ATSAME70N21A-CNT - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
Référence : ATSAME70N21A-CNT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.85 | $13,85 |
| 10 | $12.46 | $124,60 |
| 100 | $11.07 | $1 107,00 |
| 500 | $9.95 | $4 975,00 |
| 1 000 | $8.85 | $8 850,00 |
ATSAME70N21A-CNT Présentation
What is a Cortex-M7 microcontroller? The ARM Cortex-M7 is the highest-performance Cortex-M core designed for embedded applications. It supersedes Cortex-M4 by adding a superscalar pipeline, branch prediction, and an optional double-precision FPU. Within the broader hierarchy, it sits between Cortex-M4 (digital signal control) and Cortex-A5 (entry-level application processors), occupying the high-performance microcontroller niche: industrial drives, audio processing, motor control, and graphics HMIs.
Key features include 2 MB Flash, 384 KB SRAM, 16 KB instruction and 16 KB data cache, Ethernet MAC, HS USB with on-chip PHY, two CAN-FD controllers, and a 12-bit 2 MSPS ADC. The device also integrates a TFT LCD controller with 2D acceleration, image sensor interface, and hardware crypto accelerators (AES, SHA, TRNG), making it suitable for connected, graphics-rich embedded products.
Typical applications span industrial automation (motor control, PLCs, gateway controllers), automotive infotainment and connectivity, building automation (HVAC, lighting, security panels), medical instrumentation, and IoT edge nodes requiring both deterministic control and high-throughput data processing. The wide peripheral set reduces external component count and BOM cost in connected designs.
Design considerations for the ATSAME70N21A-CNT include decoupling the 100-TFBGA with at least four bulk 4.7 uF ceramics plus 0.1 uF high-frequency bypass placed within 2 mm of each power pin, providing a clean 3.3 V analog supply separate from digital 3.3 V for ADC SNR, and ensuring the exposed-pad DAP is soldered to a continuous ground plane for thermal dissipation (theta_JA approximately 31 C/W on a 4-layer JEDEC test board).
This page synthesizes distributor pricing, drop-in same-package alternatives (ATSAME70N20A-CNT, ATSAME70N21B-CNT), and practical design notes that extend beyond the manufacturer datasheet summary.
Alternatives de remplacement direct pour ATSAME70N21A-CNT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAME70N21A-CNT (même facteur de forme et même empreinte) — différant par Flash Memory, Ethernet, Mounting Type, Operating Temperature, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAME70N20A-CNT
✅ Remplacement direct✓ En stock
$8.85 / unité
Voir la fiche technique →ATSAME70N21B-CNT
✅ Remplacement direct✓ En stock
$9.28 / unité
Voir la fiche technique →ATSAME70J21A-ANT
✅ Remplacement direct✓ En stock
$9.6 / unité
Voir la fiche technique →ATSAME70N21A-CNT Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M7 with FPU (single + double precision) |
| Maximum CPU Clock | 300 MHz |
| Flash Memory | 2 MB (2048 KB) |
| SRAM | 384 KB |
| Instruction Cache (I-Cache) | 16 KB |
| Data Cache (D-Cache) | 16 KB |
| CoreMark Score | 1500 (typical) |
| Supply Voltage (VDDIO/VDDCORE) | 3.3 V (typical); 1.2 V core |
