ADC101S101CISD - 10-Bit 1MSPS SAR ADC, SPI, 6-WSON | Texas Instruments
Teilenummer: ADC101S101CISD ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.1 | $3,10 |
| 10 | $2.78 | $27,80 |
| 100 | $2.45 | $245,00 |
| 500 | $2.2 | $1.100,00 |
| 1.000 | $1.95 | $1.950,00 |
ADC101S101CISD Übersicht
A successive-approximation-register (SAR) ADC is a type of analog-to-digital converter that performs a binary search through internal capacitive DAC switching. SAR ADCs deliver deterministic latency, excellent linearity at moderate sample rates, and very low pipelining delay compared to delta-sigma or pipeline architectures. As a member of the data-converter IC family, the ADC101S101CISD belongs to the hierarchy of monolithic ADCs -> data converters -> signal chain ICs -> analog & mixed-signal semiconductors.
Key features include 10-bit resolution (no missing codes), 1MSPS maximum sampling rate, single-ended analog input, and a serial SPI-compatible digital interface. The converter achieves low power consumption suitable for battery-powered instruments and is fully specified over -40C to +85C (industrial) operation. Its 6-WSON (2.2x2.5 mm) package occupies roughly 5.5 mm squared of PCB area, making it one of the smallest SAR ADCs in TI's catalog. The architecture uses an internal S/H front-end and a supply-referenced reference, eliminating the need for an external reference IC in many systems.
Typical applications include portable data loggers, low-power sensor monitoring nodes, and compact industrial instrumentation modules. The device is specified across the full 500kSPS to 1MSPS range so engineers can trade throughput for power dissipation without changing the part. The simple SPI interface simplifies connection to virtually any microcontroller without requiring an external bus controller.
When designing with this part, ensure the host MCU provides a clock rate within the device's supported range and that ground plane stitching keeps the noisy digital ground return separated from the analog input return. The NGF (WSON-6) package requires careful PCB land pattern design for reliable solder joint integrity.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not found in the manufacturer datasheet, giving engineers a single source for sourcing and selecting this SAR ADC.
Drop-in-Alternativen für ADC101S101CISD – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ADC101S101CISD (gleiche Bauform und Footprint) – abweichend in Package, Resolution, Digital Interface, Architecture, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ADC101S101CISD/NOPB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ADC101S021CISDX/NOPB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ADC121S101CISD
✅ Drop-In✓ Auf Lager
$1.85 / Stück
Datenblatt ansehen →ADC081S051CISD
✅ Drop-In✓ Auf Lager
$1.85 / Stück
Datenblatt ansehen →ADC081S021CISD
✅ Drop-In✓ Auf Lager
$0.65 / Stück
Datenblatt ansehen →ADC101S021CIMFX
✅ Drop-In✓ Auf Lager
$1.4 / Stück
Datenblatt ansehen →ADC101S101CISD Grenzwerte & elektrische Eigenschaften
| Auflösung | 10 bit |
| Number of Channels | 1 |
| Abtastrate | 0.5 to 1 MSPS |
| Architecture | SAR (Successive Approximation) |
| Input Type | Single-Ended |
| Data Interface | SPI / QSPI / MICROWIRE compatible |
| Reference Type | Supply-referenced |
| Eingangsspannungsbereich | 0 V to VDD (0 V to 5.25 V) |
| Package / Pin Count | 6-WSON (NGF), 2.2 x 2.5 mm |
| Betriebstemperatur | -40 C to +85 C |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Automotive Grade (AEC-Q100) | Not qualified |
| Sample/Hold Ratio (S/H:ADC) | 1:1 |
ADC101S101CISD Pin-Konfiguration
| Pin 1 | VDD — Power supply and reference input |
| Pin 2 | GND — Ground (also exposed thermal pad) |
| Pin 3 | AIN — Analog input (single-ended, 0 V to VDD) |
| Pin 4 | CS — Chip select (active low) for SPI interface |
| Pin 5 | DOUT — Serial data output (SPI MISO) |
| Pin 6 | SCLK — Serial clock input |
Typische Anwendungen
ADC101S101CISD ist geeignet für 6 Anwendungs: Portable Battery Data Logger, Industrial Sensor Signal Conditioning, Medical Patient Monitoring (Non-Critical), Automotive Cabin Sensor Module, IoT Wireless Sensor Node, Test & Measurement Handheld Instrument.
Portable Battery Data Logger
The ADC101S101CISD's 1 MSPS throughput and SAR architecture give deterministic conversion latency - each result is available within a single SCLK cycle burst - which is critical for time-stamping sensor events in a portable logger. Its 6-WSON (NGF) footprint occupies only ~5.5 mm^2 of PCB, leaving room for a coin cell, a microcontroller, and a small SPI flash. The supply-referenced reference eliminates an external reference IC, saving both quiescent current and BOM cost. At 500 kSPS in burst mode, the duty-cycled average current is low enough for weeks of operation on a single CR2032 cell. Designers should add a 0.1 uF bypass capacitor adjacent to the VDD pin and route the analog input trace over a continuous ground plane.
Empfohlen
Industrial Sensor Signal Conditioning
For 4-20 mA loop-powered transmitters and bridge sensor front-ends, the ADC101S101CISD offers 10-bit resolution sufficient for monitoring moderate-precision process variables (temperature, pressure, flow). The supply-referenced reference is convenient because the loop supply itself defines the conversion full scale. SAR latency is deterministic, simplifying IEC 61131-2 timing budgets. The -40 C to +85 C industrial temperature range covers most factory environments. Use a low-pass RC on the analog input to limit aliasing and verify the SPI clock stays within the device's specified SCLK range.
