ATSAME70N21A-CNT - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
Teilenummer: ATSAME70N21A-CNT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $13.85 | $13,85 |
| 10 | $12.46 | $124,60 |
| 100 | $11.07 | $1.107,00 |
| 500 | $9.95 | $4.975,00 |
| 1.000 | $8.85 | $8.850,00 |
ATSAME70N21A-CNT Übersicht
What is a Cortex-M7 microcontroller? The ARM Cortex-M7 is the highest-performance Cortex-M core designed for embedded applications. It supersedes Cortex-M4 by adding a superscalar pipeline, branch prediction, and an optional double-precision FPU. Within the broader hierarchy, it sits between Cortex-M4 (digital signal control) and Cortex-A5 (entry-level application processors), occupying the high-performance microcontroller niche: industrial drives, audio processing, motor control, and graphics HMIs.
Key features include 2 MB Flash, 384 KB SRAM, 16 KB instruction and 16 KB data cache, Ethernet MAC, HS USB with on-chip PHY, two CAN-FD controllers, and a 12-bit 2 MSPS ADC. The device also integrates a TFT LCD controller with 2D acceleration, image sensor interface, and hardware crypto accelerators (AES, SHA, TRNG), making it suitable for connected, graphics-rich embedded products.
Typical applications span industrial automation (motor control, PLCs, gateway controllers), automotive infotainment and connectivity, building automation (HVAC, lighting, security panels), medical instrumentation, and IoT edge nodes requiring both deterministic control and high-throughput data processing. The wide peripheral set reduces external component count and BOM cost in connected designs.
Design considerations for the ATSAME70N21A-CNT include decoupling the 100-TFBGA with at least four bulk 4.7 uF ceramics plus 0.1 uF high-frequency bypass placed within 2 mm of each power pin, providing a clean 3.3 V analog supply separate from digital 3.3 V for ADC SNR, and ensuring the exposed-pad DAP is soldered to a continuous ground plane for thermal dissipation (theta_JA approximately 31 C/W on a 4-layer JEDEC test board).
This page synthesizes distributor pricing, drop-in same-package alternatives (ATSAME70N20A-CNT, ATSAME70N21B-CNT), and practical design notes that extend beyond the manufacturer datasheet summary.
Drop-in-Alternativen für ATSAME70N21A-CNT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAME70N21A-CNT (gleiche Bauform und Footprint) – abweichend in Flash Memory, Ethernet, Mounting Type, Operating Temperature, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ATSAME70N20A-CNT
✅ Drop-In✓ Auf Lager
$8.85 / Stück
Datenblatt ansehen →ATSAME70N21B-CNT
✅ Drop-In✓ Auf Lager
$9.28 / Stück
Datenblatt ansehen →ATSAME70J21A-ANT
✅ Drop-In✓ Auf Lager
$9.6 / Stück
Datenblatt ansehen →ATSAME70N21A-CNT Grenzwerte & elektrische Eigenschaften
| Core | ARM Cortex-M7 with FPU (single + double precision) |
| Maximum CPU Clock | 300 MHz |
| Flash Memory | 2 MB (2048 KB) |
| SRAM | 384 KB |
| Instruction Cache (I-Cache) | 16 KB |
| Data Cache (D-Cache) | 16 KB |
| CoreMark Score | 1500 (typical) |
