | $56.1 | $5.610,00 |
| 500 | $50.8 | $25.400,00 |
| 1.000 | $46.2 | $46.200,00 |
A3P400-FG256I Übersicht
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory rather than an external configuration device. Within the programmable logic hierarchy, the A3P400 belongs to the ProASIC3 family -> FPGA -> programmable logic IC -> semiconductor, occupying the mid-density position of the ProASIC3 lineup and offering a single-chip solution that requires no external boot PROM.
Key features include non-volatile flash programming for instant-on, single-chip operation; 178 user I/Os supporting bank-selectable voltage standards across four I/O banks; 231 MHz system performance suitable for glue logic, bus bridging, and control datapaths; and the industrial temperature grade (-40C to +100C TJ) that qualifies the part for harsh-environment deployments. The 256-LBGA surface-mount footprint balances ball pitch and board area for aerospace, industrial, and defense platforms.
Technically, ProASIC3 devices use a sea-of-gates flash architecture with VersTile logic elements, on-chip flash locking for design security, and four independent I/O banks whose VCCIBx supplies are routed per bank, allowing only electrically compatible I/O standards to share a bank, as documented in Microchip's ProASIC3 migration application notes.
Typical applications include industrial automation control, communications bridging, avionics and defense subsystems, and secure single-chip logic replacement for ASIC or mask-programmable devices.
When designing, match I/O voltage standards to the correct bank supply and plan power sequencing of VCC/VCCIBx rails per the datasheet.
This page synthesizes distributor stock data, family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3P400-FG256I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3P400-FG256I (gleiche Bauform und Footprint) – abweichend in Package, Family, Configuration Memory, Core Voltage, Logic Gates.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3P400-FG256
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
A3P400-1FG256I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
A3P400-2FG256I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
A3P400-FGG256I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
A3P600-FG256I
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$23.1 / Stück
Datenblatt ansehen →A3P400-FG256I Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3 |
| Number of System Gates | 400000 |
| Number of I/O | 178 |
| DigiKey Listed Resource Value | 55296 |
| Core Voltage | 1.5 V |
| Maximum System Frequency | 231 MHz |
| Number of I/O Banks | 4 |
| Programming Technology | Flash (non-volatile, single-chip) |
| Betriebstemperatur | -40C to +100C (TJ) |
| Gehäuse | 256-LBGA (FG256) |
| Montageart | Surface Mount |
| Packaging | Tray |
| Base Product Number | A3P400 |
| Kategorie | Field Programmable Gate Array (FPGA) IC |
| RoHS-Status | RoHS Non-Compliant (per digchip listing) |
| Lead Free Status | Contains Lead (per digchip listing) |
| Temperature Grade | I (Industrial) |
A3P400-FG256I 256-lbga (fg256) Pinbelegungsleitfaden
Pinbelegung für A3P400-FG256I (256-lbga (fg256)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3P400-FG256I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3P400-FG256I ist geeignet für 6 Anwendungs: Industrial Automation Control, Aerospace and Defense Subsystems, Communications Bridging and Line Cards, Secure Single-Chip Logic Replacement, Test and Measurement Instrumentation, Medical Device Control Electronics.
Industrial Automation Control
The A3P400-FG256I fits industrial automation control because its industrial -40C to +100C (TJ) rating survives factory-floor thermal extremes, and its 178 user I/Os across four voltage banks interface directly with PLC backplanes, motor-control logic, and legacy bus signals. The 400K-gate capacity implements state machines, encoders/decoders, and timing controllers while its flash non-volatility gives instant-on logic at power-up without a configuration PROM. In a typical deployment the FPGA sits between an MCU and field I/O, and its 231 MHz system performance comfortably handles bus bridging tasks. The single-chip flash architecture also reduces BOM cost versus SRAM FPGAs in high-volume industrial control.
Empfohlen
Aerospace and Defense Subsystems
The A3P400-FG256I suits aerospace and defense subsystems because ProASIC3 flash FPGAs originated in the Actel/Microsemi heritage trusted by military programs, offering configuration readback protection via flash design locking and no external bitstream exposure during boot. The 256-LBGA package provides mechanical robustness for vibration-prone platforms, while the -40C to +100C industrial grade covers extended environments. Distributors such as FPGAX explicitly support long-term supply and traceability of this MPN for aerospace, automotive, industrial, and defense sectors, an important lifecycle attribute for programs with multi-decade deployment horizons. Typical roles include interface bridging, telemetry encoding, and secure glue logic.
Empfohlen
Communications Bridging and Line Cards
The A3P400-FG256I is well matched to communications bridging tasks: its 231 MHz system performance handles protocol translation, FIFO interfaces, and bus width conversion between backplane standards, while 178 user I/Os give enough pin count for parallel data paths. The four I/O banks, each with an independent VCCIBx supply, let one device interface mixed-voltage line-card logic without level shifters, a documented ProASIC3 bank architecture per Microchip's migration application note. Because configuration is flash-based, a line card powers up with logic instantly, shortening system bring-up versus SRAM FPGAs that need configuration load time. Board designers should reserve bank capacity per voltage domain early in pin planning.