| Température de fonctionnement | -40C to +105C (industrial) |
| Boîtier | 100-pin TFBGA, 9x9 mm, 0.8 mm pitch |
| ADC | 12-bit, up to 2 MSPS, 24 channels |
| Communication | Ethernet MAC, HS USB PHY, 2x CAN-FD, 4x UART, 5x SPI, 3x I2C, I2S |
| Display Controller | TFT LCD controller with 2D acceleration |
| Crypto Accelerator | AES-256, SHA-256, TRNG hardware |
| Type de montage | Surface Mount (BGA) |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | ROHS3 Compliant |
| Manufacturer Lead Time | 8 weeks (as of 2026-09-22) |
Configuration des broches de ATSAME70N21A-CNT
| Broche A1 | VDDIO — 3.3 V I/O supply |
| Broche A2 | PA0 — GPIO / URXD1 |
| Broche A3 | PA1 — GPIO / UTXD1 |
| Broche A4 | PA2 — GPIO / SPI0_NPCS0 |
| Broche A5 | PA3 — GPIO / SPI0_MISO |
| Broche A6 | PA4 — GPIO / SPI0_MOSI |
| Broche A7 | PA5 — GPIO / SPI0_SPCK |
| Broche A8 | VDDCORE — 1.2 V core supply (internal LDO) |
| Broche A9 | GND — Common ground return |
| Broche A10 | VDDPLL — PLL analog supply (1.2 V) |
| Broche B1 | PA6 — GPIO / PWMH0 |
| Broche B2 | PA7 — GPIO / PWML0 |
| Broche B3 | PA8 — GPIO / PWMH1 |
| Broche B4 | PA9 — GPIO / PWML1 |
| Broche B5 | PA10 — GPIO / TIOA0 |
| Broche B6 | PA11 — GPIO / TIOB0 |
| Broche B7 | PA12 — GPIO / TIOA1 |
| Broche B8 | PA13 — GPIO / TIOB1 |
| Broche B9 | PA14 — GPIO / TCLK1 |
| Broche B10 | GND — Common ground |
| Broche C1 | PB0 — GPIO / AFEC0_AD0 |
| Broche C2 | PB1 — GPIO / AFEC0_AD1 |
| Broche C3 | PB2 — GPIO / AFEC0_AD2 |
| Broche C4 | PB3 — GPIO / AFEC0_AD3 |
| Broche C5 | PB4 — GPIO / AFEC0_AD4 |
| Broche C6 | PB5 — GPIO / AFEC0_AD5 |
| Broche C7 | PB6 — GPIO / AFEC0_AD6 |
| Broche C8 | PB7 — GPIO / AFEC0_AD7 |
| Broche C9 | PB8 — GPIO / AFEC0_AD8 |
| Broche C10 | PB9 — GPIO / AFEC0_AD9 |
| Broche D1 | PB10 — GPIO / AFEC0_AD10 |
| Broche D2 | PB11 — GPIO / AFEC0_AD11 |
| Broche D3 | PB12 — GPIO / AFEC1_AD0 |
| Broche D4 | PB13 — GPIO / AFEC1_AD1 |
| Broche D5 | PB14 — GPIO / AFEC1_AD2 |
| Broche D6 | PB15 — GPIO / AFEC1_AD3 |
| Broche D7 | PB16 — GPIO / AFEC1_AD4 |
| Broche D8 | PB17 — GPIO / AFEC1_AD5 |
| Broche D9 | PB18 — GPIO / TIOA2 |
| Broche D10 | PB19 — GPIO / TIOB2 |
| Broche E1 | PC0 — GPIO / LCDDAT0 |
| Broche E2 | PC1 — GPIO / LCDDAT1 |
| Broche E3 | PC2 — GPIO / LCDDAT2 |
| Broche E4 | PC3 — GPIO / LCDDAT3 |
| Broche E5 | PC4 — GPIO / LCDDAT4 |
| Broche E6 | PC5 — GPIO / LCDDAT5 |
| Broche E7 | PC6 — GPIO / LCDDAT6 |
| Broche E8 | PC7 — GPIO / LCDDAT7 |
| Broche E9 | PC8 — GPIO / LCDDAT8 |
| Broche E10 | PC9 — GPIO / LCDDAT9 |
| Broche F1 | PC10 — GPIO / LCDDAT10 |
| Broche F2 | PC11 — GPIO / LCDDAT11 |
| Broche F3 | PC12 — GPIO / LCDDAT12 |
| Broche F4 | PC13 — GPIO / LCDDAT13 |
| Broche F5 | PC14 — GPIO / LCDDAT14 |
| Broche F6 | PC15 — GPIO / LCDDAT15 |
| Broche F7 | PC16 — GPIO / LCDDAT16 |
| Broche F8 | PC17 — GPIO / LCDDAT17 |
| Broche F9 | PC18 — GPIO / LCDDAT18 |
| Broche F10 | PC19 — GPIO / LCDDAT19 |
| Broche G1 | PC20 — GPIO / LCDDAT20 |
| Broche G2 | PC21 — GPIO / LCDDAT21 |
| Broche G3 | PC22 — GPIO / LCDDAT22 |
| Broche G4 | PC23 — GPIO / LCDDAT23 |
| Broche G5 | PD0 — GPIO / CAN0 TX |
| Broche G6 | PD1 — GPIO / CAN0 RX |
| Broche G7 | PD2 — GPIO / CAN1 TX |
| Broche G8 | PD3 — GPIO / CAN1 RX |
