Microchip Technology

ATSAMA5D26B-CN - ARM Cortex-A5 MPU 500MHz | Microchip | 289-LFBGA

Teilenummer: ATSAMA5D26B-CN ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
5 uA Id 289-LFBGA (14x14 mm) Package 500 MHz Speed Yes (MMU) Memory
Ab $13.05 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-20
Mengenpreise
Menge Stückpreis Gesamt
1 $18.95 $18,95
10 $17.42 $174,20
100 $15.88 $1.588,00
250 $14.96 $3.740,00
500 $14.21 $7.105,00
1.000 $13.05 $13.050,00
ℹ️ Alle Preise sind in USD

ATSAMA5D26B-CN Übersicht

The Microchip Technology ATSAMA5D26B-CN is a 32-bit ARM Cortex-A5 microprocessor unit (MPU) running up to 500 MHz, housed in a 289-LFBGA (14x14) package with 0.8 mm ball pitch. It is part of the SAMA5D2 series, featuring single-core Armv7-A architecture with Arm TrustZone, NEON media processing engine, ETM/ETB support, MMU, 32 kbyte L1 instruction cache, 32 kbyte L1 data cache, and 128 kbyte L2 cache configurable as internal SRAM. The device targets low-power, high-integration embedded applications requiring rich multimedia and security capabilities.

An ARM Cortex-A5 MPU (microprocessor unit) is a high-performance applications processor designed to run full operating systems such as Linux, whereas microcontrollers (MCUs) typically run bare-metal or RTOS firmware. Cortex-A5 cores implement the Armv7-A architecture with virtual memory via an MMU, optional NEON SIMD media engine for accelerated audio/video codecs, and TrustZone hardware isolation for secure boot and DRM. Within the broader taxonomy, Cortex-A5 sits between Cortex-A7 and Cortex-M7, offering higher compute density than MCUs while consuming less power than Cortex-A9/A53 designs.

Key features of the ATSAMA5D26B-CN include a 128 kbyte L2 cache, configurable as SRAM; an embedded audio subsystem; multiple memory interfaces supporting DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, and e.MMC Flash; state-of-the-art security with secure boot, secure key storage, and crypto accelerators (AES, SHA, TRNG); an ultra-low-power mode with 5 uA backup consumption; and an integrated FUSE controller for OTP configuration. The 0.8 mm ball pitch simplifies PCB design and reduces layer count.

Typical applications include industrial HMI panels, smart energy gateways, IoT edge nodes, medical patient monitors, automotive infotainment, point-of-sale terminals, and connected appliances where Linux/Android-class application processing is required alongside secure connectivity and rich peripherals (I2C, SPI, USART, QSPI, CAN, HSIC). The simple power management scheme and low-power architecture extend battery life in portable products. The -CN suffix indicates the industrial temperature grade (-40C to +85C) packaged in LFBGA.

When designing with this device, allocate PCB area for the 14x14 mm LFBGA footprint with appropriate microvia stack-up, ensure DDR routing is length-matched within the JEDEC specification, and budget for an external power management IC (PMIC) to supply the multiple voltage rails. The 0.8 mm ball pitch allows use of standard 4-layer PCB processes with laser-drilled microvias.

This page synthesizes distributor pricing, drop-in alternatives from the SAMA5D2 family, and practical design notes not consolidated in the manufacturer datasheet.

Drop-in-Alternativen für ATSAMA5D26B-CN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAMA5D26B-CN (gleiche Bauform und Footprint) – abweichend in Package, Ethernet, USB, Core Architecture, CAN.

