ATSAM3S2CA-CU - 64MHz ARM Cortex-M3 MCU 128KB Flash | Microchip
MPN: ATSAM3S2CA-CU ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.23 | $5.23 |
| 10 | $4.75 | $47.50 |
| 100 | $4.3 | $430.00 |
| 500 | $3.95 | $1,975.00 |
| 1,000 | $3.6 | $3,600.00 |
ATSAM3S2CA-CU Overview
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals into one chip, forming the lowest layer of the embedded-system hierarchy above discrete logic and below application processors. The SAM3S family belongs to the ARM Cortex-M3 class of 32-bit MCUs, widely used where deterministic performance, low power, and rich analog/digital peripherals are required at moderate cost.
Key features include the ARM Cortex-M3 core with Thumb-2 instruction set and nested vectored interrupt controller (NVIC), 1.62V to 3.6V single-supply operation, a USB 2.0 full-speed device port, multiple USART/SPI/TWI serial interfaces, a 12-bit ADC, and an internal RC oscillator option set (4/8/12 MHz plus 32 kHz) that can remove the need for an external crystal in cost-sensitive designs.
Architecturally, the device integrates a multi-layer bus matrix and peripheral DMA channels, allowing peripherals such as the ADC and USARTs to transfer data without CPU intervention. The flash accelerator keeps effective execution close to the 64 MHz core speed, while power management controllers with multiple sleep and wait modes support battery-operated designs.
Typical applications include industrial control panels, consumer appliances, data-logging and sensor-gateway products, and USB-connected portable equipment where the full-speed USB device controller and generous USART count (up to 7 UART-class ports) simplify connectivity.
Design consideration: the TFBGA (9x9) ball-grid package demands controlled-impedance multilayer PCB layout and reflow assembly; teams requiring hand soldering or simpler inspection should evaluate the pin-compatible LQFP counterpart within the SAM3S family before committing to the BGA footprint.
This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing, drop-in same-package alternatives across the SAM3S flash-density ladder, and practical design notes for BGA layout and power-supply decoupling.
Drop-in alternatives for ATSAM3S2CA-CU — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM3S2CA-CU (same form factor and footprint) — differing in SRAM, Flash Memory, Core Processor, Package, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAM3S1CA-CU
✅ Drop-In✓ In Stock
$3.05 / Unit
View Datasheet →ATSAM3S4CA-CU
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$4.95 / Unit
View Datasheet →ATSAM3S8CA-CU
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$5.25 / Unit
View Datasheet →ATSAM3SD8CA-CU
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2.41 / Unit
View Datasheet →ATSAM3S2CA-CU Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-bit |
| Maximum Clock Speed | 64 MHz |
| Flash Memory | 128 KB (128K x 8) |
| SRAM | 32 KB (32K x 8) |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Package | 100-TFBGA (9x9 mm) |
| Pin/Ball Count | 100 |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40C to +85C (Industrial) |
| UART/USART Count | 7 |
| SPI Count | 4 |
| I2C (TWI) Count | 3 |
| USB | USB 2.0 Full-Speed Device |
| Internal Oscillator | 4/8/12 MHz RC + 32 kHz RC |
| Crypto Engine | No |
ATSAM3S2CA-CU 100-tfbga (9x9 mm) Pin Configuration Guide
Pin configuration for ATSAM3S2CA-CU (100-tfbga (9x9 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM3S2CA-CU.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM3S2CA-CU is suitable for 6 applications: Industrial Control Panels, USB Data Loggers and Gateways, Consumer Appliance Control, Sensor Network Nodes, Motor Control Interface Boards, Test and Measurement Accessories.
Industrial Control Panels
The ATSAM3S2CA-CU fits industrial HMI and control-panel controllers because its seven UART-class ports, four SPI and three I2C interfaces connect PLC front-ends, touch controllers, and field displays simultaneously on one 64 MHz Cortex-M3 core. The 128 KB flash accommodates a state-machine application plus a Modbus or custom protocol stack, while 32 KB SRAM buffers communication frames. Operating from 1.62V to 3.6V, it runs directly from a 3.3V industrial rail, and the industrial -40C to +85C rating covers cabinet environments. Peripheral DMA offloads serial transfers so the CPU can dedicate cycles to control loops, and the TFBGA-100's dense 9x9 mm footprint conserves PCB area in modular panel controllers.
Recommended
USB Data Loggers and Gateways
Data-logging products benefit from the ATSAM3S2CA-CU's integrated USB 2.0 full-speed device controller, which enumerates as CDC or MSC without an external USB chip, cutting BOM cost. Sensor data captured via the 12-bit ADC or TWI-connected sensors is buffered in 32 KB SRAM and streamed over USB or stored in external SPI flash via one of the four SPI peripherals. The 64 MHz Cortex-M3 with Thumb-2 code density keeps firmware compact within 128 KB flash. Multi-mode power management allows sleep between samples, extending battery life in portable loggers, and the internal RC oscillators enable crystal-less designs where timing accuracy requirements are relaxed.