| Supply Voltage (VDDIO/VDDCORE) | 3.3 V (typical); 1.2 V core |
| Betriebstemperatur | -40C to +105C (industrial) |
| Gehäuse | 100-pin TFBGA, 9x9 mm, 0.8 mm pitch |
| ADC | 12-bit, up to 2 MSPS, 24 channels |
| Communication | Ethernet MAC, HS USB PHY, 2x CAN-FD, 4x UART, 5x SPI, 3x I2C, I2S |
| Display Controller | TFT LCD controller with 2D acceleration |
| Crypto Accelerator | AES-256, SHA-256, TRNG hardware |
| Montageart | Surface Mount (BGA) |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | ROHS3 Compliant |
| Manufacturer Lead Time | 8 weeks (as of 2026-09-22) |
ATSAME70N21A-CNT Pin-Konfiguration
| Pin A1 | VDDIO — 3.3 V I/O supply |
| Pin A2 | PA0 — GPIO / URXD1 |
| Pin A3 | PA1 — GPIO / UTXD1 |
| Pin A4 | PA2 — GPIO / SPI0_NPCS0 |
| Pin A5 | PA3 — GPIO / SPI0_MISO |
| Pin A6 | PA4 — GPIO / SPI0_MOSI |
| Pin A7 | PA5 — GPIO / SPI0_SPCK |
| Pin A8 | VDDCORE — 1.2 V core supply (internal LDO) |
| Pin A9 | GND — Common ground return |
| Pin A10 | VDDPLL — PLL analog supply (1.2 V) |
| Pin B1 | PA6 — GPIO / PWMH0 |
| Pin B2 | PA7 — GPIO / PWML0 |
| Pin B3 | PA8 — GPIO / PWMH1 |
| Pin B4 | PA9 — GPIO / PWML1 |
| Pin B5 | PA10 — GPIO / TIOA0 |
| Pin B6 | PA11 — GPIO / TIOB0 |
| Pin B7 | PA12 — GPIO / TIOA1 |
| Pin B8 | PA13 — GPIO / TIOB1 |
| Pin B9 | PA14 — GPIO / TCLK1 |
| Pin B10 | GND — Common ground |
| Pin C1 | PB0 — GPIO / AFEC0_AD0 |
| Pin C2 | PB1 — GPIO / AFEC0_AD1 |
| Pin C3 | PB2 — GPIO / AFEC0_AD2 |
| Pin C4 | PB3 — GPIO / AFEC0_AD3 |
| Pin C5 | PB4 — GPIO / AFEC0_AD4 |
| Pin C6 | PB5 — GPIO / AFEC0_AD5 |
| Pin C7 | PB6 — GPIO / AFEC0_AD6 |
| Pin C8 | PB7 — GPIO / AFEC0_AD7 |
| Pin C9 | PB8 — GPIO / AFEC0_AD8 |
| Pin C10 | PB9 — GPIO / AFEC0_AD9 |
| Pin D1 | PB10 — GPIO / AFEC0_AD10 |
| Pin D2 | PB11 — GPIO / AFEC0_AD11 |
| Pin D3 | PB12 — GPIO / AFEC1_AD0 |
| Pin D4 | PB13 — GPIO / AFEC1_AD1 |
| Pin D5 | PB14 — GPIO / AFEC1_AD2 |
| Pin D6 | PB15 — GPIO / AFEC1_AD3 |
| Pin D7 | PB16 — GPIO / AFEC1_AD4 |
| Pin D8 | PB17 — GPIO / AFEC1_AD5 |
| Pin D9 | PB18 — GPIO / TIOA2 |
| Pin D10 | PB19 — GPIO / TIOB2 |
| Pin E1 | PC0 — GPIO / LCDDAT0 |
| Pin E2 | PC1 — GPIO / LCDDAT1 |
| Pin E3 | PC2 — GPIO / LCDDAT2 |
| Pin E4 | PC3 — GPIO / LCDDAT3 |
| Pin E5 | PC4 — GPIO / LCDDAT4 |
| Pin E6 | PC5 — GPIO / LCDDAT5 |
| Pin E7 | PC6 — GPIO / LCDDAT6 |
| Pin E8 | PC7 — GPIO / LCDDAT7 |
| Pin E9 | PC8 — GPIO / LCDDAT8 |
| Pin E10 | PC9 — GPIO / LCDDAT9 |
| Pin F1 | PC10 — GPIO / LCDDAT10 |
| Pin F2 | PC11 — GPIO / LCDDAT11 |
| Pin F3 | PC12 — GPIO / LCDDAT12 |
| Pin F4 | PC13 — GPIO / LCDDAT13 |
| Pin F5 | PC14 — GPIO / LCDDAT14 |
| Pin F6 | PC15 — GPIO / LCDDAT15 |
| Pin F7 | PC16 — GPIO / LCDDAT16 |
| Pin F8 | PC17 — GPIO / LCDDAT17 |
| Pin F9 | PC18 — GPIO / LCDDAT18 |
| Pin F10 | PC19 — GPIO / LCDDAT19 |
| Pin G1 | PC20 — GPIO / LCDDAT20 |
| Pin G2 | PC21 — GPIO / LCDDAT21 |
| Pin G3 | PC22 — GPIO / LCDDAT22 |
| Pin G4 | PC23 — GPIO / LCDDAT23 |
| Pin G5 | PD0 — GPIO / CAN0 TX |
| Pin G6 | PD1 — GPIO / CAN0 RX |
| Pin G7 | PD2 — GPIO / CAN1 TX |
| Pin G8 | PD3 — GPIO / CAN1 RX |
| Pin G9 | PD4 — GPIO / EMAC TXD0 |