Microchip Technology
Package: 196-ball TFBGA (10x10 mm)
Ethernet: 10/100 Mbps MAC (1 port)
USB: USB 2.0 + HSIC
Vergleichen mit ATSAMA5D26B-CN →
Microchip Technology
Package: 256-TFBGA (8x8 mm, 0.4 mm pitch)
Ethernet: 1x 10/100 Mbps GMAC
USB: USB 2.0 High-Speed Host + Device (with PHY)
Vergleichen mit ATSAMA5D26B-CN →
Microchip Technology
Ethernet: 2x 10/100/1000 GMAC
USB: USB 2.0 Host + Device with PHY
Core Architecture: ARM Cortex-A5 (32-bit)
Vergleichen mit ATSAMA5D26B-CN →
Microchip Technology
Package: 289-LFBGA, 14x14 mm, 0.8 mm pitch
Ethernet: 2x 10/100 Mbps EMAC (GMII/RGMII/MII)
USB: 2x USB 2.0 High-Speed Host + 1x USB 2.0 Device/Host
Vergleichen mit ATSAMA5D26B-CN →
Microchip Technology
Package: 289-LFBGA (14x14x1.4 mm)
Ethernet: 2x EMAC with IEEE 1588 (10/100 Mbps)
USB: USB 2.0 High-Speed Host and Device
Vergleichen mit ATSAMA5D26B-CN →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

ATSAMA5D26B-CNR

✅ Drop-In
Microchip Technology
📦 289-LFBGA (14x14)
Arm Cortex-A5 (Armv7-A) with NEON and FPU · 500 MHz · 1 · 128 KB · DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, e.MMC, NAND · 289-LFBGA (14x14x1.4 mm) · 0.8 mm · 2D LCD controller, up to 2048x2048

✓ Auf Lager

$9.1 / Stück

Datenblatt ansehen →

ATSAMA5D26A-CUR

✅ Drop-In
Microchip Technology
📦 289-LFBGA (14x14)
ARM Cortex-A5 (ARMv7-A) · 500 MHz · 1 · 32-bit · 128 KB · 160 KB · 32 KB · 32 KB

✓ Auf Lager

$14.2 / Stück

Datenblatt ansehen →

ATSAMA5D26A-CN

✅ Drop-In
Microchip Technology
📦 289-LFBGA (14x14)
SAMA5D2 · ARM Cortex-A5 (32-bit) · 500 MHz · 1 · 128 KB · DDR2, DDR3L, LPDDR2, LPDDR3 · 289-LFBGA (14x14 mm) · 289

✓ Auf Lager

$15.2 / Stück

Datenblatt ansehen →

ATSAMA5D24B-CU

✅ Drop-In
Microchip Technology
📦 289-LFBGA (14x14)
ARM Cortex-A5 (ARMv7-A) · 500 MHz · 1 · 128 KB · 160 KB (secure boot) · 16-bit DDR2/LPDDR/LPDDR2/DDR3 (LV-DDR3) · 1.2 V · 3.3 V

✓ Auf Lager

$10.42 / Stück

Datenblatt ansehen →

ATSAMA5D22A-CN

✅ Drop-In
Microchip Technology
📦 289-LFBGA (14x14)
ARM Cortex-A5 (32-bit) · 500 MHz · 32 KB I-cache, 32 KB D-cache · 128 KB · 16-bit DDR3/DDR3L/LPDDR2/LPDDR3 · 160 KB boot ROM · 2D (GC320) · Yes, up to WXGA

✓ Auf Lager

$9.95 / Stück

Datenblatt ansehen →

ATSAMA5D26B-CN Grenzwerte & elektrische Eigenschaften

Core Architecture ARM Cortex-A5 (Armv7-A)
Number of Cores 1
Maximale Taktfrequenz 500 MHz
L1 Instruction Cache 32 kbyte
L1 Data Cache 32 kbyte
L2 Cache 128 kbyte (configurable as SRAM)
Memory Management Unit Yes (MMU)
NEON Media Processing Engine Yes
Arm TrustZone Yes
ETM/ETB Support Yes
DDR Memory Interface DDR2, DDR3L, LPDDR2, LPDDR3
Flash Memory Interface QSPI, e.MMC
Backup Mode Current 5 uA
Security Features Secure boot, AES, SHA, TRNG, tamper pins
Peripheral Interfaces I2C, SPI, USART, UART, QSPI, CAN, HSIC, SMC
Embedded Audio Subsystem Yes
Gehäuse 289-LFBGA (14x14 mm)
Ball Pitch 0.8 mm
Betriebstemperaturbereich -40C to +85C (industrial, -CN grade)
Montageart Surface Mount
RoHS-Status Compliant

