A3PE3000-1FGG896I - ProASIC3E Flash FPGA 3M Gates | Microchip
Teilenummer: A3PE3000-1FGG896I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $295 | $295,00 |
| 10 | $278 | $2.780,00 |
| 100 | $255 | $25.500,00 |
| 500 | $236 | $118.000,00 |
| 1.000 | $219 | $219.000,00 |
A3PE3000-1FGG896I Übersicht
A flash-based FPGA is a field-programmable gate array whose configuration data is stored in on-chip flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, the A3PE3000-1FGG896I sits in the high-density tier of the ProASIC3E family, which belongs to the broader class of nonvolatile FPGAs and programmable system-on-chip platforms. Because the configuration is retained in flash, the device powers up instantly as a single-chip solution with no external boot device.
Key differentiating features include low total cost of ownership through single-chip integration, reprogrammability in-system, support for high-performance system-level designs, and abundant advanced features beyond the earlier ProASICPLUS generation. The 620 I/O count and 516 Kbit RAM make it suited to wide-bus interfaces and data buffering.
Architecturally, the device is built on a 130 nm CMOS flash process with a sea-of-modules fabric, distributed SRAM/FIFO blocks, and flexible I/O banking. The -1 speed grade supports core toggling rates up to 272 MHz, sufficient for pipelined DSP datapaths, protocol engines, and glueless processor interfacing.
Typical applications include industrial automation controllers, communications and networking line cards, medical instrumentation, aerospace/defense systems requiring single-chip instant-on logic, and test equipment where 620 I/Os terminate backplanes and sensor arrays.
A key design consideration: flash FPGAs trade some raw fabric speed versus the fastest SRAM FPGAs, so verify timing closure at 272 MHz with Microchip Libero SoC before committing the PCB. Plan power distribution for the 1.5 V core rail across the 896-ball array.
This page synthesizes distributor pricing, same-footprint drop-in speed-grade and low-power alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3PE3000-1FGG896I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3PE3000-1FGG896I (gleiche Bauform und Footprint) – abweichend in Package, Family, Process Technology, Operating Temperature, Configuration Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3PE3000-2FGG896I
✅ Drop-In✓ Auf Lager
$1482.9 / Stück
Datenblatt ansehen →A3PE3000-FGG896I
✅ Drop-In✓ Auf Lager
$135.2 / Stück
Datenblatt ansehen →A3PE3000-FGG896
✅ Drop-In✓ Auf Lager
$340 / Stück
Datenblatt ansehen →A3PE3000L-1FGG896I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE3000L-FGG896I
✅ Drop-In✓ Auf Lager
$139.9 / Stück
Datenblatt ansehen →A3PE3000L-FGG896M
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE3000-2FGG896
✅ Drop-In✓ Auf Lager
$128 / Stück
Datenblatt ansehen →A3PE3000-1FGG896I Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3E Flash FPGA |
| System Gates | 3,000,000 |
| Logic Cells | 75,264 |
| Total RAM Bits | 516,096 |
| User I/O | 620 |
| Maximum Operating Frequency | 272 MHz |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Speed Grade | -1 |
| Process Technology | 130 nm CMOS flash |
| Configuration Memory | On-chip flash (nonvolatile, single chip) |
| Gehäuse | 896-Ball FBGA (FGG896), square, ball grid array |
| Montageart | Surface Mount |
| Temperature Grade | Industrial (I suffix) |
| Terminal Form | Ball |
| Terminal Count | 896 |
| RoHS-Status | Compliant |
A3PE3000-1FGG896I 896-ball fbga (fgg896), square, ball grid array Pinbelegungsleitfaden
Pinbelegung für A3PE3000-1FGG896I (896-ball fbga (fgg896), square, ball grid array-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3PE3000-1FGG896I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3PE3000-1FGG896I ist geeignet für 6 Anwendungs: Industrial Automation Controllers, Communications and Networking Line Cards, Medical Instrumentation, Aerospace and Defense Systems, Test and Measurement Equipment, High-Density Data Acquisition Systems.