Recommended
Consumer Appliance Control
Appliance control boards - coffee machines, air-conditioner user interfaces, small kitchen equipment - use the ATSAM3S2CA-CU to drive segment LCDs or serial displays, read capacitive touch via TWI-attached controllers, and manage relays through GPIO with adequate drive configuration. The 9x9 mm TFBGA-100 saves board space in compact appliance PCBs, while the 1.62V-3.6V single-supply range simplifies power design from a mains-derived 3.3V rail. Internal 4/8/12 MHz RC oscillators remove crystal cost in applications with loose timing tolerances. Industrial temperature rating adds margin for near-heat-source mounting, and 128 KB flash holds UI firmware, Unicode font tables, and OTA-updatable logic.
Recommended
Sensor Network Nodes
Wired sensor nodes and gateways leverage the ATSAM3S2CA-CU's seven USARTs and three TWI ports to aggregate multiple sensor streams into a single uplink. The 12-bit ADC samples analog sensors directly, and peripheral DMA moves results to SRAM without CPU wake-ups, reducing average current in sleep-dominated duty cycles. At 64 MHz the Cortex-M3 executes protocol stacks (Modbus RTU, custom framing) with headroom, while 128 KB flash supports in-field firmware updates over the same serial links. The 1.62V-3.6V supply range tolerates long-cable rail droop, and the -40C to +85C industrial rating suits outdoor and rooftop enclosures.
Recommended
Motor Control Interface Boards
As the supervisory controller in motor-driven systems, the ATSAM3S2CA-CU communicates with dedicated motor drivers over SPI or USART, samples current shunts through its 12-bit ADC, and enforces safety interlocks with fast GPIO interrupt response from the Cortex-M3 NVIC. While the SAM3S lacks dedicated motor-control PWM peripherals of the SAM3X/ATSAM4C families, 128 KB flash and 32 KB SRAM comfortably host a supervision state machine, fault logging, and host protocol. The 64 MHz core provides deterministic interrupt latency, and the TFBGA-100's many GPIO support encoder inputs and limit-switch monitoring in compact drive-interface PCBs.
Recommended
Test and Measurement Accessories
USB instrument accessories - calibration adapters, multi-port serial probes, bench data front-ends - use the ATSAM3S2CA-CU because the full-speed USB device port plus abundant UARTs let one MCU bridge a PC application to several targets. Thumb-2 code density and 128 KB flash hold command parsers and DSP-style filtering, while 32 KB SRAM buffers waveform captures from the 12-bit ADC at moderate sample rates. Peripheral DMA sustains continuous streaming to USB without CPU stalls. Operation from a single 3.3V rail drawn over USB bus power keeps accessory hardware simple, and the industrial temperature spec tolerates bench-top thermal variation.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM3S2CA-CU — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM3S1CA-CU | ATSAM3S4CA-CU | ATSAM3S8CA-CU | ATSAM3SD8CA-CU |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Brand | Microchip Technology (Atmel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 128 KB | 64 KB | 256 KB | 512 KB | 512 KB |
| Supply Voltage | 1.62 V - 3.6 V | 1.62 V - 3.6 V | 1.62 V - 3.6 V | 1.62 V - 3.6 V | 1.62 V - 3.6 V |
| USB | Full-Speed Device | Full-Speed Device | Full-Speed Device | Full-Speed Device | Full-Speed Device (high-speed-capable family variant) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Balanced memory density for cost-optimized designs (vs ATSAM3S8CA-CU)
- Headroom against flash ceiling (vs ATSAM3S1CA-CU)
- Integrated full-speed USB device (vs ATSAM3N4BA-MU)
Design Notes
The 9x9 mm TFBGA-100 uses a 0.8 mm ball pitch. Plan a 4-layer minimum stackup with via-in-pad or dog-bone fanout and an unbroken ground plane under the device. Solder-mask-defined pads with non-solder-mask-defined via capture improve assembly yield. BGA assembly requires reflow; budget for X-ray or optical inspection and rework capability before committing to the -CU package instead of the -AU LQFP equivalent.
Supply the VDDIO/VDDCORE rails from a clean 3.3V source within the 1.62V-3.6V range. Place 100 nF ceramic capacitors within 2 mm of each supply ball pair, plus bulk 10 uF near the regulator. Follow Microchip's SAM3S hardware design application note for internal-regulator capacitor requirements on VDDCORE; omitting or misplacing this capacitor is a common cause of brown-out during flash writes.
Do not assume the -CU (TFBGA) and -AU (LQFP) variants are interchangeable: identical silicon, different footprints. Also verify USB full-speed routing with 90-ohm differential impedance and keep the 1.5 kOhm pull-up per USB device spec handled by the on-chip transceiver. When using internal RC oscillators for cost savings, remember flash self-write timing and USB accuracy requirements may still mandate the external crystal.
Compliance Information
Compliance data was not present in the provided verified web data. The -CU suffix generally denotes lead-free/halogen-free processing for Microchip parts, but RoHS/REACH status must be confirmed from the official Microchip product page before release.