ATSAMA5D26B-CN 289-lfbga (14x14 mm) Pinbelegungsleitfaden

Pinbelegung für ATSAMA5D26B-CN (289-lfbga (14x14 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für ATSAMA5D26B-CN im 289-lfbga (14x14 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für ATSAMA5D26B-CN.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

ATSAMA5D26B-CN ist geeignet für 8 Anwendungs: Industrial IoT Gateway, Human-Machine Interface (HMI) Panels, Medical Patient Monitoring, Smart Energy Meter and Gateway, Automotive Infotainment Head Unit, Point-of-Sale (POS) Terminal, Connected Appliance Controller, Building Automation Controller.

🏭

Industrial IoT Gateway

The ATSAMA5D26B-CN is well-suited for industrial IoT gateways that aggregate sensor data from Modbus, CAN, and Ethernet fieldbus networks and forward it to cloud platforms over MQTT or CoAP. Its 500 MHz Cortex-A5 core runs embedded Linux with sufficient headroom for protocol translation, TLS termination, and edge analytics. The integrated AES/SHA/TRNG crypto accelerators enable hardware root-of-trust and encrypted TLS sessions without taxing the CPU. DDR3L support provides high-bandwidth memory for buffering burst sensor traffic, while the 5 uA backup current preserves battery life during sleep cycles. The industrial -40C to +85C temperature grade ensures reliable operation in unconditioned factory cabinets. Microchip's MPU Linux4SAM distribution provides long-term kernel and security patch support. Compared to Cortex-M MCUs, the ATSAMA5D26B-CN handles TCP/IP stacks and TLS handshakes in software without external radios.

📺

Human-Machine Interface (HMI) Panels

The ATSAMA5D26B-CN drives industrial HMI panels with capacitive touchscreens, RGB or LVDS displays, and real-time graphical user interfaces running Qt or Web-based frontends. The Cortex-A5 NEON engine accelerates JPEG/PNG decode and 2D graphics composition, while the integrated LCD controller supports displays up to WXGA resolution with parallel RGB or LVDS output. The MMU enables full Linux with hardware-accelerated 2D graphics libraries. Designers can use the SAME70 or SAMA5D2 BSPs from Microchip's repository to accelerate time-to-market. The 128 kbyte L2 cache improves GUI responsiveness under load, and the DDR3L interface feeds the display pipeline at sufficient bandwidth. Compared to lower-end Cortex-M7 designs, the ATSAMA5D26B-CN delivers true WebKit/Chromium rendering performance in a power-efficient envelope.

💊

Medical Patient Monitoring

The ATSAMA5D26B-CN powers portable patient monitors measuring ECG, SpO2, temperature, and respiration with secure data transmission to hospital EMR systems. The Cortex-A5 core runs embedded Linux with deterministic real-time scheduling for vital sign acquisition while the AES hardware accelerator secures HL7 FHIR data exchange. The integrated audio subsystem enables voice prompts and alarm tones. The industrial temperature grade ensures reliable operation near patients and hospital HVAC zones. The 5 uA backup current extends battery life during patient transport. Microchip provides IEC 62304-compliant software artifacts and a documented development process for medical device certification. Compared to non-secure Cortex-A5 alternatives, the ATSAMA5D26B-CN's tamper detection pins protect against physical attacks on patient data at rest.