Empfohlen
Secure Single-Chip Logic Replacement
For ASIC prototyping, obsolete-logic emulation, or secure logic replacement, the A3P400-FG256I provides a single-chip, non-volatile fabric whose flash cells store the design on-chip, removing the configuration PROM that SRAM FPGAs require and closing the bitstream-theft window at boot. ProASIC3's flash locking feature protects IP in fielded systems, and the 400K-gate capacity maps moderate ASIC blocks. Its four voltage banks ease integration with legacy interface levels when replacing retired ASSPs. Since the part remains active in Microchip's catalog and is stocked by multiple distributors (DigiKey, Mouser, Arrow), long-term supply for replacement programs is practical, and FGG-package variants address RoHS-constrained refresh builds.
Empfohlen
Test and Measurement Instrumentation
The A3P400-FG256I serves test and measurement instruments as a timing, triggering, and acquisition control fabric: 231 MHz system performance supports fine-grained trigger generation, while 178 user I/Os connect ADC front ends, relays, and status interfaces. Flash-based instant-on logic means the instrument is functional the moment power is applied, improving measurement uptime versus SRAM FPGA designs with configuration delay. The industrial temperature grade suits bench and field instruments alike, and the 256-LBGA footprint simplifies four-layer and six-layer board routing for bank-separated analog and digital I/O domains. Designers typically pair the FPGA with precision analog front-end ICs and low-noise LDO supplies.
Empfohlen
Medical Device Control Electronics
The A3P400-FG256I fits medical device control electronics where deterministic, instant-on logic is needed for safety interlocks, sensor timing, and display-driving interfaces. The flash fabric eliminates configuration-state ambiguity at power-up, an advantage for devices with defined safety states, and flash locking protects proprietary control algorithms from extraction. Its -40C to +100C industrial rating covers sterilization-adjacent and transport extremes, while 178 I/Os across four voltage banks interface with mixed-level sensors, lamps, and communication ports in a single device. The 256-LBGA surface-mount package supports compact, board-space-constrained medical enclosures when routed on standard six-layer stackups.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3P400-FG256I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3P400-FG256 | A3P400-1FG256I | A3P400-2FG256I | A3P400-FGG256I | A3P600-FG256I |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (FG256) | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same | 256-BGA (FGG256, Pb-free) - same footprint | 256-LBGA (FG256) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 400000 | 400000 | 400000 | 400000 | 400000 | ~600000 (higher density) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | -40C to +100C (TJ), Industrial | Commercial grade | -40C to +100C (TJ), Industrial | -40C to +100C (TJ), Industrial | -40C to +100C (TJ), Industrial | -40C to +100C (TJ), Industrial |
| Speed Grade | Standard (231 MHz system) | Standard | -1 (faster) | -2 (fastest) | Standard | Standard |
Wichtigste Unterscheidungsmerkmale
- Non-volatile flash, single-chip boot (vs. A3P600-FG256I)
- Industrial temperature without speed-grade premium (vs. A3P400-1FG256I)
- RoHS-flexible footprints (vs. A3P400-FGG256I)
- I/O count advantage over smaller family members (vs. A3P030-QNG48I)
Designhinweise
The A3P400-FG256I requires a 1.5V core supply (VCC) plus separate VCCIBx supplies for each of its four I/O banks. Per Microchip's ProASIC3 migration application note, bank VCCIBx pins are routed through the corresponding banks, so each bank supply should get its own decoupling network close to the balls - typically 10uF bulk plus 0.1uF ceramic per bank. Sequence VCC and VCCIBx per the datasheet power-up specification to avoid I/O latch-up during startup.
The 256-LBGA ball grid requires careful escape routing; a typical fanout uses dog-bone vias on 1.0 mm pitch or via-in-pad on dense boards. Plan a minimum six-layer stackup with dedicated ground planes adjacent to signal layers for impedance control on the I/O banks. Verify the exact ball map against the ProASIC3 family datasheet before routing - pin assignments differ per bank and per voltage standard, and the design software (Libero SoC) will flag bank capacity conflicts during pin assignment.
The device is rated -40C to +100C junction temperature. Estimated: at moderate switching activity a ProASIC3 400K-gate device typically dissipates well under 1W in the 256-LBGA, but I/O-heavy designs driving many banks at 3.3V can add several hundred milliwatts; verify with Microchip's power calculator in Libero. The LBGA relies on board-level thermal relief, so use grounded via arrays under or near the package to spread heat into inner planes.
Do not assign I/O standards across bank boundaries: only electrically compatible voltage standards may share a bank, as stated in Microchip's migration application note. Also note that digchip lists this standard FG package as containing lead and RoHS non-compliant - for RoHS-constrained builds select the FGG lead-free variant early, since package suffix affects compliance documentation but not the ball footprint.
Compliance-Informationen
Per digchip specification listing: 'Lead Free Status: Contains Lead; RoHS Status: RoHS Non-Compliant' for the standard FG package. The FGG package variant provides a Pb-free option in the same footprint. Confirm official material declarations on the Microchip product page.