A3PE600-1FG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
Teilenummer: A3PE600-1FG256 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $45.6 | $45,60 |
| 10 | $41.8 | $418,00 |
| 100 | $38.2 | $3.820,00 |
| 500 | $35.4 | $17.700,00 |
| 1.000 | $32.9 | $32.900,00 |
A3PE600-1FG256 Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field after manufacturing. Unlike SRAM-based FPGAs, the ProASIC3E family stores its configuration in on-chip flash, which means it is live-at-power-up (Level 0 support) and requires no external boot configuration device - a true single-chip solution within the broader hierarchy: FPGA -> programmable logic device -> digital IC -> semiconductor.
Key features include flash-based nonvolatile configuration enabling instant-on operation, up to 504 kbits of true dual-port SRAM for on-chip buffering, optional soft ARM support via Cortex-M1 compatible fabric, and reprogrammability without a configuration PROM. The low total cost of ownership (TOC) results from the single-chip, no-boot-device architecture, and system performance reaches 272 MHz on the -1 speed grade.
The architecture uses 130-nm flash-based CMOS with metal interconnect routing. Logic is implemented in VersTile-compatible fabric elements, and embedded true dual-port SRAM blocks support FIFOs and data buffering. Because configuration is stored in flash cells, security is inherently higher than SRAM FPGAs - there is no bitstream to intercept at power-up.
Typical applications include industrial control and automation, communications and networking line cards, aerospace and defense systems requiring instant-on secure boot, and portable instrumentation where a single-chip FPGA reduces board area and BOM count.
A key design consideration: the -1 speed grade limits maximum system frequency to 272 MHz, so verify timing closure with Libero SoC before committing; the FG256 package provides 165 I/Os, versus 616 I/Os max in larger family packages.
This page synthesizes distributor pricing, drop-in same-package alternatives, pinout resources, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3PE600-1FG256 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3PE600-1FG256 (gleiche Bauform und Footprint) – abweichend in Configuration Memory, Package, Process Technology, Reprogrammability, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3PE600-1FG256I
✅ Drop-In✓ Auf Lager
$38.2 / Stück
Datenblatt ansehen →A3PE600-1FGG256
✅ Drop-In✓ Auf Lager
$38.9 / Stück
Datenblatt ansehen →A3PE600-1FGG256I
✅ Drop-In✓ Auf Lager
$33.5 / Stück
Datenblatt ansehen →A3PE600-2FG256
✅ Drop-In✓ Auf Lager
$32.8 / Stück
Datenblatt ansehen →A3PE600-FG256
✅ Drop-In✓ Auf Lager
$33.5 / Stück
Datenblatt ansehen →A3PE600-2FGG256
✅ Drop-In✓ Auf Lager
$33.15 / Stück
Datenblatt ansehen →A3PE600-1FG256 Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3E |
| System Gates | 600000 |
| Configuration Cells | 110592 |
| User I/Os (this package) | 165 |
| Maximum User I/Os (family) | 616 |
| Embedded SRAM | up to 504 kbits True Dual-Port |
| Maximum System Frequency | 272 MHz |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | On-chip Flash, Live-At-Power-Up Level 0 |
| Gehäuse | 256-LBGA / FBGA-256, 1 mm pitch |
| Betriebstemperatur | 0 to 70 C |
| Logic Family | CMOS |
| Soft Processor Support | Optional Soft ARM (Cortex-M1 class) |
| Single-Chip Solution | Yes (no external configuration device) |
| Montageart | Surface Mount |
| Speed Grade | -1 |
A3PE600-1FG256 256-lbga / fbga-256, 1 mm pitch Pinbelegungsleitfaden
Pinbelegung für A3PE600-1FG256 (256-lbga / fbga-256, 1 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3PE600-1FG256.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3PE600-1FG256 ist geeignet für 6 Anwendungs: Industrial Control and Automation, Communications and Networking Line Cards, Aerospace and Defense Secure Boot Systems, Portable and Battery-Powered Instrumentation, Medical Diagnostic Equipment, Video and Display Interface Systems.