⚡

Smart Energy Meter and Gateway

The ATSAMA5D26B-CN supports smart electricity, water, and gas meters with PLC, RF mesh, or cellular backhaul. The Cortex-A5 core runs metering firmware plus DLMS/COSEM or wireless M-Bus protocol stacks with hardware AES for encrypted meter readings. The 5 uA backup current extends battery life in gas/water meters to over 10 years. The industrial temperature grade ensures outdoor cabinet reliability from -40C in Nordic winters to +85C in desert enclosures. DDR3L/LPDDR3 support accommodates smart grid aggregators that store interval data for nonvolatile transmission. Microchip's certified DLMS/COSEM library shortens utility meter certification cycles. Compared to Cortex-M0+ alternatives, the ATSAMA5D26B-CN handles DLMS and secure OTA updates with substantial margin.

🚗

Automotive Infotainment Head Unit

The ATSAMA5D26B-CN drives entry-level automotive infotainment head units with radio, media playback, and Bluetooth connectivity. The Cortex-A5 core runs Automotive Grade Linux or QNX with NEON-accelerated audio codecs and the integrated audio subsystem routing to Class-D amplifiers. Hardware AES secures vehicle-to-cloud communication for OTA firmware updates, while TrustZone protects digital rights management for premium audio content. The industrial temperature grade supports automotive cabin environments. Designers can leverage Microchip's MOST and CAN-FD reference designs for body network integration. Compared to entry-level Cortex-M MPUs, the ATSAMA5D26B-CN provides actual touchscreen GUI performance with WebKit/Chromium rendering. Note that the -CN variant is industrial grade; the -CNVAO or automotive-qualified variant is required for AEC-Q100 designs.

🖥️

Point-of-Sale (POS) Terminal

The ATSAMA5D26B-CN powers secure retail POS terminals processing EMV chip card, NFC contactless, and PIN entry transactions. The Cortex-A5 core runs Linux-based payment applications while TrustZone isolates payment keys and the AES/SHA hardware accelerators encrypt transaction data end-to-end. The integrated LCD controller drives operator and customer-facing displays, and the QSPI interface supports fast external flash for transaction logging. PCI PTS certification is achievable using Microchip's reference security architecture and the ATECC608B secure element. The industrial temperature grade supports retail floor and outdoor terminal environments. Compared to discrete secure MCU architectures, the ATSAMA5D26B-CN consolidates application processing and secure element functions into a single BGA package reducing BOM cost and PCB area.

🏭

Connected Appliance Controller

The ATSAMA5D26B-CN drives Wi-Fi-connected home appliances including refrigerators, washing machines, ovens, and HVAC controllers. The Cortex-A5 core runs MQTT/CoAP clients and provider-specific cloud SDKs while the AES hardware accelerator secures cloud credentials and OTA firmware updates. The integrated audio subsystem provides voice prompts and alarm tones, and the LCD controller drives front-panel displays. The 5 uA backup current preserves battery-backed clock and settings during power loss, while the industrial temperature grade ensures reliable operation in kitchen and garage environments. Compared to bare-metal Wi-Fi MCU designs, the ATSAMA5D26B-CN's Linux support simplifies AWS IoT, Azure IoT, and Google Cloud IoT integration with mature TLS libraries and JSON parsers.

🧩

Building Automation Controller

The ATSAMA5D26B-CN powers BACnet, KNX, and LonWorks building automation controllers managing HVAC, lighting, and access control subsystems. The Cortex-A5 core runs BACnet/IP stacks and BACnet Secure Connect with hardware AES for encrypted building network communication. The DDR3L interface supports large point databases and trend logs required for commercial buildings, while the rich peripheral set (CAN, USART, SPI, I2C) interfaces with legacy building subsystems. The industrial temperature grade ensures reliable operation in mechanical rooms and rooftop installations. Microchip's certified BACnet stack accelerates certification for ASHRAE 135 compliance. Compared to lower-power Cortex-M7 designs, the ATSAMA5D26B-CN handles BACnet Secure Connect TLS handshakes with full headroom for building analytics workloads.

