A3PE3000-FGG896 - ProASIC3E 3M-Gate Flash FPGA 896-BGA | Microchip
Teilenummer: A3PE3000-FGG896 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $485 | $485,00 |
| 10 | $445 | $4.450,00 |
| 100 | $405 | $40.500,00 |
| 500 | $372 | $186.000,00 |
| 1.000 | $340 | $340.000,00 |
A3PE3000-FGG896 Übersicht
A flash-based FPGA is a field-programmable gate array whose configuration data is stored in on-chip flash memory cells rather than volatile SRAM. Unlike SRAM FPGAs, flash FPGAs retain their configuration through power cycles without an external configuration PROM, reducing bill-of-materials cost and improving system boot security. Within the power-management hierarchy of programmable logic devices, the FPGA sits above CPLDs and below full ASIC implementations, and the ProASIC3E family was positioned by Actel (now Microchip Technology) specifically as a cost-effective ASIC replacement for high-volume applications.
Key differentiating features of the A3PE3000 include single-chip operation with no external boot device, reprogrammability with live-at-power-up behavior, low total cost of ownership, and abundant embedded block resources. The ProASIC3E fabric is built on a 130nm flash process technology, delivering deterministic, high-performance logic capacity of 35K logic elements with 516096 bits of distributed and block memory for buffering, FIFOs, and data-path functions.
Architecturally, the device combines a sea-of-versatile-modules fabric with embedded flash switches, which supply inherent security benefits because configuration data is non-volatile and cannot be easily read back. This makes the family attractive for avionics, networking, computing, and consumer platforms where IP protection matters. The 620 available I/Os support broad system connectivity within a single 896-ball package.
Typical applications include industrial control systems, wireless and networking communication equipment, ASIC prototyping and low-volume ASIC replacement, and avionics subsystems that require non-volatile, secure configuration storage.
A key design consideration is supply integrity: the 1.5V core rail must be well-regulated and decoupled, and BGA escape routing requires careful fanout planning on high-layer-count PCBs.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3PE3000-FGG896 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3PE3000-FGG896 (gleiche Bauform und Footprint) – abweichend in Package, Family, Configuration Memory, Operating Temperature, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3PE3000-FGG896I
✅ Drop-In✓ Auf Lager
$135.2 / Stück
Datenblatt ansehen →A3PE3000L-FGG896M
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE3000L-FGG896I
✅ Drop-In✓ Auf Lager
$139.9 / Stück
Datenblatt ansehen →A3PE3000L-1FGG896M
✅ Drop-In✓ Auf Lager
$432 / Stück
Datenblatt ansehen →A3PE3000L-1FGG896I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE3000-FGG896 Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3E (Flash FPGA) |
| System Gates | 3000000 |
| Logic Elements | 35000 |
| CLBs | 75264 |
| Total Memory Bits | 516096 |
| User I/O | 620 |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| Configuration Type | Flash (non-volatile, single-chip) |
| Gehäuse | 896-ball FBGA (FGG896) |
| Montageart | Surface Mount |
| Packaging | Tray |
A3PE3000-FGG896 896-ball fbga (fgg896) Pinbelegungsleitfaden
Pinbelegung für A3PE3000-FGG896 (896-ball fbga (fgg896)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3PE3000-FGG896.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3PE3000-FGG896 ist geeignet für 6 Anwendungs: Industrial Control and Automation, Networking and Communications Equipment, Avionics and Defense Subsystems, ASIC Replacement and Prototyping, Computing and Server Board Management, Wireless and RF Baseband Support.
Industrial Control and Automation
The A3PE3000-FGG896 fits industrial control backplanes and automation controllers because its 620 user I/Os handle dense fieldbus, sensor, and actuator interfaces, while 3 million system gates absorb glue logic, PWM engines, and protocol bridges in one device. Flash configuration means the controller is live immediately at power-up with no configuration PROM delay, improving fault-recovery time on factory floors. Placed between power and I/O banks with proper 1.5V core regulation, it consolidates multiple CPLDs and ASSPs; the trade-off is 130nm-class speed, so hard real-time loops above roughly 200 MHz system clock need architectural partitioning rather than raw frequency headroom.
Empfohlen
Networking and Communications Equipment
In switch, router, and wireless infrastructure boards, the A3PE3000-FGG896 serves as system fabric glue logic, interfacing MACs, PHYs, and backplane connectors with its 620 I/Os and 516096 memory bits for packet buffering FIFOs. Its non-volatile flash configuration simplifies power-sequencing design in rack systems where every millisecond of boot time matters, and the 3M-gate capacity implements address decoding, status aggregation, and bridging that would otherwise consume several smaller devices. The 231 MHz system performance supports common line-card housekeeping functions; for deep-packet processing, pair it with dedicated network processors rather than soft cores to stay within timing closure.
