ATSAME70N21A-CNT - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
부품 번호: ATSAME70N21A-CNT ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $13.85 | $13.85 |
| 10 | $12.46 | $124.60 |
| 100 | $11.07 | $1,107.00 |
| 500 | $9.95 | $4,975.00 |
| 1,000 | $8.85 | $8,850.00 |
ATSAME70N21A-CNT 개요
What is a Cortex-M7 microcontroller? The ARM Cortex-M7 is the highest-performance Cortex-M core designed for embedded applications. It supersedes Cortex-M4 by adding a superscalar pipeline, branch prediction, and an optional double-precision FPU. Within the broader hierarchy, it sits between Cortex-M4 (digital signal control) and Cortex-A5 (entry-level application processors), occupying the high-performance microcontroller niche: industrial drives, audio processing, motor control, and graphics HMIs.
Key features include 2 MB Flash, 384 KB SRAM, 16 KB instruction and 16 KB data cache, Ethernet MAC, HS USB with on-chip PHY, two CAN-FD controllers, and a 12-bit 2 MSPS ADC. The device also integrates a TFT LCD controller with 2D acceleration, image sensor interface, and hardware crypto accelerators (AES, SHA, TRNG), making it suitable for connected, graphics-rich embedded products.
Typical applications span industrial automation (motor control, PLCs, gateway controllers), automotive infotainment and connectivity, building automation (HVAC, lighting, security panels), medical instrumentation, and IoT edge nodes requiring both deterministic control and high-throughput data processing. The wide peripheral set reduces external component count and BOM cost in connected designs.
Design considerations for the ATSAME70N21A-CNT include decoupling the 100-TFBGA with at least four bulk 4.7 uF ceramics plus 0.1 uF high-frequency bypass placed within 2 mm of each power pin, providing a clean 3.3 V analog supply separate from digital 3.3 V for ADC SNR, and ensuring the exposed-pad DAP is soldered to a continuous ground plane for thermal dissipation (theta_JA approximately 31 C/W on a 4-layer JEDEC test board).
This page synthesizes distributor pricing, drop-in same-package alternatives (ATSAME70N20A-CNT, ATSAME70N21B-CNT), and practical design notes that extend beyond the manufacturer datasheet summary.
드롭인 대체품: ATSAME70N21A-CNT — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAME70N21A-CNT (동일 폼 팩터 및 풋프린트) — 차이점: Flash Memory, Ethernet, Mounting Type, Operating Temperature, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAME70N20A-CNT
✅ 드롭인✓ 재고 있음
$8.85 / 개
데이터시트 보기 →ATSAME70N21B-CNT
✅ 드롭인✓ 재고 있음
$9.28 / 개
데이터시트 보기 →ATSAME70J21A-ANT
✅ 드롭인✓ 재고 있음
$9.6 / 개
데이터시트 보기 →ATSAME70N21A-CNT 최대 정격 & 전기적 특성
| Core | ARM Cortex-M7 with FPU (single + double precision) |
| Maximum CPU Clock | 300 MHz |
| Flash Memory | 2 MB (2048 KB) |
| SRAM | 384 KB |
| Instruction Cache (I-Cache) | 16 KB |
| Data Cache (D-Cache) | 16 KB |
| CoreMark Score | 1500 (typical) |