Industrial Control and Automation
The A3PE600-1FG256 fits industrial PLC I/O modules, motor control interface logic, and factory automation glue logic because its 600K system gates and 165 user I/Os absorb the mixed combinatorial and sequential logic typical of fieldbus and sensor-aggregation boards. Its flash configuration provides live-at-power-up Level 0 operation, so I/O channels are active the instant 1.5V-core rails stabilize - a benefit in machinery where SRAM FPGA boot delay is unacceptable. Up to 504 kbits of true dual-port SRAM buffer data between clock domains, for example between an EtherCAN or industrial Ethernet MAC and a local microcontroller. Use the commercial 0 to 70 C version in cabinet-mounted equipment or the A3PE600-1FG256I industrial variant for -40 to +100 C factory-floor environments; both occupy the identical FG256 footprint, enabling one PCB design across temperature tiers.
Empfohlen
Communications and Networking Line Cards
Networking line cards need high I/O density, dual-clock-domain buffering, and deterministic power-up - all strengths of the A3PE600-1FG256. The 165 user I/Os in the compact 1 mm-pitch 256-ball FBGA connect PHY devices, backplane connectors, and status LEDs, while the 504 kbit true dual-port SRAM implements FIFOs between the line-side PHY clock domain and the system-side switch fabric domain. The 272 MHz maximum system frequency on the -1 speed grade supports OC-3-class and Gigabit-control pipelines for modest-throughput cards. Because configuration is stored in on-chip flash, the card meets carrier live-at-power-up requirements without a serial boot device, improving availability figures used in carrier SLA calculations. Designs requiring higher throughput should move to the ProASIC3E A3PE1500 or A3PE3000 tiers, which reuse the same Libero SoC toolchain and design methodology.
Empfohlen
Aerospace and Defense Secure Boot Systems
Flash-based ProASIC3E FPGAs are widely deployed in avionics, satellite bus logic, and defense subsystem controllers specifically because the configuration bitstream resides in on-chip flash - there is no external configuration read at power-up that an attacker could intercept. The A3PE600-1FG256 provides 600K system gates for interface bridging, Telemetry encoding, and voting logic, with live-at-power-up Level 0 operation meeting time-critical startup requirements in flight hardware. Designers targeting defense environments should select the A3PE600-1FG256I industrial variant (-40 to +100 C) since the commercial part is rated only 0 to 70 C, and should consult Microchip for qualified screening options where mission profiles demand it. For radiation environments, migrate to the RT-series; the design methodology and Libero SoC toolchain carry over directly.
Empfohlen
Portable and Battery-Powered Instrumentation
Handheld test instruments, portable data loggers, and battery-powered field equipment benefit from the A3PE600-1FG256's single-chip architecture: flash configuration eliminates the external boot PROM, cutting board area and BOM count - important in compact enclosures. The 1.5V core supply aligns with modern low-voltage rails, and the 256-ball 1 mm-pitch FBGA occupies roughly 17 x 17 mm, fitting dense portable PCBs. The 165 user I/Os drive LCD segments, sensor interfaces, and button matrices, while 504 kbits of true dual-port SRAM buffer ADC samples between acquisition and processing clock domains. Because the FPGA is active immediately at power-up, instruments can display status before a host controller completes its own boot. Designers should budget power in standby, since flash FPGAs avoid the repeated reconfiguration energy of SRAM parts in duty-cycled instruments.
Empfohlen
Medical Diagnostic Equipment
Benchtop medical analyzers, imaging acquisition boards, and patient-monitoring front ends use the A3PE600-1FG256 as sensor-interface and timing-controller fabric. The 600K system gates implement ADC framing, filter engines, and interface bridges to a host processor, while 504 kbits of true dual-port SRAM stage sample streams before host DMA transfer. Live-at-power-up flash configuration ensures acquisition hardware initializes deterministically during instrument power-on self-test sequences required by medical device procedures. The 165 user I/Os interface multiple sensor channels plus control peripherals in the compact 256-ball FBGA. Medical OEMs typically select the A3PE600-1FG256I industrial-temperature variant for extended chamber testing headroom, and because Microchip maintains long product lifecycles on the ProASIC3E family, multi-year regulatory-supported production runs remain practical on a stable bill of materials.