Empfohlen
Avionics and Defense Subsystems
Avionics designers choose the A3PE3000-FGG896 because Actel/Microchip flash FPGAs have a long heritage in aerospace platforms where configuration read-back protection and instant-on behavior are required. The single-chip flash architecture eliminates the external configuration stream that could be intercepted or corrupted under radiation or tampering scenarios, and 3 million gates implement sensor aggregation, ARINC-style interface logic, and built-in-test controllers. The 620 I/Os support redundant bus interfaces across an 896-ball FBGA with robust mechanical attachment. Verify the specific temperature and qualification grade ordering code against the program's environmental specification before design freeze.
Empfohlen
ASIC Replacement and Prototyping
The ProASIC3E family was explicitly positioned by Microchip as a cost-effective ASIC replacement for consumer, networking, computing, and avionics markets, and the A3PE3000-FGG896 is the family's largest member. Its 3 million system gates and 75264 CLBs provide enough capacity to prototype mid-size ASIC designs or bridge production gaps while a mask-ROM ASIC is fabricated, and the 516096 memory bits absorb embedded RAM blocks without external SRAM. Because configuration is on-chip flash, prototype boards boot like final ASIC hardware, easing firmware integration. Watch die-level utilization: place-and-route typically targets under 80 percent fabric utilization for reliable timing closure.
Empfohlen
Computing and Server Board Management
Server and storage platform boards use the A3PE3000-FGG896 as a board-management FPGA handling hot-swap control, slot presence detection, voltage monitoring aggregation, and fan control across 620 I/Os. Flash configuration guarantees the management logic is operational before host CPUs release reset, which is essential for power-good sequencing in multi-rail servers. The 516096 memory bits buffer event logs and sensor histories, and the 231 MHz fabric speed easily handles management-bus polling. The low-power A3PE3000L variant is attractive here since management FPGAs run continuously, so static power savings compound across always-on chassis.
Empfohlen
Wireless and RF Baseband Support
Wireless infrastructure and RF equipment leverage the A3PE3000-FGG896 for baseband framing, filter coefficient storage, and RF module sequencing, using the 3M-gate fabric for digital down-conversion helpers and the 620 I/Os to connect multiple transceiver chains. Flash configuration keeps RF calibration state machines available at power-up without boot devices, shortening link-establishment time in repeaters and small-cell hardware. The 516096 memory bits hold lookup tables for gain and frequency compensation. For wideband signal paths, keep high-speed serial interfaces on dedicated transceiver devices and use the FPGA for control and moderate-rate parallel data to respect 130nm timing limits.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3PE3000-FGG896 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3PE3000-FGG896I | A3PE3000L-FGG896M | A3PE3000L-1FGG896I |
|---|---|---|---|---|
| Package | 896-ball FBGA (FGG896) | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA - same |
| Brand | Microchip Technology (Actel) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3000000 | 3000000 | 3000000 | 3000000 |
| Logic Elements | 35000 | 35000 | 35000 | 35000 |
| User I/O | 620 | 620 | 620 | 620 |
| Power Class | Standard ProASIC3E | Standard | Low power (L variant) | Low power (L variant) |
Wichtigste Unterscheidungsmerkmale
- Standard speed grades for maximum timing margin (vs. A3PE3000L-1FGG896I)
- Lower static power option within same footprint (vs. A3PE3000-FGG896I)
- Non-volatile single-chip flash configuration (vs. SRAM FPGAs of similar density)
Designhinweise
The A3PE3000-FGG896 core operates at 1.5V and flash FPGAs draw core current that scales strongly with clock activity and utilization. Estimated: at 75264 CLBs with moderate toggling activity, core current can reach multiple amperes, so size the 1.5V rail regulator and power-plane copper for worst-case static plus dynamic estimates from Microchip's power calculator in Libero SoC. Decouple each VCC core ball group with 0.1uF ceramics plus bulk capacitance near the package. Verify I/O bank voltage grouping before finalizing rail count.
Escape routing a 0.8mm-pitch-class 896-ball FBGA typically requires at least 8-10 PCB layers with via-in-pad or dog-bone fanout. Plan I/O bank assignment early using the datasheet ball map so that high-speed interfaces land on banks with appropriate I/O standards, and reserve escape channels for the 620 user I/Os. Place bulk decoupling capacitors on the underside of the BGA footprint to minimize loop inductance. A daisy-chain JTAG access point must reach all boundary-scan devices for production test.
Although flash configuration removes the external boot PROM, designers frequently still violate power sequencing by enabling I/O bank rails after the core in ways that back-drive pads; follow the ProASIC3E datasheet power-up requirements exactly. Second, timing closure with the 231 MHz family limit requires meeting static timing after place-and-route - do not assume source-synchronous interfaces close at the headline frequency. Third, when substituting low-power L variants, recompile against the correct speed-grade files rather than assuming binary compatibility of the timing report.
Compliance-Informationen
Microchip offers lead-free/RoHS-compliant ordering options for ProASIC3E FGG896 parts, but exact RoHS/REACH status for this ordering code was not stated in the retrieved data; confirm on the Microchip product status page.
