ATSAM3S4CA-CU - 64MHz Cortex-M3 MCU 256KB Flash | Microchip
Teilenummer: ATSAM3S4CA-CU ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.57 | $6,57 |
| 10 | $6.24 | $62,40 |
| 100 | $5.78 | $578,00 |
| 500 | $5.36 | $2.680,00 |
| 1.000 | $4.95 | $4.950,00 |
ATSAM3S4CA-CU Übersicht
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, memory (Flash for program storage and SRAM for data), and peripherals on one die, forming the lowest layer of the embedded processing hierarchy: ARM Cortex-M3 core -> 32-bit MCU -> embedded processor -> semiconductor. MCUs execute dedicated control tasks in everything from consumer appliances to industrial automation, replacing multi-chip solutions with lower cost and power.
Key features of the ATSAM3S4CA-CU include the 64 MHz ARM Cortex-M3 RISC core with Thumb-2 instruction set, 256 KB (256K x 8) of Flash program memory, 48 KB of SRAM, and a wide supply range of 1.62 V to 3.6 V. The device integrates a DMA controller that offloads the CPU for peripheral-to-memory transfers, and it is packaged as a 100-TFBGA (9x9) ball grid array for compact, high-density PCB layouts. Mouser lists it as industrial temperature range with MRL A packing classification.
Technically, the SAM3S family implements the Cortex-M3 pipeline with nested vectored interrupt controller (NVIC), and per the Microchip product page for the related ATSAM3S4C variant, the family is pin-to-pin compatible with the SAM3N4C series, giving designers a migration path between entry-level and feature-rich parts. The core runs from an internal supply domain of roughly 1.08 V to 1.32 V (1.2 V typical regulator output) per published parametric data.
Typical applications include industrial control and factory automation nodes, battery-powered portable instruments leveraging the low-voltage operating range, and consumer appliances requiring 32-bit processing headroom with USB or serial connectivity.
When designing with this device, budget the 256 KB Flash and 48 KB SRAM early: projects that grow past these limits require migration to ATSAM3S8-class devices in the same footprint family.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für ATSAM3S4CA-CU – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAM3S4CA-CU (gleiche Bauform und Footprint) – abweichend in SRAM, Flash Memory, Series, RoHS Status, Core Processor.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ATSAM3S4CA-CUR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ATSAM3S2CA-CU
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.6 / Stück
Datenblatt ansehen →ATSAM3S8CA-CU
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5.25 / Stück
Datenblatt ansehen →ATSAM3A4CA-CU
✅ Drop-In✓ Auf Lager
$5.4 / Stück
Datenblatt ansehen →ATSAM3S4CA-CU Grenzwerte & elektrische Eigenschaften
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Maximum Clock Speed | 64 MHz |
| Flash Memory | 256 KB (256K x 8) |
| SRAM | 48 KB |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Core Supply Voltage | 1.08 V to 1.32 V (1.2 V nominal) |
| Gehäuse | 100-TFBGA (9x9 mm) |
| Montageart | Surface Mount |
| Series | SAM3S |
| Betriebstemperatur | -40C to +85C (Industrial) |
| DMA Controller | Yes |
| Instruction Set | Thumb-2 (RISC) |
| Program Memory Type | Flash |
| Packing Classification | MRL A |
| Life Cycle Stage | ACTIVE |
| Pin-to-Pin Compatible Family | SAM3N4C |
ATSAM3S4CA-CU 100-tfbga (9x9 mm) Pinbelegungsleitfaden
Pinbelegung für ATSAM3S4CA-CU (100-tfbga (9x9 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für ATSAM3S4CA-CU.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
ATSAM3S4CA-CU ist geeignet für 6 Anwendungs: Industrial Control and Automation, Battery-Powered Portable Instruments, Consumer Appliances, Data Acquisition Systems, IoT Sensor Nodes, Medical and Diagnostic Handhelds.
Industrial Control and Automation
The ATSAM3S4CA-CU fits industrial control nodes that need 32-bit processing headroom with deterministic interrupt response. Its 64 MHz ARM Cortex-M3 core with NVIC handles multi-task control loops, while the 256 KB Flash accommodates communication stacks (Modbus, CAN gateways) and 48 KB SRAM buffers process data. The DMA controller offloads serial and ADC transfers, keeping CPU cycles available for the control algorithm, and the -40C to +85C industrial rating covers cabinet-mounted electronics. Running from a standard 3.3 V rail with a 1.62 V to 3.6 V tolerance, it integrates directly into 24 V industrial systems with a simple buck or LDO front end.
Empfohlen
Battery-Powered Portable Instruments
For handheld meters, data loggers, and portable test equipment, the ATSAM3S4CA-CU offers a wide 1.62 V to 3.6 V supply range that tolerates discharging battery packs without a regulator, plus a DMA-driven architecture that lets the CPU sleep while peripherals move data into the 48 KB SRAM. The Thumb-2 instruction set compresses the 256 KB Flash budget, leaving room for OTA-style field updates. The 9x9 mm 100-ball TFBGA keeps PCB area small for compact enclosures, and the industrial temperature range supports outdoor use where consumer-grade parts would fail.