Zusammenfassung der empfohlenen Produkte

KSZ8081RNAIA Ethernet PHY for gateway connectivity Verwendet in: Industrial IoT Gateway, Point-of-Sale (POS) Terminal, Building Automation Controller ATECC608B-MAHCZ-T Secure element for cryptographic key storage Verwendet in: Industrial IoT Gateway, Medical Patient Monitoring, Smart Energy Meter and Gateway, Point-of-Sale (POS) Terminal, Connected Appliance Controller, Building Automation Controller MT41K256M16TW-107 Micron Technology Verwendet in: Industrial IoT Gateway ATSAM3X8E-AU Companion touch controller MCU Verwendet in: Human-Machine Interface (HMI) Panels ADV7513BSTZ HDMI transmitter for external displays Verwendet in: Human-Machine Interface (HMI) Panels W25Q256JVSIQ QSPI flash for asset storage Verwendet in: Human-Machine Interface (HMI) Panels MAX30003CTI+ ECG analog front-end Verwendet in: Medical Patient Monitoring MAX30102 SpO2 optical sensor module Verwendet in: Medical Patient Monitoring MCP3911A0-E/SS Multi-channel ADC for power metering Verwendet in: Smart Energy Meter and Gateway RN2483A-I/RM103 LoRaWAN transceiver for long-range backhaul Verwendet in: Smart Energy Meter and Gateway MCP2517FD-H/SL Microchip Technology Verwendet in: Automotive Infotainment Head Unit, Building Automation Controller LAN8742A-CZ-TR Microchip Technology Verwendet in: Automotive Infotainment Head Unit BM62SPKS1MC2-0001AA Bluetooth audio module for infotainment Verwendet in: Automotive Infotainment Head Unit PN7150A0HN/C11002E NFC controller for contactless payments Verwendet in: Point-of-Sale (POS) Terminal ATWINC1500-MR210PB Wi-Fi module for cloud connectivity Verwendet in: Connected Appliance Controller MIC28511-1YFL-TR Buck regulator for power management Verwendet in: Connected Appliance Controller
What is the operating frequency of the ATSAMA5D26B-CN microprocessor?
The ATSAMA5D26B-CN operates at up to 500 MHz on a single ARM Cortex-A5 core. According to the Microchip SAMA5D2 series datasheet, this frequency is achieved with the Armv7-A architecture and supports dynamic voltage/frequency scaling for low-power modes. This places the ATSAMA5D26B-CN in the mid-performance MPU tier suitable for Linux-driven IoT gateways, HMI panels, and multimedia appliances requiring more compute density than Cortex-M microcontrollers but lower power than Cortex-A7/A53 designs.
What is the difference between ATSAMA5D26B-CN and ATSAMA5D26A-CUR?
The ATSAMA5D26B-CN and ATSAMA5D26A-CUR belong to the same SAMA5D26 silicon family but differ in silicon revision and temperature grade. The -CN suffix denotes the industrial temperature range (-40C to +85C) in LFBGA-289 package, while -CUR typically denotes a different speed/revision code. Both run at 500 MHz and share the same 289-LFBGA (14x14) footprint, making them drop-in compatible at the PCB level with appropriate firmware revision checks.
Where can I buy the ATSAMA5D26B-CN online at distributor pricing?
The ATSAMA5D26B-CN is available from major distributors including DigiKey, Mouser, Octopart-listed suppliers, Microchip Direct, and Avaq. As of 2026-09-21, unit pricing at qty-1 starts around $18.95 USD and decreases to approximately $13.05 USD at qty-1000. Stock is generally available but lead times may extend for industrial temperature grades due to wafer allocation. Always verify RoHS/REACH compliance certification with your distributor before industrial design-in.
What is the lead time for ATSAMA5D26B-CN orders?
Lead time for the ATSAMA5D26B-CN industrial temperature variant is typically 8 to 16 weeks from the manufacturer and 4 to 8 weeks through authorized distributors as of 2026-09-21. The -CN temperature grade is the most common SAMA5D26 order code and tends to maintain stock at DigiKey and Mouser. For volume orders above 1000 units, Microchip Direct typically provides the shortest lead times with direct factory scheduling.
Is the ATSAMA5D26B-CN in stock at major distributors?
Yes, the ATSAMA5D26B-CN is currently stocked at multiple authorized distributors per Octopart data from 2026-09-21. DigiKey lists inventory of 2 distributors with bulk discount tiers. Stock levels fluctuate weekly; for guaranteed allocation, place orders through Microchip Direct with annual volume agreements. For engineering samples, Microchip's Sample Center provides up to 5 free units per part number for evaluation purposes.
What is the price of the ATSAMA5D26B-CN at quantity 100?
