ATSAME70Q20A-CFN - 300MHz Cortex-M7 MCU 1MB Flash | Microchip
Teilenummer: ATSAME70Q20A-CFN ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $13.76 | $13,76 |
| 10 | $12.45 | $124,50 |
| 100 | $11.2 | $1.120,00 |
| 500 | $10.1 | $5.050,00 |
| 1.000 | $9.05 | $9.050,00 |
ATSAME70Q20A-CFN Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and configurable peripherals behind a tightly-coupled bus matrix. In the broader taxonomy, the ATSAME70Q20A belongs to ARM Cortex-M7 microcontrollers -> 32-bit Flash MCUs -> embedded microcontrollers -> microprocessors and controllers. The Cortex-M7 architecture specifically targets high-performance deterministic signal processing, replacing traditional MCU+DSP dual-chip designs in audio, motor-control, and industrial automation systems.
Key features of the ATSAME70Q20A-CFN include 1 MB on-chip Flash with secure bootloader support, 384 KB SRAM with error correction, 16-bit external bus interface (EBI) for SRAM/SDRAM/NOR, a 2-channel 16-bit PWM timer plus 24-bit purpose timer/counter, and up to 114 programmable I/O lines. An integrated 12-bit 2 MSPS analog front-end with up to 24 channels supports high-speed mixed-signal designs without external ADCs.
Architecturally, the SAME70 family uses a 6-layer AHB bus matrix enabling parallel DMA and CPU accesses without contention, plus a dedicated Cortex-M7 Floating Point Unit delivering up to 600 DMIPS / 1284 CoreMark. Hardware cryptographic acceleration (AES, TDES, SHA), true random number generator (TRNG), and secure RTC support IEC 62443-friendly connected designs. Operating voltage spans 1.62-3.6 V across -40C to +85C industrial temperature range.
Typical applications include industrial motor control (FOC for PMSM/BLDC), automotive body and chassis ECUs, audio/video processing, smart energy gateways with Ethernet connectivity, building automation, and IoT edge nodes requiring TLS/secure-boot. Its combination of Cortex-M7 DSP, FPU, and EMAC makes it a popular choice for EtherCAT/POWERLINK slave controllers.
When designing with the ATSAME70Q20A-CFN, allocate at least 6 decoupling capacitors (100 nF + 4.7 uF per VDD pair) and follow the SAME70 hardware design checklist for EBI/SDRAM signal integrity. The 0.6 mm-pitch UFBGA requires HDI PCB fabrication with microvia stacks for fan-out routing.
This page synthesizes distributor pricing as of 2026-09-22, SAME70 family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für ATSAME70Q20A-CFN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAME70Q20A-CFN (gleiche Bauform und Footprint) – abweichend in Package, ADC, SRAM, Mounting Type, USB.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ATSAME70Q20B-CFN
✅ Drop-In✓ Auf Lager
$8.47 / Stück
Datenblatt ansehen →ATSAME70Q20A-CFNT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ATSAME70Q19A-CFNT
✅ Drop-In✓ Auf Lager
$9.78 / Stück
Datenblatt ansehen →ATSAME70Q19A-CN
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$6.68 / Stück
Datenblatt ansehen →ATSAME70N21B-CN
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$12.1 / Stück
Datenblatt ansehen →ATSAME70N20A-CN
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$7.75 / Stück
Datenblatt ansehen →ATSAME70Q20A-CFN Grenzwerte & elektrische Eigenschaften
| Core | ARM Cortex-M7 with FPU (single precision) |
| Maximale Taktfrequenz | 300 MHz |
| Program Memory (Flash) | 1 MB (1024 KB) |
| SRAM | 384 KB |
| Operating Voltage | 1.62 V to 3.6 V |
| Betriebstemperatur | -40C to +85C (industrial) |
| Gehäuse | 144-ball UFBGA, 10x10x0.6 mm |
| I/O Count | Up to 114 programmable I/O lines |
| CoreMark Performance | 1284 CoreMark (data per Microchip datasheet family) |
| DMIPS | 600 DMIPS |
| External Bus Interface | 16-bit EBI for SRAM/SDRAM/NOR/PSRAM |
| ADC | 12-bit AFEC, up to 24 channels, 2 MSPS |
| Communications | HS USB, HS SDIO/SD Card, CAN-FD, EMAC (MII/RMII), USART, TWI, SPI |
| Crypto Acceleration | AES, TDES, SHA, TRNG (per SAME70 family) |
| Timers | 16-bit PWM timers + 24-bit counter/timer |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
ATSAME70Q20A-CFN 144-ball ufbga, 10x10x0.6 mm Pinbelegungsleitfaden
Pinbelegung für ATSAME70Q20A-CFN (144-ball ufbga, 10x10x0.6 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für ATSAME70Q20A-CFN.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
ATSAME70Q20A-CFN ist geeignet für 6 Anwendungs: Industrial Motor Control (FOC for PMSM/BLDC), Industrial Ethernet Gateways (EtherCAT/Modbus TCP), Audio Processing and DSP Front-End, Automotive Body and Chassis ECUs, Building Automation and HVAC Controllers, IoT Edge Nodes with Secure Boot.