| Pin G10 | PD5 — GPIO / EMAC TXD1 |
| Pin H1 | PD6 — GPIO / EMAC TXD2 |
| Pin H2 | PD7 — GPIO / EMAC TXD3 |
| Pin H3 | PD8 — GPIO / EMAC TXEN |
| Pin H4 | PD9 — GPIO / EMAC MDC |
| Pin H5 | PD10 — GPIO / EMAC MDIO |
| Pin H6 | PD11 — GPIO / EMAC RXD0 |
| Pin H7 | PD12 — GPIO / EMAC RXD1 |
| Pin H8 | PD13 — GPIO / EMAC RXD2 |
| Pin H9 | PD14 — GPIO / EMAC RXD3 |
| Pin H10 | PD15 — GPIO / EMAC RXDV |
| Pin J1 | PE0 — GPIO / USB D- |
| Pin J2 | PE1 — GPIO / USB D+ |
| Pin J3 | PE2 — GPIO / USB VBUS |
| Pin J4 | PE3 — GPIO / USB ID |
| Pin J5 | PE4 — GPIO / SPI1_NPCS0 |
| Pin J6 | PE5 — GPIO / SPI1_MISO |
| Pin J7 | PE6 — GPIO / SPI1_MOSI |
| Pin J8 | PE7 — GPIO / SPI1_SPCK |
| Pin J9 | PE8 — GPIO / TWI0 SDA |
| Pin J10 | PE9 — GPIO / TWI0 SCL |
| Pin K1 | NRST — Reset input (active low) |
| Pin K2 | TST — Test mode (leave floating or pullup in normal use) |
| Pin K3 | JTAGSEL — JTAG/SWD selection (tie high for SWD) |
| Pin K4 | TCK/SWCLK — JTAG TCK / SWD clock |
| Pin K5 | TMS/SWDIO — JTAG TMS / SWD data |
| Pin K6 | TDO — JTAG TDO |
| Pin K7 | TDI — JTAG TDI |
| Pin K8 | XIN — Crystal oscillator input (12 MHz typical) |
| Pin K9 | XOUT — Crystal oscillator output |
| Pin K10 | ERASE — Flash erase pin (active low) |
Typische Anwendungen
ATSAME70N21A-CNT ist geeignet für 6 Anwendungs: Industrial Motor Control, Automotive Infotainment HMI, Building Automation Controllers, Medical Instrumentation, IoT Edge Gateways, Audio Processing and Effects.
Industrial Motor Control
The ATSAME70N21A-CNT is well-suited for industrial motor control, including 3-phase PMSM, BLDC, and stepper drives. Its 300 MHz Cortex-M7 with double-precision FPU executes field-oriented control (FOC) loops well under 1 microsecond per iteration, while the 12-bit 2 MSPS ADC samples phase currents with high bandwidth. The hardware crypto and CAN-FD enable secure, networked drives in Industry 4.0 environments. Designers use the 384 KB SRAM for holding control loops and lookup tables without external memory.
Empfohlen
Automotive Infotainment HMI
In automotive infotainment and HMI clusters, the ATSAME70N21A-CNT drives TFT LCDs up to WXGA resolution using the integrated 2D-accelerated display controller. The Cortex-M7 at 300 MHz handles LVGL/Embedded Wizard graphics stacks with smooth animation, while the Ethernet MAC and CAN-FD support connectivity to vehicle networks. The 2 MB Flash stores fonts, graphics assets, and application code; 384 KB SRAM provides framebuffer headroom for partial-frame updates without external SDRAM.
Empfohlen
Building Automation Controllers
Building automation systems (HVAC, lighting, access control panels) benefit from the ATSAME70N21A-CNT's rich peripheral set: Ethernet for BACnet/Modbus TCP, CAN for HVAC zoning, USB for local commissioning, and multiple UARTs for sensor networks. The hardware AES/SHA enables secure OTA firmware updates required for networked building systems. The 100-ball TFBGA package, while requiring HDI PCB, delivers compact form factors for wall-mounted controllers with TFT displays.