The ATSAMA5D26B-CN pricing at qty-100 is approximately $15.88 USD per unit as of 2026-09-21 distributor data. Price breaks occur at qty-10 ($17.42), qty-100 ($15.88), qty-250 ($14.96), qty-500 ($14.21), and qty-1000 ($13.05). Volume pricing for OEM production runs above 5000 units is typically negotiated directly through Microchip's sales channel with NRE and tooling amortized into unit cost.
What is the difference between ATSAMA5D26B-CN and ATSAMA5D36A-CN?
The ATSAMA5D26B-CN and ATSAMA5D36A-CN differ primarily in their security feature set. The 26-variant is the mainstream SAMA5D2 with full security including secure boot, AES/SHA accelerators, TRNG, and tamper detection, while the 36-variant adds additional hardware cryptography blocks. Both share the same 500 MHz Cortex-A5 core, 128 kbyte L2 cache, and 289-LFBGA (14x14) package footprint, making them pin-compatible drop-in alternatives when security requirements align.
Can ATSAMA5D26B-CNR replace ATSAMA5D26B-CN directly?
Yes, the ATSAMA5D26B-CNR is the tape-and-reel packaging variant of the ATSAMA5D26B-CN and is fully pin-to-pin compatible. Both share identical 289-LFBGA (14x14) package dimensions, 0.8 mm ball pitch, and die revision. The only difference is the carrier format: -CN ships in tray, -CNR ships in tape-and-reel for high-volume SMT assembly. According to Microchip's product family documentation, no firmware or bootloader changes are required to migrate between these two packaging variants.
When should I choose ATSAMA5D26B-CN over ATSAMA5D22A-CN?
Choose the ATSAMA5D26B-CN when your design requires the maximum L2 cache (128 kbyte), full security feature set including tamper pins, and embedded audio subsystem support. Choose the ATSAMA5D22A-CN when your application needs lower power, reduced peripheral count, and lower cost. Both share the same 500 MHz Cortex-A5 core and 289-LFBGA package, so PCB layout is reusable; the decision reduces to feature subset selection based on BOM cost targets.
Is the ATSAMA5D26B-CN suitable for industrial IoT gateway applications?
Yes, the ATSAMA5D26B-CN is highly suitable for industrial IoT gateway applications. The 500 MHz Cortex-A5 core runs Linux comfortably, the industrial -40C to +85C temperature grade ensures field reliability, the DDR3L/LPDDR3 interface supports high-throughput sensor aggregation, and the integrated crypto accelerators (AES, SHA, TRNG) provide hardware root-of-trust for secure MQTT/CoAP communications. Per Microchip reference designs, typical gateway implementations achieve sub-1W active power with the 5 uA backup mode.
Where can I download the ATSAMA5D26B-CN datasheet PDF?
The official ATSAMA5D26B-CN datasheet can be downloaded as a PDF from the Microchip product page at microchip.com/en-us/product/ATSAMA5D26. The datasheet covers electrical characteristics, pin mapping, memory map, peripheral register descriptions, and reference schematics. A errata sheet and SAMA5D2 hardware design checklist are also available from the same product page to support board bring-up and silicon revision awareness during firmware development.
Where do I find the ATSAMA5D26B-CN pinout and ball map?
The ATSAMA5D26B-CN pinout and ball map are documented in section 7 of the Microchip SAMA5D2 datasheet. The 289-LFBGA package uses a 14x14 mm body with 0.8 mm ball pitch arranged in a peripheral+staggered pattern. Power, ground, DDR, and high-speed interface balls are concentrated for optimal PCB escape routing. Microchip also provides an Allegro and Altium Designer footprint library on the product page's design resources tab.
What are the key specifications of ATSAMA5D26B-CN engineers should know?
Engineers should know: 500 MHz single-core ARM Cortex-A5, 128 kbyte L2 cache, MMU plus TrustZone, 0.8 mm pitch 289-LFBGA, industrial -40C to +85C grade, 5 uA backup current, DDR3L/LPDDR3 + QSPI/e.MMC memory interfaces, hardware AES/SHA/TRNG crypto, and integrated audio subsystem. These specs position the ATSAMA5D26B-CN as a Linux-capable secure MPU for cost-sensitive industrial and IoT edge applications where full Cortex-A7 compute is unnecessary.
What is the best Microchip equivalent for ATSAMA5D26B-CN in a related pin-compatible family?
Within the Microchip SAMA5D2 family, the best pin-compatible equivalents include ATSAMA5D22A-CN for cost-reduced designs, ATSAMA5D24B-CU for higher feature integration, and ATSAMA5D26A-CUR for a different silicon revision. All four share the same 289-LFBGA (14x14) 0.8 mm pitch package, enabling PCB reuse. The decision depends on your security feature requirements, peripheral needs, and qualification cycles across the Microchip SAMA5D2 product tree.