Empfohlen
Video and Display Interface Systems
The A3PE600-1FG256 serves as scan-conversion, timing-generation, and bridge logic in industrial displays, legacy video format converters, and signage controllers. The 272 MHz system frequency on the -1 speed grade covers pixel clock requirements for SVGA/XGA-class raster timing, while 165 user I/Os drive RGB parallel video buses, LVDS-serializer control interfaces, and panel backlight controls. The 504 kbit true dual-port SRAM implements line buffers (FIFOs) that absorb pixel-rate differences between the source and display clock domains - a classic use of ProASIC3E embedded memory blocks. Flash-based live-at-power-up operation means displays show content immediately on power application without a boot delay, which matters in digital signage and instrument panels. For HD-resolution designs requiring higher pixel clocks, migrate to A3PE1500-class devices within the same Libero SoC flow.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3PE600-1FG256 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3PE600-1FG256I | A3PE600-1FGG256 | A3PE600-2FG256 | A3PE600-FG256 |
|---|---|---|---|---|---|
| Package | 256-FBGA (FG256, 1 mm pitch) | 256-FBGA - same | 256-FBGA (green) - same | 256-FBGA - same | 256-FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| Speed Grade | -1 (272 MHz) | -1 (272 MHz) | -1 (272 MHz) | -2 (faster) | standard |
| User I/Os | 165 | 165 | 165 | 165 | 165 |
| Configuration Memory | On-chip Flash (Live-At-Power-Up Level 0) | On-chip Flash - same | On-chip Flash - same | On-chip Flash - same | On-chip Flash - same |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Wichtigste Unterscheidungsmerkmale
- Flash-based single-chip configuration (Live-At-Power-Up Level 0) (vs. SRAM-based FPGAs of similar capacity (e.g., Xilinx Spartan-class))
- Compact 165-I/O package for 600K gates (vs. A3PE600-1FG484)
- Secure on-chip bitstream storage (vs. A3PE600-1FG256I (same die) and SRAM FPGA competitors)
- Trade-off: -1 speed grade limits system frequency (vs. A3PE600-2FG256)
Designhinweise
The A3PE600-1FG256 uses a 1.5V core supply on a 130-nm flash-based CMOS process; verify that your power tree sequences core, I/O banks, and auxiliary rails according to the ProASIC3E power-up requirements in the Microsemi datasheet. Because the device is live at power-up (Level 0), rail sequencing faults can leave the fabric in an undefined state - add a supervisor on the 1.5V rail (e.g., a voltage monitor with reset output). Estimate core current by running static and dynamic power analysis in Microchip Libero SoC with your actual design; 600K-gate designs at 272 MHz can draw hundreds of milliamps at the core.
The FG256 package is a 1 mm-pitch, 256-ball BGA. Escape routing on a standard through-via stack requires 0.2 mm vias under pads or dog-bone escapes on an 8-mil trace grid; for 4-6 layer boards, via-in-pad with filled vias is strongly recommended for inner balls. Provide at least two dedicated power/ground ball connections per I/O bank per datasheet package file, and flood adjacent layers for return paths. Download the official package outline and ball map from Microchip - never derive the footprint from third-party aggregator sites.
Do not assume the commercial A3PE600-1FG256 (0 to 70 C) works in industrial enclosures - order the A3PE600-1FG256I (-40 to +100 C) variant, which is pin-identical, before release to production. Another common pitfall is timing sign-off at the 272 MHz headline figure: the -1 grade maximum is a fabric capability, not a guarantee for dense designs. Run static timing analysis on your routed netlist in Libero SoC and add 10-15% margin. Finally, since configuration is on-chip flash, no external PROM is needed - removing a legacy boot device from the BOM is safe but must be reflected in programming fixtures.
Compliance-Informationen
Compliance data was not present in the provided web data. The A3PE600-1FGG256 variants are understood to be green/lead-free options per Microchip naming convention - verify on the official Microchip product page. This device is a commercial FPGA, not AEC-Q100 automotive qualified.