Empfohlen
Medical Patient Monitoring (Non-Critical)
In non-life-critical patient monitoring (e.g. wearable pulse oximetry or temperature patches), the ADC101S101CISD samples photodiode or thermistor outputs at up to 1 MSPS. The SPI interface makes it simple to connect to a BLE-enabled microcontroller for wireless telemetry. The 6-WSON package fits inside a fingertip clip or behind a thin adhesive patch. Designers must follow IEC 60601-1 isolation and leakage requirements at the system level; the ADC itself is not a patient-contact component. Add TVS protection on the analog input if the device may be exposed to ESD events.
Empfohlen
Automotive Cabin Sensor Module
While the ADC101S101CISD itself is not AEC-Q100 qualified, it is widely used in non-safety automotive cabin applications such as HVAC zone temperature, seat-occupancy, and humidity sensing nodes. The 6-WSON package survives automotive vibration profiles with proper PCB land pattern design. The SAR ADC's deterministic latency is helpful when synchronizing to the body controller's CAN-FD bus schedule. Designers should still choose an AEC-Q100 alternative such as TI's ADC101S101-Q1 family for safety-relevant subsystems. Always add reverse-battery and load-dump protection on the supply rail.
Empfohlen
IoT Wireless Sensor Node
The ADC101S101CISD pairs naturally with sub-GHz or BLE radios in an IoT sensor node: the MCU wakes, samples a sensor at 1 MSPS through the SPI ADC, then transmits over the radio before returning to deep sleep. The SAR architecture's low duty-cycled current draw is ideal for battery-powered deployments where the node must last 1-5 years on two AA cells. The 10-bit resolution is more than sufficient for soil moisture, ambient light, and air-quality sensors. Use an RTC for scheduled wakeups and include a watchdog timer for unattended deployments.
Empfohlen
Test & Measurement Handheld Instrument
Handheld multimeters and clamp meters frequently use a small 10-bit SAR ADC like the ADC101S101CISD for the secondary measurement channel (e.g., continuity buzzer, diode test, or temperature via a thermocouple amplifier). The 1 MSPS rate is far above what these slow-changing measurements need, but the deterministic latency simplifies firmware scheduling. The 6-WSON package fits inside a small handheld enclosure. Designers should add a low-leakage analog input switch and an input protection network at the probe terminals.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ADC101S101CISD – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ADC101S101CISD/NOPB | ADC101S021CISDX/NOPB | ADC121S101CISD | ADC081S051CISD |
|---|---|---|---|---|---|
| Package | 6-WSON (NGF) | 6-WSON (NGF) - same | 6-WSON (NGF) - same | 6-WSON (NGF) - same | 6-WSON (NGF) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Resolution | 10 bit | 10 bit | 10 bit | 12 bit | 8 bit |
| Max Sample Rate | 1 MSPS | 1 MSPS | 200 kSPS | 1 MSPS | 1 MSPS |
| Architecture | SAR | SAR | SAR | SAR | SAR |
| Data Interface | SPI | SPI | SPI | SPI | SPI |
| Reference Type | Supply-referenced | Supply-referenced | Supply-referenced | Supply-referenced | Supply-referenced |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Lifecycle Status | Obsolete (use NOPB) | Active | Active | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Smallest 10-bit 1 MSPS SAR ADC footprint in TI catalog (vs. ADC121S101CISD)
- Supply-referenced reference eliminates external reference IC (vs. ADC101S021CISDX/NOPB)
- Wide sample-rate specification 0.5 to 1 MSPS (vs. ADC081S051CISD)
Designhinweise
The 6-WSON NGF package exposes the thermal pad on the underside, which doubles as the analog ground reference. Solder the thermal pad to a continuous ground pour with multiple thermal vias to the inner ground plane. A discontinuous or missing ground connection is the most common cause of degraded SNR on this family. Keep the analog input trace short and routed over the same ground pour to minimize ground-loop pickup.
Place a 0.1 uF ceramic bypass capacitor within 2 mm of the VDD pin and a 1 uF bulk capacitor on the supply trace feeding the ADC. The supply-referenced reference architecture means any noise on VDD is injected directly into the conversion - use an LDO rather than a switching regulator for the ADC rail unless extensive filtering is provided. Estimated: at 1 MSPS continuous conversion, supply current scales with sample rate; for battery designs, duty-cycle the conversions.
Route the SPI signals (SCLK, DOUT, CS) on the opposite side of the PCB from the analog input trace, with a ground plane stitch line between them. Avoid running the SCLK trace parallel to the analog input for long distances. Keep CS low only during the conversion read to prevent spurious clocks from corrupting the serial frame. Place a small series resistor (22-33 ohm) near the SCLK source if the trace exceeds 50 mm to dampen reflections.
Do not exceed VDD on the analog input; the device has no internal input clamp and over-voltage can permanently damage the input cell. Ensure the host MCU SPI peripheral supports the device's SCLK range and CPOL/CPHA mode as specified in the datasheet timing table. Do not assume the device remains idle when CS is high - while conversions do not start until CS falls, the SCLK pin should still be held low or static to avoid spurious toggling.
Compliance-Informationen
RoHS compliance applies to the /NOPB variant. The non-NOPB finish may not be RoHS compliant; engineers should specify /NOPB for new designs. AEC-Q100 is not applicable in this family - choose a -Q1 part for automotive safety applications.