Empfohlen
Consumer Appliances
White goods, small appliances, and HVAC controllers benefit from the ATSAM3S4CA-CU's balance of 32-bit performance and integration. The 64 MHz Cortex-M3 executes user-interface state machines, sensor fusion, and motor-control assist routines concurrently, while 256 KB Flash holds multi-language HMI code and 48 KB SRAM manages display buffers. Per Microchip, the family is pin-to-pin compatible with the SAM3N4C series, so appliance platforms can start on the lower-cost SAM3N and migrate to SAM3S as feature requirements grow without changing the PCB, protecting tooling investment across product tiers.
Empfohlen
Data Acquisition Systems
The ATSAM3S4CA-CU's DMA controller is the key enabler for data-acquisition designs: ADC sample streams are moved to the 48 KB SRAM without CPU intervention, maximizing throughput at 64 MHz and minimizing jitter between samples. The 256 KB Flash supports on-board calibration tables, linearization curves, and local averaging algorithms, while the 3.3 V I/O domain interfaces directly with common external ADC front ends. The compact 9x9 mm TFBGA suits dense multi-channel DAQ cards, and the -40C to +85C range covers harsh monitoring environments.
Empfohlen
IoT Sensor Nodes
Connected sensor endpoints use the ATSAM3S4CA-CU to run protocol stacks alongside sampling firmware: the Cortex-M3 at 64 MHz has headroom for TCP/MQTT-style framing, while the DMA moves UART or SPI transceiver traffic to SRAM efficiently. The low-voltage 1.62 V minimum supply supports coin-cell-adjacent and two-cell designs, and the 256 KB Flash accommodates security routines and future feature expansion. Its pin compatibility with SAM3N devices lets IoT platform vendors qualify one PCB across cost-optimized and feature-rich SKUs, streamlining procurement and firmware maintenance.
Empfohlen
Medical and Diagnostic Handhelds
Portable medical devices such as glucose meters, pulse oximeters, and diagnostic readers require silent, low-noise digital control and long battery life. The ATSAM3S4CA-CU serves these with its efficient 64 MHz Cortex-M3, low-voltage operation down to 1.62 V, and DMA-assisted sampling that keeps the analog measurement path predictable by minimizing CPU wake-ups. The 256 KB Flash holds device calibration data, UI resources, and compliance logging, while the industrial -40C to +85C rating plus BGA solder reliability support sterilization-tolerant and field-deployed instruments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ATSAM3S4CA-CU – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ATSAM3S4CA-CUR | ATSAM3S2CA-CU | ATSAM3S8CA-CU | ATSAM3A4CA-CU |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-ball BGA - same footprint class |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 256 KB | 256 KB | 128 KB (-50%) | 512 KB (+100%) | 256 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.8 V / 2.5 V / 3.3 V domains |
| DMA Controller | Yes | Yes | Yes | Yes | Yes |
| Distinct Feature | Balanced memory, USB device class | Identical; reel packaging | Cost-optimized, smaller Flash | Largest Flash in footprint | Adds CAN controller (SAM3A) |
Wichtigste Unterscheidungsmerkmale
- Largest memory in the same BGA footprint tier (vs. ATSAM3S2CA-CU)
- Identical drop-in continuity for reel assembly (vs. ATSAM3S4CA-CUR)
- Migration path to CAN-capable SAM3A variant (vs. ATSAM3A4CA-CU)
- Honest trade-off: smaller ecosystem than STM32 (vs. STM32F103CBT6)
Designhinweise
Power the ATSAM3S4CA-CU from a 3.3 V rail within its 1.62 V to 3.6 V range; the on-chip regulator generates the 1.08 V to 1.32 V core domain internally, so no external core supply is required. Place 100 nF ceramic decoupling capacitors at each VDDIO/VDDCORE ball pair plus one bulk 10 uF capacitor near the package. Estimated: at 64 MHz full-speed operation from 3.3 V, budget core plus I/O current per the SAM3S datasheet power consumption tables rather than assuming a fixed number - current scales with clock frequency and active peripherals.
The 9x9 mm 100-ball TFBGA uses a fine-pitch ball grid array: design fan-out with 0.5 mm-pitch escape routing and consider via-in-pad or dog-bone fanout on inner rows. Follow Microchip's SAM3S hardware design guidelines: keep the VDDCORE decoupling loop shortest, place the 480-ohm-class RC on the core regulator output exactly as specified in the datasheet, and provide a solid ground plane under the BGA. Verify the landing pattern against the latest IPC-referenced Microchip package drawing before fabrication.
Flash programming budget: 256 KB is shared by code, constants, and bootloader. Plan for a small margin before committing to ATSAM3S4CA-CU; if the application may grow, the pin-compatible ATSAM3S8CA-CU (512 KB) in the same 100-TFBGA footprint is the safe migration path. Also note that the -AU (LQFP) and -MU (QFN) suffixes of the same die are NOT footprint-compatible with the -CU BGA - do not substitute them without a PCB respin.
Compliance-Informationen
Compliance statuses not stated in the provided Verified Web Data; the 'MRL A' packing classification and industrial temperature range are confirmed via Mouser, but RoHS/REACH/lead-free statements must be verified on the official Microchip product compliance page.