Technische Referenzdaten für ATSAMA5D26B-CN – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the ATSAMA5D26B-CN when your design requires a Linux-capable ARM Cortex-A5 microprocessor with full hardware security (AES, SHA, TRNG, tamper pins), embedded audio subsystem support, and the latest revision B silicon. Choose the ATSAMA5D26B-CNR instead when you need tape-and-reel packaging for high-volume SMT assembly - it is fully pin-compatible. Choose the ATSAMA5D24B-CU when you do not need the full security feature set and want to reduce BOM cost in the same package. Choose the ATSAMA5D22A-CN when you need the lowest cost SAMA5D2 with reduced peripherals. All five alternatives share the same 289-LFBGA (14x14 mm) footprint, enabling PCB layout reuse. Cross-brand Cortex-A alternatives such as NXP i.MX 6UL or STM32MP1 exist but require PCB rework due to different packages - they are not drop-in replacements.

Vergleich mit Alternativen

Parameter Dieses Produkt ATSAMA5D26B-CNR ATSAMA5D26A-CUR ATSAMA5D26A-CN ATSAMA5D24B-CU ATSAMA5D22A-CN
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 289-LFBGA (14x14 mm) 289-LFBGA (14x14 mm) - same 289-LFBGA (14x14 mm) - same 289-LFBGA (14x14 mm) - same 289-LFBGA (14x14 mm) - same 289-LFBGA (14x14 mm) - same
Maximum Clock Frequency 500 MHz 500 MHz 500 MHz 500 MHz 500 MHz 500 MHz
L2 Cache 128 kbyte 128 kbyte 128 kbyte 128 kbyte 128 kbyte 128 kbyte
Security Features Full (secure boot, AES, SHA, TRNG, tamper) Full Full Full Reduced Reduced
Embedded Audio Subsystem Yes Yes Yes Yes Yes No
Temperature Grade Industrial (-40C to +85C) Industrial Industrial Industrial Industrial Industrial
Silicon Revision B B A A B A
Approximate Unit Price (qty-1, USD) $18.95 $18.95 $19.50 $19.50 $15.20 $13.40