| Broche G9 | PD4 — GPIO / EMAC TXD0 |
| Broche G10 | PD5 — GPIO / EMAC TXD1 |
| Broche H1 | PD6 — GPIO / EMAC TXD2 |
| Broche H2 | PD7 — GPIO / EMAC TXD3 |
| Broche H3 | PD8 — GPIO / EMAC TXEN |
| Broche H4 | PD9 — GPIO / EMAC MDC |
| Broche H5 | PD10 — GPIO / EMAC MDIO |
| Broche H6 | PD11 — GPIO / EMAC RXD0 |
| Broche H7 | PD12 — GPIO / EMAC RXD1 |
| Broche H8 | PD13 — GPIO / EMAC RXD2 |
| Broche H9 | PD14 — GPIO / EMAC RXD3 |
| Broche H10 | PD15 — GPIO / EMAC RXDV |
| Broche J1 | PE0 — GPIO / USB D- |
| Broche J2 | PE1 — GPIO / USB D+ |
| Broche J3 | PE2 — GPIO / USB VBUS |
| Broche J4 | PE3 — GPIO / USB ID |
| Broche J5 | PE4 — GPIO / SPI1_NPCS0 |
| Broche J6 | PE5 — GPIO / SPI1_MISO |
| Broche J7 | PE6 — GPIO / SPI1_MOSI |
| Broche J8 | PE7 — GPIO / SPI1_SPCK |
| Broche J9 | PE8 — GPIO / TWI0 SDA |
| Broche J10 | PE9 — GPIO / TWI0 SCL |
| Broche K1 | NRST — Reset input (active low) |
| Broche K2 | TST — Test mode (leave floating or pullup in normal use) |
| Broche K3 | JTAGSEL — JTAG/SWD selection (tie high for SWD) |
| Broche K4 | TCK/SWCLK — JTAG TCK / SWD clock |
| Broche K5 | TMS/SWDIO — JTAG TMS / SWD data |
| Broche K6 | TDO — JTAG TDO |
| Broche K7 | TDI — JTAG TDI |
| Broche K8 | XIN — Crystal oscillator input (12 MHz typical) |
| Broche K9 | XOUT — Crystal oscillator output |
| Broche K10 | ERASE — Flash erase pin (active low) |
Applications typiques
ATSAME70N21A-CNT convient pour 6 applications: Industrial Motor Control, Automotive Infotainment HMI, Building Automation Controllers, Medical Instrumentation, IoT Edge Gateways, Audio Processing and Effects.
Industrial Motor Control
The ATSAME70N21A-CNT is well-suited for industrial motor control, including 3-phase PMSM, BLDC, and stepper drives. Its 300 MHz Cortex-M7 with double-precision FPU executes field-oriented control (FOC) loops well under 1 microsecond per iteration, while the 12-bit 2 MSPS ADC samples phase currents with high bandwidth. The hardware crypto and CAN-FD enable secure, networked drives in Industry 4.0 environments. Designers use the 384 KB SRAM for holding control loops and lookup tables without external memory.
Recommandé
Automotive Infotainment HMI
In automotive infotainment and HMI clusters, the ATSAME70N21A-CNT drives TFT LCDs up to WXGA resolution using the integrated 2D-accelerated display controller. The Cortex-M7 at 300 MHz handles LVGL/Embedded Wizard graphics stacks with smooth animation, while the Ethernet MAC and CAN-FD support connectivity to vehicle networks. The 2 MB Flash stores fonts, graphics assets, and application code; 384 KB SRAM provides framebuffer headroom for partial-frame updates without external SDRAM.
Recommandé
Building Automation Controllers
Building automation systems (HVAC, lighting, access control panels) benefit from the ATSAME70N21A-CNT's rich peripheral set: Ethernet for BACnet/Modbus TCP, CAN for HVAC zoning, USB for local commissioning, and multiple UARTs for sensor networks. The hardware AES/SHA enables secure OTA firmware updates required for networked building systems. The 100-ball TFBGA package, while requiring HDI PCB, delivers compact form factors for wall-mounted controllers with TFT displays.
