A3PE600-1FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
MPN: A3PE600-1FGG256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $62.5 | $62.50 |
| 10 | $56.25 | $562.50 |
| 100 | $48.75 | $4,875.00 |
| 500 | $43.1 | $21,550.00 |
| 1,000 | $38.9 | $38,900.00 |
Drop-in alternatives for A3PE600-1FGG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE600-1FGG256I
✅ Drop-In✓ In Stock
$33.5 / Unit
View Datasheet →A3PE600-FGG256
✅ Drop-In✓ In Stock
$19.6 / Unit
View Datasheet →A3PE600-FGG256I
✅ Drop-In✓ In Stock
$41.8 / Unit
View Datasheet →A3PE600-2FGG256
✅ Drop-In✓ In Stock
$33.15 / Unit
View Datasheet →A3PE600-2FGG256I
✅ Drop-In📋 Reference alternative (not in catalog)
M1AFS600-1FGG256
✅ Drop-In✓ In Stock
$191.1 / Unit
View Datasheet →M7AFS600-1FGG256
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →A3PE600-1FGG256 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E |
| System Gates | 600000 |
| Logic Elements | 7K LEs |
| User I/O | 165 |
| Registers | 110592 |
| Core Supply Voltage | 1.5 V |
| Maximum System Frequency | 272 MHz |
| Process Technology | 130-nm, 7-layer metal (6 copper) flash-based CMOS |
| Configuration Memory | On-chip flash (single-chip, live-at-power-up) |
| Speed Grade | -1 |
| Operating Temperature | 0 C to +70 C |
| Package | 256-LBGA (FBGA-256, 1 mm ball pitch) |
| Mounting Type | Surface Mount |
| Logic Family | CMOS |
| Embedded Memory (family max) | Up to 504 kbits True Dual-Port SRAM |
| Power-Up Support | Live-At-Power-Up Level 0 |
| Reprogrammability | Yes (flash-based, in-system reprogrammable) |
A3PE600-1FGG256 256-lbga (fbga-256, 1 mm ball pitch) Pin Configuration Guide
Complete pinout information for A3PE600-1FGG256 (256-lbga (fbga-256, 1 mm ball pitch) package) with 256 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE600-1FGG256.
Refer to the datasheet for full pin configuration.
Estimated pin count: 256 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE600-1FGG256 is suitable for 6 applications: Networking and Communications Equipment, Avionics and Defense Subsystems, Industrial Control and Automation, Computing Platforms and Server Backplanes, Consumer Electronics, ASIC Prototyping and Emulation.
Networking and Communications Equipment
The A3PE600-1FGG256 fits switch, router, and backplane control-plane designs where 165 user I/Os bridge multiple bus domains and the flash fabric comes up instantly at power-on - no configuration PROM means line cards meet tight power-on-to-ready windows. Its 272 MHz (-1 grade) system performance handles packet framing, status aggregation, and LED/PHY supervision, while true dual-port SRAM buffers descriptor queues. Because it is single-chip, board BOM cost and sequencing risk drop versus SRAM FPGAs. Use the differential I/O capability for clock pairs, remembering each pair consumes two single-ended I/Os from the 165 available.
Recommended
Avionics and Defense Subsystems
Flash-based configuration gives the A3PE600-1FGG256 inherent immunity to bitstream tampering and single-event configuration upsets that affect SRAM FPGAs, which is why Microchip targets the ProASIC3E family at avionics markets. In mission-computer I/O, sensor-interface, and ARINC-style bus glue logic, the live-at-power-up fabric removes boot sequencing from the safety case, and the single-chip solution reduces board-level parts counts. The 600K system gates absorb protocol bridges and discrete-discrete interfaces; select the A3PE600-1FGG256I industrial variant and consult Microchip for program-specific screening when temperature or quality flow-down applies.
Recommended
Industrial Control and Automation
In PLC I/O modules, motor-control supervisory logic, and machine-vision trigger engines, the A3PE600-1FGG256 consolidates glue logic that previously needed several CPLDs and discrete parts. Its flash configuration survives brown-outs and powers up instantly, so machinery resumes deterministic behavior after faults - no reload from external memory. The 1.5V core keeps dynamic power low in always-on panels, and 165 I/Os interface 24V-buffered logic, encoders, and HMI buses. Designers should hold I/O-bank voltages within datasheet limits and reserve VREF pins per minibank when voltage-referenced standards are used on mixed-voltage boards.
Recommended
Computing Platforms and Server Backplanes
Server and storage backplanes use the A3PE600-1FGG256 as a system-management fabric: it aggregates SMBus/PMBus status, drives FRU EEPROM access, sequences power-supply enables, and implements hot-swap handshake logic. The flash fabric is live before the main CPUs boot, letting the FPGA enforce correct power-up order - a task SRAM FPGAs cannot perform without external boot memory. The 272 MHz class performance covers management-bus Bridging comfortably, and true dual-port SRAM implements small FIFOs between asynchronous clock domains. Footprint compatibility with FG484 variants gives a migration path when channel counts grow.