Wichtigste Unterscheidungsmerkmale

  • Full security subsystem including tamper detection pins (vs. ATSAMA5D24B-CU)
  • Embedded audio subsystem (vs. ATSAMA5D22A-CN)
  • Latest silicon revision (B) with bug fixes (vs. ATSAMA5D26A-CN)
  • Wide peripheral integration including CAN and HSIC (vs. Lower-end Cortex-M MCUs)
  • Linux-class application processing at industrial temperature grade (vs. ATSAM4S series Cortex-M4 MCUs)

Designhinweise

The 289-LFBGA package uses a 14x14 mm body with 0.8 mm ball pitch. PCB design requires laser-drilled microvias in the BGA break-out region and 4-layer stack-up minimum. Microchip's SAMA5D2 hardware design checklist recommends placing the DDR3L SDRAM within 50 mm trace length to maintain signal integrity. Decoupling: place 100 nF X7R capacitors on every VDDCORE, VDDIO, and VDDPLL pin within 2 mm trace length, plus bulk 10 uF X5R capacitors at each power rail entry. The exposed pad (if present) must be soldered to a continuous ground plane for thermal dissipation; the package dissipates up to 1.2 W under full load.

Estimated: At 500 MHz with all peripherals active, the ATSAMA5D26B-CN draws approximately 350 mW core power plus DDR I/O power, totaling near 1 W total system-on-chip dissipation. With the 289-LFBGA package and theta_JA of approximately 25 C/W on a 4-layer JEDEC JESD51 test board, junction temperature rise above ambient is roughly 25 C. At industrial +85C ambient, junction reaches 110 C - within the 125 C Tj max. Designers should still place thermal vias under the central ball array connected to internal ground planes for heat spreading. Forced airflow is recommended for fanless enclosures above 1 W total system power dissipation.

Three critical pitfalls to avoid: (1) Do not omit the external 32.768 kHz crystal on the SLOWCLK pins - the RTC and backup domain depend on it and software will hang at boot without it. (2) Do not connect VDDCORE directly to VDDIO; use a Microchip-recommended PMIC such as MCP16502 or discrete LDO chain with proper power-up sequencing. (3) Verify silicon revision before flashing firmware - the ATSAMA5D26B (revision B) and ATSAMA5D26A (revision A) share the same datasheet but have different errata; check the bootrom version at reset to confirm silicon revision before booting Linux.

DDR3L routing requires length matching within +/-25 mil across the byte lanes and within +/-50 mil across the address/command group per JEDEC JESD79-3-F. Use a 50 ohm controlled-impedance microstrip on the top layer with continuous reference ground plane on layer 2. VTT termination is mandatory for DDR3L; use a dedicated VTT regulator at 0.75*VDDQ. For QSPI flash interfaces routed to the boot ROM, keep trace lengths under 50 mm and use series damping resistors to reduce ringing on clock edges above 50 MHz SDR clock rate.

Recommended power tree uses the MCP16502 PMIC generating 1.0V VDDCORE, 1.5V VDD_DDR, 1.8V VDDIO, and 3.3V VDDA from a single 3.6-5.5V input. The PMIC supports dynamic voltage scaling coordinated with Linux CPUFreq drivers. Add a coin-cell or supercapacitor on the backup domain (VDDBU) for RTC retention during main power loss; backup current is 5 uA typical so a 1 F supercapacitor provides approximately 50 hours of RTC retention. Always enable the secure boot fuse programming during production to lock the bootrom to authenticated firmware images.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS and REACH compliance confirmed per Microchip product page. The -CN suffix denotes industrial temperature grade (-40C to +85C); not AEC-Q100 qualified - automotive designs require the ATSAMA5D26 automotive-qualified variant. Halogen-free status not explicitly stated in available data.

Daten verifiziert am: 2026-09-21 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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