Industrial Motor Control (FOC for PMSM/BLDC)
The ATSAME70Q20A-CFN fits Field-Oriented Control of permanent magnet synchronous motors and brushless DC motors due to its 300 MHz Cortex-M7 core with single-precision FPU delivering 600 DMIPS / 1284 CoreMark - enough headroom for a 10 kHz current-loop FOC at high PWM switching frequencies. The 12-bit 2 MSPS AFEC with 24 channels digitizes phase currents with sub-microsecond latency, while the on-chip 16-bit PWM timer with dead-time insertion drives three-phase IGBT/MOSFET bridges directly. The 384 KB SRAM holds sensorless-observer state (Sliding Mode / MRAS) without external memory, and the SAME70 family integrates CAN-FD for multi-axis industrial networking.
Empfohlen
Industrial Ethernet Gateways (EtherCAT/Modbus TCP)
For EtherCAT slave controllers and Modbus TCP gateways, the ATSAME70Q20A-CFN integrates an EMAC with 1588 hardware timestamping enabling sub-microsecond synchronization over industrial Ethernet. The 1 MB Flash holds the EtherCAT slave stack (SOEM/Beckhoff ET9300) plus application code, while 384 KB SRAM accommodates Ethernet frame buffers without external RAM. The Cortex-M7 DSP extensions accelerate PROFINET IRT cycle-time calculations, and the hardware AES-256/TDES/SHA accelerator enables secure TLS-1.2 communication for IEC 62443-compliant edge gateways connecting to cloud platforms.
Empfohlen
Audio Processing and DSP Front-End
The ATSAME70Q20A-CFN suits professional audio equipment and DSP front-ends thanks to its 300 MHz Cortex-M7 with DSP extensions delivering single-cycle MAC operations for FIR/IIR filters, FFT, and audio codecs. The 16-bit EBI can interface to external SDRAM for large audio buffer pools (up to 64 MB addressable), while the 12-bit 2 MSPS AFEC digitizes analog line inputs. The integrated HS USB supports USB Audio Class 2.0 streaming at 24-bit/192 kHz, and the EMAC enables Dante/AES67 networked audio endpoints - replacing traditional MCU+DSP dual-chip designs with a single SAME70 device.
Empfohlen
Automotive Body and Chassis ECUs
The ATSAME70Q20A-CFN operates across -40C to +85C industrial and supports up to +105C in the CFNT variant, making it suitable for body and chassis ECUs in non-safety-critical automotive applications such as HVAC control, lighting modules, and door modules. The CAN-FD interface connects to vehicle CAN networks at 2-5 Mbps, while the EMAC supports automotive Ethernet (100BASE-T1 via external PHY) for gateway applications. The 16-bit EBI drives external graphics LCDs for instrument cluster displays, and the hardware crypto engine secures OTA firmware updates over CAN or Ethernet.
Empfohlen
Building Automation and HVAC Controllers
The ATSAME70Q20A-CFN integrates the peripherals needed for BACnet/Modbus building controllers: EMAC for BACnet/IP, CAN-FD for BACnet MS-TP or proprietary field buses, USART for Modbus RTU, and the 12-bit AFEC for temperature/pressure sensor inputs. The 1 MB Flash holds a full BACnet stack plus scheduling and trend-logging logic, while the secure RTC with TRNG supports tamper-resistant metering. The SAME70 family hardware AES encrypts secure communication to cloud-based building management systems, replacing traditional 16-bit MCU + external ASIC designs with a single Cortex-M7 device.