| Supply Voltage (VDDIO/VDDCORE) | 3.3 V (typical); 1.2 V core |
| 동작 온도 | -40C to +105C (industrial) |
| 패키지 | 100-pin TFBGA, 9x9 mm, 0.8 mm pitch |
| ADC | 12-bit, up to 2 MSPS, 24 channels |
| Communication | Ethernet MAC, HS USB PHY, 2x CAN-FD, 4x UART, 5x SPI, 3x I2C, I2S |
| Display Controller | TFT LCD controller with 2D acceleration |
| Crypto Accelerator | AES-256, SHA-256, TRNG hardware |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | 3 (168 hours) |
| RoHS 상태 | ROHS3 Compliant |
| Manufacturer Lead Time | 8 weeks (as of 2026-09-22) |
ATSAME70N21A-CNT 핀 구성
| 핀 A1 | VDDIO — 3.3 V I/O supply |
| 핀 A2 | PA0 — GPIO / URXD1 |
| 핀 A3 | PA1 — GPIO / UTXD1 |
| 핀 A4 | PA2 — GPIO / SPI0_NPCS0 |
| 핀 A5 | PA3 — GPIO / SPI0_MISO |
| 핀 A6 | PA4 — GPIO / SPI0_MOSI |
| 핀 A7 | PA5 — GPIO / SPI0_SPCK |
| 핀 A8 | VDDCORE — 1.2 V core supply (internal LDO) |
| 핀 A9 | GND — Common ground return |
| 핀 A10 | VDDPLL — PLL analog supply (1.2 V) |
| 핀 B1 | PA6 — GPIO / PWMH0 |
| 핀 B2 | PA7 — GPIO / PWML0 |
| 핀 B3 | PA8 — GPIO / PWMH1 |
| 핀 B4 | PA9 — GPIO / PWML1 |
| 핀 B5 | PA10 — GPIO / TIOA0 |
| 핀 B6 | PA11 — GPIO / TIOB0 |
| 핀 B7 | PA12 — GPIO / TIOA1 |
| 핀 B8 | PA13 — GPIO / TIOB1 |
| 핀 B9 | PA14 — GPIO / TCLK1 |
| 핀 B10 | GND — Common ground |
| 핀 C1 | PB0 — GPIO / AFEC0_AD0 |
| 핀 C2 | PB1 — GPIO / AFEC0_AD1 |
| 핀 C3 | PB2 — GPIO / AFEC0_AD2 |
| 핀 C4 | PB3 — GPIO / AFEC0_AD3 |
| 핀 C5 | PB4 — GPIO / AFEC0_AD4 |
| 핀 C6 | PB5 — GPIO / AFEC0_AD5 |
| 핀 C7 | PB6 — GPIO / AFEC0_AD6 |
| 핀 C8 | PB7 — GPIO / AFEC0_AD7 |
| 핀 C9 | PB8 — GPIO / AFEC0_AD8 |
| 핀 C10 | PB9 — GPIO / AFEC0_AD9 |
| 핀 D1 | PB10 — GPIO / AFEC0_AD10 |
| 핀 D2 | PB11 — GPIO / AFEC0_AD11 |
| 핀 D3 | PB12 — GPIO / AFEC1_AD0 |
| 핀 D4 | PB13 — GPIO / AFEC1_AD1 |
| 핀 D5 | PB14 — GPIO / AFEC1_AD2 |
| 핀 D6 | PB15 — GPIO / AFEC1_AD3 |
| 핀 D7 | PB16 — GPIO / AFEC1_AD4 |
| 핀 D8 | PB17 — GPIO / AFEC1_AD5 |
| 핀 D9 | PB18 — GPIO / TIOA2 |
| 핀 D10 | PB19 — GPIO / TIOB2 |
| 핀 E1 | PC0 — GPIO / LCDDAT0 |
| 핀 E2 | PC1 — GPIO / LCDDAT1 |
| 핀 E3 | PC2 — GPIO / LCDDAT2 |
| 핀 E4 | PC3 — GPIO / LCDDAT3 |
| 핀 E5 | PC4 — GPIO / LCDDAT4 |
| 핀 E6 | PC5 — GPIO / LCDDAT5 |
| 핀 E7 | PC6 — GPIO / LCDDAT6 |
| 핀 E8 | PC7 — GPIO / LCDDAT7 |
| 핀 E9 | PC8 — GPIO / LCDDAT8 |
| 핀 E10 | PC9 — GPIO / LCDDAT9 |
| 핀 F1 | PC10 — GPIO / LCDDAT10 |
| 핀 F2 | PC11 — GPIO / LCDDAT11 |
| 핀 F3 | PC12 — GPIO / LCDDAT12 |
| 핀 F4 | PC13 — GPIO / LCDDAT13 |
| 핀 F5 | PC14 — GPIO / LCDDAT14 |
| 핀 F6 | PC15 — GPIO / LCDDAT15 |
| 핀 F7 | PC16 — GPIO / LCDDAT16 |
| 핀 F8 | PC17 — GPIO / LCDDAT17 |
| 핀 F9 | PC18 — GPIO / LCDDAT18 |
| 핀 F10 | PC19 — GPIO / LCDDAT19 |
| 핀 G1 | PC20 — GPIO / LCDDAT20 |
| 핀 G2 | PC21 — GPIO / LCDDAT21 |
| 핀 G3 | PC22 — GPIO / LCDDAT22 |
| 핀 G4 | PC23 — GPIO / LCDDAT23 |
| 핀 G5 | PD0 — GPIO / CAN0 TX |
| 핀 G6 | PD1 — GPIO / CAN0 RX |
| 핀 G7 | PD2 — GPIO / CAN1 TX |
| 핀 G8 | PD3 — GPIO / CAN1 RX |
| 핀 G9 | PD4 — GPIO / EMAC TXD0 |
| 핀 G10 | PD5 — GPIO / EMAC TXD1 |