Recommended
Consumer Electronics
Microchip positions ProASIC3E as a cost-effective ASIC replacement for consumer products, and the A3PE600-1FGG256 fits display timing controllers, interface translation, and feature-bridging roles where ASIC NRE is unjustified. The single-chip flash solution eliminates the configuration flash that inflates BOM cost on consumer boards, and reprogrammability lets one PCB serve multiple SKUs through different programmed images. Low static power suits battery-adjacent and standby-path circuitry. For cost-down production runs, the standard-speed A3PE600-FGG256 variant in the same FBGA-256 footprint drops in without layout changes when timing margin allows.
Recommended
ASIC Prototyping and Emulation
Design teams use the A3PE600-1FGG256 to prototype ASIC control blocks before committing to masks: the 600K-gate fabric absorbs RTL at moderate scale, the flash fabric loads at power-up for bench bring-up, and reprogrammability supports iterative verification. The 1 mm-pitch FBGA-256 keeps the prototype board compact, and footprint compatibility across FG256/FG484 lets a single carrier board host multiple member sizes when the design grows. True dual-port SRAM models embedded memories from the ASIC netlist. Remember that each differential pair consumes two of the 165 single-ended I/Os, so plan pin multiplexing for probe access early.
Recommended
Recommended Products Summary
Engineering reference data for A3PE600-1FGG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE600-1FGG256I | A3PE600-FGG256 | A3PE600-2FGG256 | M1AFS600-1FGG256 |
|---|---|---|---|---|---|
| Package | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) - same | 256-LBGA (FBGA-256) - same | 256-LBGA (FBGA-256) - same | 256-LBGA (FBGA-256) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600K-class (Fusion) |
| User I/O | 165 | 165 | 165 | 165 | [DATA_NEEDED] |
| Speed Grade / Max Frequency | -1 / 272 MHz class | -1 / 272 MHz class | Standard (slower than -1) | -2 (faster than -1) | -1 (Fusion family) |
| Operating Temperature | 0 C to +70 C | -40 C to +85 C | 0 C to +70 C | 0 C to +70 C | [DATA_NEEDED] |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V core (plus analog supplies) |
| Configuration Memory | On-chip flash (single-chip) | On-chip flash | On-chip flash | On-chip flash | On-chip flash (Fusion) |
| Extra Features | None (pure fabric) | None | None | None | Analog peripherals: ADC, eRAM, RTC |
Key Differentiators
- Instant-on flash configuration - no boot PROM (vs SRAM-based competitor FPGAs (Xilinx/Intel equivalents))
- Footprint migration path within same package (vs A3PE600-1FGG484 family members)
- Trade-off: lower fabric performance than SRAM FPGAs (vs A3PE600-2FGG256)
Design Notes
The A3PE600-1FGG256 core runs from 1.5V while I/O banks take separate rails (supporting multiple standards). Because the flash fabric is live-at-power-up, all rails must respect the datasheet power-up ramp and sequencing requirements - avoid uncontrolled rail contention during hot-socket or staged power events. Decouple each supply pin pair with at least 0.1 uF ceramic capacitors placed within 2 mm of the ball via, plus bulk 10 uF per rail. Verify actual core current with your design in Libero power analysis; 130-nm flash fabric has low static current but switching current scales with clock activity.
The 1 mm-pitch FBGA-256 requires a controlled-impedance stackup and via-in-pad or dog-bone escape patterns; plan at least one buried via layer for inner-row ball escapes. FG256 and FG484 are footprint-compatible per the datasheet, so a carrier layout that anticipates FG484 enables future density migration. Keep configuration and JTAG traces short and, in noisy environments, protect TCK with series termination. Reserve a VREF pin per I/O minibank whenever voltage-referenced standards (e.g., SSTL-class) are assigned in that bank.
Two frequently missed datasheet constraints: (1) each used differential I/O pair reduces the single-ended I/O count by two, so a design heavy on LVDS-style pairs can silently exceed the 165-I/O budget - perform I/O budgeting before pin placement; (2) the -1 speed grade tops out around the 272 MHz class, so high-throughput paths may fail timing and require the -2 grade - same footprint, but confirm timing in static analysis, not estimates. Also, the commercial-grade part is rated 0 C to +70 C only; use the "I" industrial variant for extended temperature environments rather than relying on derating.
Compliance Information
Verified web data did not include compliance certificates. Microchip's current production ProASIC3E devices are generally offered in RoHS-compliant packaging - request the material declaration from Microchip or your distributor before ordering.