Empfohlen
IoT Edge Nodes with Secure Boot
The ATSAME70Q20A-CFN provides a secure-boot capable platform for IoT edge nodes with its hardware AES-256/TDES/SHA accelerator, True Random Number Generator, and Flash secure-bootloader region. The Cortex-M7 with FPU runs on-device ML inference (e.g., CMSIS-NN for keyword spotting or vibration analysis) while the EMAC and HS USB provide connectivity to cloud platforms. The 384 KB SRAM holds model weights for small ML models without external PSRAM, and the 6-layer bus matrix enables parallel Ethernet DMA + Cortex-M7 execution without bus contention.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ATSAME70Q20A-CFN – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ATSAME70Q20B-CFN | ATSAME70Q20A-CFNT | ATSAME70Q19A-CFNT | ATSAME70N21B-CN | ATSAME70N20A-CN |
|---|---|---|---|---|---|---|
| Package | 144-ball UFBGA (10x10x0.6 mm) | 144-ball UFBGA (10x10) - same | 144-ball UFBGA (10x10) - same | 144-ball UFBGA (10x10) - same | 144-ball UFBGA family variant | 144-ball UFBGA family variant |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M7 with FPU @ 300 MHz | ARM Cortex-M7 with FPU @ 300 MHz | ARM Cortex-M7 with FPU @ 300 MHz | ARM Cortex-M7 with FPU @ 300 MHz | ARM Cortex-M7 with FPU @ 300 MHz | ARM Cortex-M7 with FPU @ 300 MHz |
| Flash Memory | 1024 KB | 1024 KB | 1024 KB | 1024 KB | 2048 KB | 128 KB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB | 128 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +105C | -40C to +105C | -40C to +85C | -40C to +85C |
| Silicon Revision | Rev A | Rev B (errata fixed) | Rev A (extended temp) | Rev variant | Rev B | Rev variant |
| Approx. Unit Price (qty 1) | $13.76 | $13.76 (similar) | $14.20 (extended temp) | $12.50 (cost optimized) | $16.40 (higher Flash) | $9.20 (lower Flash) |
Wichtigste Unterscheidungsmerkmale
- Silicon revision B with full errata fixes for production deployments (vs. ATSAME70Q20B-CFN)
- Extended -40C to +105C temperature range for harsh environments (vs. ATSAME70Q20A-CFNT)
- Higher 2 MB Flash density for full EtherCAT/BACnet stacks (vs. ATSAME70N21B-CN)
- Lower-cost same-family variant for high-volume applications (vs. ATSAME70N20A-CN)
Designhinweise
Estimated: The 144-ball UFBGA with 0.6 mm ball pitch requires 4-layer+ HDI PCB with microvia stacks for inner-row fan-out. Per SAME70 hardware design checklist, allocate at least 6 decoupling capacitors (100 nF X7R per VDD pin pair plus 4.7 uF bulk) within 2 mm of the balls. The exposed die paddle must be soldered to a continuous ground plane for thermal dissipation - expect theta_JA of approximately 25-30 C/W with proper PCB layout.
The 16-bit External Bus Interface (EBI) for SDRAM operates at up to 75 MHz - route address, data, and control signals with matched lengths (delta < 5 mm), 50 ohm controlled impedance, and a continuous ground reference plane. Add series damping resistors (22-33 ohm) on EBI data lines near the MCU if SDRAM clock exceeds 100 MHz. Reference the SAME70 hardware design checklist application note for specific PCB stackup recommendations.
Do not omit the 32.768 kHz low-frequency crystal for the RTC subsystem - the SAME70 RTC requires it for accurate timekeeping and secure timestamping. The VDDPLL and VDDUTMIC supplies each require their own ferrite-bead-isolated rail with 100 nF + 4.7 uF decoupling. Program the SAME70 GPNVM bits to enable secure boot only after verifying Flash image integrity - a locked device with a corrupted image requires external programmer recovery.
Estimated: At 300 MHz operation with all peripherals active, the ATSAME70Q20A-CFN consumes approximately 200-300 mW typical, increasing to 500+ mW with sustained DSP workloads. With 25-30 C/W theta_JA on a properly laid out 4-layer PCB, this translates to ~15C junction temperature rise above ambient - no heatsink required for typical industrial environments. For high-temperature automotive underhood applications, the ATSAME70Q20A-CFNT (extended -40C to +105C) is recommended.
The SAME70 family integrates a Power Management Controller (PMC) with four programmable voltage regulators for core, PLL, USB, and ADC supplies. Enable the PMC's low-power modes (Wait, Sleep, Backup) when designing battery-powered applications - deep-sleep current drops to < 5 uA with RTC running. Use the SUPC (Supply Controller) to monitor VDDIO brownout events and trigger safe RTC-only operation before complete power loss.
Compliance-Informationen
RoHS and REACH compliant per Microchip product environmental compliance information. Not AEC-Q100 qualified - for automotive safety-critical applications, consider ATSAM3A8CA-CU or ATSAMC20 equivalent families. Lead-free reflow-compatible per JEDEC J-STD-020.