Industrial Automation Controllers
The A3PE3000-1FGG896I fits industrial automation controllers because its 620 user I/Os terminate the wide parallel buses typical of PLC backplanes, motor-control cards, and machine-vision interfaces, while its 75,264 logic cells implement multiple deterministic state machines and protocol bridges in one fabric. As a flash FPGA it is instantly operational at power-up with no configuration device, reducing boot time in equipment that must respond within milliseconds of line power application. Industrial rating (-40C-class industrial grade) suits factory-floor thermal profiles. Place it between sensor/actuator banks and a host CPU, with the 516,096-bit RAM used as line-rate FIFO buffering; the nonvolatile fabric eliminates the configuration-corruption failure mode that SRAM FPGAs can exhibit in electrically noisy industrial environments.
Empfohlen
Communications and Networking Line Cards
Networking line cards benefit from the A3PE3000-1FGG896I's combination of 620 I/Os for PHY, backplane, and framing interfaces plus up to 272 MHz fabric performance for pipeline stages such as packet parsing, queueing, and traffic shaping. The 516,096 bits of embedded RAM implement deep FIFOs and descriptor rings between MAC and switch fabric, while distributed registers handle per-port statistics. Its flash configuration provides instant-on link bring-up, important in redundant systems where a card must rejoin a ring quickly after replacement. Designers should partition the 620 I/Os across banks according to each interface standard early in layout, since bank voltage assignments in the FGG896 package constrain which signals can share a bank; Libero SoC's I/O constraint flow verifies bank legality before PCB routing is committed.
Empfohlen
Medical Instrumentation
Medical imaging and diagnostic equipment use the A3PE3000-1FGG896I to glue together high-channel-count front ends: its 620 I/Os connect large detector arrays and ADC banks, and 3M gates implement per-channel calibration, filtering, and triggering logic. The single-chip flash architecture shortens system power-up sequence - valuable in devices that must be ready quickly between patient examinations - and its nonvolatile configuration supports design IP protection. Industrial-grade temperature screening supports the controlled thermal environments of clinical hardware. Designers typically use the embedded RAM as acquisition buffers feeding a host processor over a parallel or PCIe-bridged interface; because medical platforms have long service lives, the ProASIC3E family's stable, actively supported lifecycle status makes it a defensible long-term component choice for regulatory documentation.
Empfohlen
Aerospace and Defense Systems
The ProASIC3E flash family is a proven choice in aerospace and defense payloads, avionics boxes, and secure communications equipment where the A3PE3000-1FGG896I's instant-on, single-chip operation removes external configuration memory from the bill of materials - reducing parts count, cost of ownership, and an attack surface associated with bitstream interception during boot. The 3M-gate fabric and 516 Kbit RAM implement sensor interfaces, bus bridges (MIL-STD-class and ARINC-class protocol cores available in the Microchip ecosystem), and data formatting at up to 272 MHz. Industrial-grade screening suits many defense commercial-off-the-shelf programs. Layout planning must account for the 896-ball array's supply and ground ball pattern to keep simultaneous-switching noise within budget when many of the 620 I/Os toggle together on wide parallel buses.
Empfohlen
Test and Measurement Equipment
Bench and automated test instruments exploit the A3PE3000-1FGG896I's wide 620-I/O fabric to drive and capture multi-channel digital patterns, implement timing generators at up to 272 MHz, and buffer acquired data in its 516,096-bit RAM. Reprogrammability lets one hardware platform be reconfigured per test application in the field, an advantage of flash FPGAs over masked ASICs and a reason ProASIC3E is common in modular test architectures. Instant-on configuration means channels are active immediately at instrument power-up. Designers should allocate the fastest I/O banks to timing-critical pattern pins and use Libero timing simulation to verify channel skew at -1 grade; if pattern rates exceed the -1 timing budget, the pin-compatible -2 speed grade (A3PE3000-2FGG896I) drops onto the same board without redesign.