| 핀 H1 | PD6 — GPIO / EMAC TXD2 |
| 핀 H2 | PD7 — GPIO / EMAC TXD3 |
| 핀 H3 | PD8 — GPIO / EMAC TXEN |
| 핀 H4 | PD9 — GPIO / EMAC MDC |
| 핀 H5 | PD10 — GPIO / EMAC MDIO |
| 핀 H6 | PD11 — GPIO / EMAC RXD0 |
| 핀 H7 | PD12 — GPIO / EMAC RXD1 |
| 핀 H8 | PD13 — GPIO / EMAC RXD2 |
| 핀 H9 | PD14 — GPIO / EMAC RXD3 |
| 핀 H10 | PD15 — GPIO / EMAC RXDV |
| 핀 J1 | PE0 — GPIO / USB D- |
| 핀 J2 | PE1 — GPIO / USB D+ |
| 핀 J3 | PE2 — GPIO / USB VBUS |
| 핀 J4 | PE3 — GPIO / USB ID |
| 핀 J5 | PE4 — GPIO / SPI1_NPCS0 |
| 핀 J6 | PE5 — GPIO / SPI1_MISO |
| 핀 J7 | PE6 — GPIO / SPI1_MOSI |
| 핀 J8 | PE7 — GPIO / SPI1_SPCK |
| 핀 J9 | PE8 — GPIO / TWI0 SDA |
| 핀 J10 | PE9 — GPIO / TWI0 SCL |
| 핀 K1 | NRST — Reset input (active low) |
| 핀 K2 | TST — Test mode (leave floating or pullup in normal use) |
| 핀 K3 | JTAGSEL — JTAG/SWD selection (tie high for SWD) |
| 핀 K4 | TCK/SWCLK — JTAG TCK / SWD clock |
| 핀 K5 | TMS/SWDIO — JTAG TMS / SWD data |
| 핀 K6 | TDO — JTAG TDO |
| 핀 K7 | TDI — JTAG TDI |
| 핀 K8 | XIN — Crystal oscillator input (12 MHz typical) |
| 핀 K9 | XOUT — Crystal oscillator output |
| 핀 K10 | ERASE — Flash erase pin (active low) |
일반적인 애플리케이션
ATSAME70N21A-CNT 적합 용도: 6 애플리케이션s: Industrial Motor Control, Automotive Infotainment HMI, Building Automation Controllers, Medical Instrumentation, IoT Edge Gateways, Audio Processing and Effects.
Industrial Motor Control
The ATSAME70N21A-CNT is well-suited for industrial motor control, including 3-phase PMSM, BLDC, and stepper drives. Its 300 MHz Cortex-M7 with double-precision FPU executes field-oriented control (FOC) loops well under 1 microsecond per iteration, while the 12-bit 2 MSPS ADC samples phase currents with high bandwidth. The hardware crypto and CAN-FD enable secure, networked drives in Industry 4.0 environments. Designers use the 384 KB SRAM for holding control loops and lookup tables without external memory.
추천
Automotive Infotainment HMI
In automotive infotainment and HMI clusters, the ATSAME70N21A-CNT drives TFT LCDs up to WXGA resolution using the integrated 2D-accelerated display controller. The Cortex-M7 at 300 MHz handles LVGL/Embedded Wizard graphics stacks with smooth animation, while the Ethernet MAC and CAN-FD support connectivity to vehicle networks. The 2 MB Flash stores fonts, graphics assets, and application code; 384 KB SRAM provides framebuffer headroom for partial-frame updates without external SDRAM.
추천
Building Automation Controllers
Building automation systems (HVAC, lighting, access control panels) benefit from the ATSAME70N21A-CNT's rich peripheral set: Ethernet for BACnet/Modbus TCP, CAN for HVAC zoning, USB for local commissioning, and multiple UARTs for sensor networks. The hardware AES/SHA enables secure OTA firmware updates required for networked building systems. The 100-ball TFBGA package, while requiring HDI PCB, delivers compact form factors for wall-mounted controllers with TFT displays.