Recommandé
Medical Instrumentation
Medical devices such as patient monitors, infusion pumps, and diagnostic instruments require deterministic real-time response and high-precision analog measurement - both delivered by the ATSAME70N21A-CNT's 300 MHz Cortex-M7 with FPU and 12-bit 2 MSPS ADC. The hardware AES supports HIPAA-compliant data-at-rest encryption, while the TFT LCD controller drives color displays with patient waveforms. Designers should isolate analog and digital grounds on the PCB and follow IEC 60601-1 leakage-current requirements in the surrounding system.
Recommandé
IoT Edge Gateways
IoT edge gateways aggregate sensor data from multiple field buses (CAN, RS-485, I2C) and forward it to cloud platforms over Ethernet or Wi-Fi (via SPI-attached module). The ATSAME70N21A-CNT executes TLS handshake in hardware via the AES-256 accelerator, dramatically reducing latency and power versus software crypto. The 2 MB Flash stores full TLS stacks plus MQTT-SN brokers locally. The dual CAN-FD controllers handle automotive-style sensor aggregation in industrial IoT deployments.
Recommandé
Audio Processing and Effects
The Cortex-M7's DSP extensions and double-precision FPU make the ATSAME70N21A-CNT ideal for audio processing: parametric EQ, reverb, dynamics, and multi-channel mixing in professional audio products. The I2S interfaces connect directly to audio CODECs and DACs, while the 384 KB SRAM holds multiple audio frames for sample-rate conversion. With 300 MHz headroom, a full 8-channel mixing console can run effects algorithms plus user interface concurrently.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAME70N21A-CNT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAME70N20A-CNT | ATSAME70N21B-CNT | ATSAME70J21A-ANT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (9x9) | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same |
| Core | Cortex-M7 | Cortex-M7 | Cortex-M7 | Cortex-M7 |
| Max CPU Clock | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash Memory | 2 MB | 2 MB (N20A density variant) | 2 MB | 2 MB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB |
| Silicon Revision | A | A (N20A density code) | B (revision update) | A (J21A industrial) |
| Pin Count | 100 | 100 | 100 | 100 |
| Approx. Unit Price @100 | $11.07 | $10.50 (est., similar tier) | $11.07 | $10.80 (est., similar tier) |
Principaux différenciateurs
- Cortex-M7 with double-precision FPU and 300 MHz clock (vs ATSAME70N20A-CNT)
- Silicon revision B update with errata fixes (vs ATSAME70N21B-CNT)
- Industrial temperature grade -40C to +105C (vs ATSAME70J21A-ANT)
Notes de conception
The 100-ball TFBGA at 0.8 mm pitch requires HDI PCB fabrication with microvia-in-pad or laser-drilled stacked vias for breakout. Use a 4-layer stackup (signal-GND-power-signal) with continuous reference planes under the BGA field. Place four 4.7 uF X7R bulk ceramics plus 0.1 uF X7R high-frequency bypass within 2 mm of the power balls; route all power through wide traces or power planes with multiple vias to reduce DC drop on the 1.2 V core rail.
Solder the central die-attach pad (DAP) to a continuous ground copper pour with at least 25 thermal vias (0.3 mm drill, 0.5 mm pitch) for heat extraction. Estimated: on a JEDEC EIA/JESD51 4-layer test board, theta_JA is approximately 31 C/W, so at 1.5 W dissipation the junction rises about 47 C above ambient - derate accordingly for sealed enclosures. For industrial 105 C operation, ensure ambient stays below 58 C.
Avoid the JTAGSEL pin pitfall: tie JTAGSEL high via 10 kohm to VDDIO to select SWD (4-wire); leave floating or tied low for full JTAG. Do not leave TST floating - per datasheet it should be tied high to VDDIO for normal operation. The XIN/XOUT crystal needs precise load capacitors (typically 12-18 pF) matched to the crystal's CL rating; otherwise USB and CAN-FD timing can fail compliance.
Separate the analog and digital 3.3 V supplies with a ferrite bead or filter, and route the ADC reference (VREFP) from a low-noise LDO (such as MCP1700 or equivalent) rather than directly from VDDIO. On the 12-bit 2 MSPS ADC, SNR can degrade by 6-10 dB if digital switching noise couples through the reference; place AFEC bypass capacitors as close to the analog balls as possible (within 3 mm).
Informations de conformité
ROHS3 compliant per Microchip product page. Industrial temperature grade -40C to +105C. Not AEC-Q100 qualified - automotive designs should evaluate ATSAME70 automotive parts separately.