Empfohlen
High-Density Data Acquisition Systems
Large data-acquisition systems - seismology arrays, industrial recorders, and physics instrumentation - use the A3PE3000-1FGG896I as a frontend concentrator: dozens of ADC channels aggregate through its 620 I/Os, and its 3M gates perform decimation, gain/offset correction, and packetization before streaming to host storage. The 516,096-bit embedded RAM provides per-channel elastic buffering that absorbs bursts without external SRAM, and the nonvolatile fabric boots the acquisition logic instantly so no data window is lost at system start. Because the device integrates configuration memory on-chip, the BOM avoids an external flash part whose failure would otherwise be a single point of acquisition loss. Budget core current for continuous high-toggle-rate operation using Microchip power estimation, and provision the 1.5 V core rail (1.425-1.575 V) with adequate decoupling across the 896-ball array.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3PE3000-1FGG896I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3PE3000-2FGG896I | A3PE3000-FGG896I | A3PE3000L-1FGG896I | A3PE3000L-FGG896M |
|---|---|---|---|---|---|
| Package | 896-Ball FBGA (FGG896) | 896-Ball FBGA (FGG896) - same | 896-Ball FBGA (FGG896) - same | 896-Ball FBGA (FGG896) - same | 896-Ball FBGA (FGG896) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | 75,264 | 75,264 | 75,264 | 75,264 |
| User I/O | 620 | 620 | 620 | 620 | 620 |
| Total RAM Bits | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 |
| Speed Grade | -1 | -2 (faster) | standard | -1 (low-power) | standard (low-power, M grade) |
| Static Power | Standard ProASIC3E | Standard ProASIC3E | Standard ProASIC3E | Reduced (L low-power variant) | Reduced (L low-power variant) |
| Temperature Grade | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) | M grade |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
Wichtigste Unterscheidungsmerkmale
- Guaranteed -1 timing at lowest cost among same-die variants (vs. A3PE3000-2FGG896I)
- Standard-power fabric for maximum toggle-rate headroom (vs. A3PE3000L-1FGG896I)
- Industrial temperature screening (vs. A3PE3000-2FGG896)
Designhinweise
The 1.5 V core rail (1.425-1.575 V allowed range) must be regulated tightly; dynamic core current in a 3M-gate fabric scales with toggle activity, so run Microchip's power estimation tool with your post-place-and-route netlist rather than relying on rule-of-thumb figures. Decouple the 896-ball array's VCore/VSupply balls with a distributed network of bulk plus 0.1 uF ceramics placed under the BGA via fanout. Allocate I/O bank voltages per standard early - bank assignment constrains which signals can share a bank.
The FGG896 is a fine-pitch 896-ball BGA requiring controlled-impedance multilayer PCB with via-in-pad or dog-bone escape routing; follow the datasheet land-pattern and ballout tables exactly. Plan signal integrity on high-speed I/O standards with length matching for source-synchronous buses, and reference each bank's signals to its assigned bank supply plane. Reserve the ability to populate -1, -2, or L variants (all same footprint) by keeping the bitstream regenerable in Libero SoC for any of them.
Do not assume the full 620 I/Os are available simultaneously: per the ProASIC3E datasheet, each used differential I/O pair reduces the available single-ended I/O count by two, and the use of certain I/O standards is limited on A3PE3000 devices. Verify I/O budget after choosing differential standards. Also remember the -1 speed grade supports up to 272 MHz-class operation, but timing closure depends on your specific design - run static timing analysis in Libero SoC and step to the pin-compatible -2 grade only if needed.
Compliance-Informationen
OnlineComponents.com lists this part as RoHS. REACH, halogen-free, and conflict-minerals status not stated in provided data.