추천
Medical Instrumentation
Medical devices such as patient monitors, infusion pumps, and diagnostic instruments require deterministic real-time response and high-precision analog measurement - both delivered by the ATSAME70N21A-CNT's 300 MHz Cortex-M7 with FPU and 12-bit 2 MSPS ADC. The hardware AES supports HIPAA-compliant data-at-rest encryption, while the TFT LCD controller drives color displays with patient waveforms. Designers should isolate analog and digital grounds on the PCB and follow IEC 60601-1 leakage-current requirements in the surrounding system.
추천
IoT Edge Gateways
IoT edge gateways aggregate sensor data from multiple field buses (CAN, RS-485, I2C) and forward it to cloud platforms over Ethernet or Wi-Fi (via SPI-attached module). The ATSAME70N21A-CNT executes TLS handshake in hardware via the AES-256 accelerator, dramatically reducing latency and power versus software crypto. The 2 MB Flash stores full TLS stacks plus MQTT-SN brokers locally. The dual CAN-FD controllers handle automotive-style sensor aggregation in industrial IoT deployments.
추천
Audio Processing and Effects
The Cortex-M7's DSP extensions and double-precision FPU make the ATSAME70N21A-CNT ideal for audio processing: parametric EQ, reverb, dynamics, and multi-channel mixing in professional audio products. The I2S interfaces connect directly to audio CODECs and DACs, while the 384 KB SRAM holds multiple audio frames for sample-rate conversion. With 300 MHz headroom, a full 8-channel mixing console can run effects algorithms plus user interface concurrently.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAME70N21A-CNT — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAME70N20A-CNT | ATSAME70N21B-CNT | ATSAME70J21A-ANT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (9x9) | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same |
| Core | Cortex-M7 | Cortex-M7 | Cortex-M7 | Cortex-M7 |
| Max CPU Clock | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash Memory | 2 MB | 2 MB (N20A density variant) | 2 MB | 2 MB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB |
| Silicon Revision | A | A (N20A density code) | B (revision update) | A (J21A industrial) |
| Pin Count | 100 | 100 | 100 | 100 |
| Approx. Unit Price @100 | $11.07 | $10.50 (est., similar tier) | $11.07 | $10.80 (est., similar tier) |
주요 차별점
- Cortex-M7 with double-precision FPU and 300 MHz clock (vs ATSAME70N20A-CNT)
- Silicon revision B update with errata fixes (vs ATSAME70N21B-CNT)
- Industrial temperature grade -40C to +105C (vs ATSAME70J21A-ANT)
설계 노트
The 100-ball TFBGA at 0.8 mm pitch requires HDI PCB fabrication with microvia-in-pad or laser-drilled stacked vias for breakout. Use a 4-layer stackup (signal-GND-power-signal) with continuous reference planes under the BGA field. Place four 4.7 uF X7R bulk ceramics plus 0.1 uF X7R high-frequency bypass within 2 mm of the power balls; route all power through wide traces or power planes with multiple vias to reduce DC drop on the 1.2 V core rail.
Solder the central die-attach pad (DAP) to a continuous ground copper pour with at least 25 thermal vias (0.3 mm drill, 0.5 mm pitch) for heat extraction. Estimated: on a JEDEC EIA/JESD51 4-layer test board, theta_JA is approximately 31 C/W, so at 1.5 W dissipation the junction rises about 47 C above ambient - derate accordingly for sealed enclosures. For industrial 105 C operation, ensure ambient stays below 58 C.
Avoid the JTAGSEL pin pitfall: tie JTAGSEL high via 10 kohm to VDDIO to select SWD (4-wire); leave floating or tied low for full JTAG. Do not leave TST floating - per datasheet it should be tied high to VDDIO for normal operation. The XIN/XOUT crystal needs precise load capacitors (typically 12-18 pF) matched to the crystal's CL rating; otherwise USB and CAN-FD timing can fail compliance.
Separate the analog and digital 3.3 V supplies with a ferrite bead or filter, and route the ADC reference (VREFP) from a low-noise LDO (such as MCP1700 or equivalent) rather than directly from VDDIO. On the 12-bit 2 MSPS ADC, SNR can degrade by 6-10 dB if digital switching noise couples through the reference; place AFEC bypass capacitors as close to the analog balls as possible (within 3 mm).
규정 준수 정보
ROHS3 compliant per Microchip product page. Industrial temperature grade -40C to +105C. Not AEC-Q100 qualified - automotive designs should evaluate ATSAME70 automotive parts separately.