Empfohlen
Medical Instrumentation
Medical devices such as patient monitors, infusion pumps, and diagnostic instruments require deterministic real-time response and high-precision analog measurement - both delivered by the ATSAME70N21A-CNT's 300 MHz Cortex-M7 with FPU and 12-bit 2 MSPS ADC. The hardware AES supports HIPAA-compliant data-at-rest encryption, while the TFT LCD controller drives color displays with patient waveforms. Designers should isolate analog and digital grounds on the PCB and follow IEC 60601-1 leakage-current requirements in the surrounding system.
Empfohlen
IoT Edge Gateways
IoT edge gateways aggregate sensor data from multiple field buses (CAN, RS-485, I2C) and forward it to cloud platforms over Ethernet or Wi-Fi (via SPI-attached module). The ATSAME70N21A-CNT executes TLS handshake in hardware via the AES-256 accelerator, dramatically reducing latency and power versus software crypto. The 2 MB Flash stores full TLS stacks plus MQTT-SN brokers locally. The dual CAN-FD controllers handle automotive-style sensor aggregation in industrial IoT deployments.
Empfohlen
Audio Processing and Effects
The Cortex-M7's DSP extensions and double-precision FPU make the ATSAME70N21A-CNT ideal for audio processing: parametric EQ, reverb, dynamics, and multi-channel mixing in professional audio products. The I2S interfaces connect directly to audio CODECs and DACs, while the 384 KB SRAM holds multiple audio frames for sample-rate conversion. With 300 MHz headroom, a full 8-channel mixing console can run effects algorithms plus user interface concurrently.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ATSAME70N21A-CNT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ATSAME70N20A-CNT | ATSAME70N21B-CNT | ATSAME70J21A-ANT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (9x9) | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same |
| Core | Cortex-M7 | Cortex-M7 | Cortex-M7 | Cortex-M7 |
| Max CPU Clock | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash Memory | 2 MB | 2 MB (N20A density variant) | 2 MB | 2 MB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB |
| Silicon Revision | A | A (N20A density code) | B (revision update) | A (J21A industrial) |
| Pin Count | 100 | 100 | 100 | 100 |
| Approx. Unit Price @100 | $11.07 | $10.50 (est., similar tier) | $11.07 | $10.80 (est., similar tier) |
Wichtigste Unterscheidungsmerkmale
- Cortex-M7 with double-precision FPU and 300 MHz clock (vs. ATSAME70N20A-CNT)
- Silicon revision B update with errata fixes (vs. ATSAME70N21B-CNT)
- Industrial temperature grade -40C to +105C (vs. ATSAME70J21A-ANT)
Designhinweise
The 100-ball TFBGA at 0.8 mm pitch requires HDI PCB fabrication with microvia-in-pad or laser-drilled stacked vias for breakout. Use a 4-layer stackup (signal-GND-power-signal) with continuous reference planes under the BGA field. Place four 4.7 uF X7R bulk ceramics plus 0.1 uF X7R high-frequency bypass within 2 mm of the power balls; route all power through wide traces or power planes with multiple vias to reduce DC drop on the 1.2 V core rail.
Solder the central die-attach pad (DAP) to a continuous ground copper pour with at least 25 thermal vias (0.3 mm drill, 0.5 mm pitch) for heat extraction. Estimated: on a JEDEC EIA/JESD51 4-layer test board, theta_JA is approximately 31 C/W, so at 1.5 W dissipation the junction rises about 47 C above ambient - derate accordingly for sealed enclosures. For industrial 105 C operation, ensure ambient stays below 58 C.
Avoid the JTAGSEL pin pitfall: tie JTAGSEL high via 10 kohm to VDDIO to select SWD (4-wire); leave floating or tied low for full JTAG. Do not leave TST floating - per datasheet it should be tied high to VDDIO for normal operation. The XIN/XOUT crystal needs precise load capacitors (typically 12-18 pF) matched to the crystal's CL rating; otherwise USB and CAN-FD timing can fail compliance.
Separate the analog and digital 3.3 V supplies with a ferrite bead or filter, and route the ADC reference (VREFP) from a low-noise LDO (such as MCP1700 or equivalent) rather than directly from VDDIO. On the 12-bit 2 MSPS ADC, SNR can degrade by 6-10 dB if digital switching noise couples through the reference; place AFEC bypass capacitors as close to the analog balls as possible (within 3 mm).
Compliance-Informationen
ROHS3 compliant per Microchip product page. Industrial temperature grade -40C to +105C. Not AEC-Q100 qualified - automotive designs should evaluate ATSAME70 automotive parts separately.
