BCM352F110M300B00 - 300W Isolated BCM 352V to 11V | Vicor
Teilenummer: BCM352F110M300B00 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $96.28 | $96,28 |
| 10 | $87.5 | $875,00 |
| 50 | $78.2 | $3.910,00 |
| 100 | $72.45 | $7.245,00 |
| 500 | $64.1 | $32.050,00 |
BCM352F110M300B00 Übersicht
What is a Bus Converter Module? A BCM is a specialized isolated fixed-ratio DC-DC converter that creates an isolated, regulated intermediate bus voltage from a higher-voltage distribution rail. The BCM sits in the power-distribution hierarchy between an AC-DC front end / PFC stage and downstream Point-of-Load (POL) converters, replacing traditional isolated bus converters with a planar magnetic, sine-amplitude-conversion topology that delivers faster transient response and lower noise than conventional hard-switched converters.
Key features include isolated 3,750 VDC galvanic barrier, 330-365 VDC input range with input overvoltage lockout, and an output voltage range of 10.3 V to 11.4 V. The fast transient response of the BCM topology reduces or eliminates the need for bulk aluminum electrolytic or tantalum hold-up capacitors at downstream POL inputs, saving board area, BOM cost, and improving system reliability by removing limited-life capacitors from the design.
Technically, the BCM352F110y300B00 uses Vicor's proprietary Sine Amplitude Conversion (SAC) topology with zero-current switching and zero-voltage switching, minimizing switching losses and EMI. The co-molded VI Chip package exposes a large thermal interface area that conducts heat directly into the PCB, supporting >300 W continuous output at case temperatures up to 100 C (T-Grade) without forced-air cooling in typical applications.
Typical applications include 380 VDC distribution from three-phase PFC front ends, intermediate bus architectures (IBA) feeding downstream Vicor PI31xx/PI33xx or LGA POL converters, telecom equipment, LED lighting drivers, and industrial 380 V process-control systems. The off-line BCM is particularly suited for silver-box AC-DC designs where isolation, efficiency, and density are paramount.
When designing with this device, ensure the upstream PFC front end provides input voltage within the 330-365 VDC window and that downstream POL converters accept 11 V nominal input. Thermal management relies on PCB copper area under the VI Chip thermal interface pad; follow Vicor AN:301 layout guidelines for best results.
This page synthesizes distributor pricing, real cross-reference data, drop-in alternatives, and application guidance that complements - but is not found in - the manufacturer datasheet alone.
Drop-in-Alternativen für BCM352F110M300B00 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
BCM352F110T300B00
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
BCM352F110M300A00
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
BCM352x110y300B00
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
BCM352F110M300B00 Grenzwerte & elektrische Eigenschaften
| Topologie | Sine Amplitude Conversion (SAC) - isolated fixed-ratio |
| Transformation Ratio (K) | 1/32 |
| Eingangsspannungsbereich | 330 V to 365 VDC |
| Ausgangsspannungsbereich | 10.3 V to 11.4 V |
| Nominal Output Voltage | 11 V |
| Maximum Continuous Output Power | 300 W |
| Maximaler Ausgangsstrom | 28.5 A |
| Input Overvoltage Lockout | Yes |
| Isolation Voltage (Input to Output) | 3,750 VDC |
| Package Type | VI Chip (co-molded SMD) |
| Montageart | Surface Mount |
| Operating Case Temperature (T-Grade) | -40 C to +100 C |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| Pick-and-Place Compatible | Yes (standard SMD assembly) |
BCM352F110M300B00 Pin-Konfiguration
| Pin 1 | +VIN — Positive high-voltage input (330-365 VDC) |
| Pin 2 | -VIN — Negative high-voltage input / input return |
| Pin 3 | +VOUT — Positive isolated 11 V output |
| Pin 4 | -VOUT — Negative isolated 11 V output / output return |
| Pin 5 | THERMAL PAD — Top thermal interface pad - solder to PCB copper pour for heat dissipation |
Typische Anwendungen
BCM352F110M300B00 ist geeignet für 6 Anwendungs: 380 V Three-Phase PFC Intermediate Bus, Telecom Silver-Box Power Supply, Industrial 380 V Process-Control Systems, Renewable-Energy / Solar Inverter Auxiliary Power, High-Voltage LED Lighting Drivers, Off-Line / Server DC Distribution.
380 V Three-Phase PFC Intermediate Bus
The BCM352F110M300B00 converts 380 VDC from a three-phase PFC front end into an isolated 11 V distribution bus. Its 330-365 VDC input range aligns directly with regulated three-phase PFC outputs, and the 3,750 VDC isolation satisfies reinforced-insulation requirements for industrial equipment. At 28.5 A / 300 W, a single BCM can supply a full intermediate-bus architecture feeding downstream Vicor PI31xx/PI33xx POL converters, eliminating the need for bulk electrolytic hold-up capacitors and improving long-term system MTBF.
Empfohlen
Telecom Silver-Box Power Supply
In telecom silver-box AC-DC designs, the BCM352F110M300B00 sits between the PFC stage and the 11 V intermediate bus that feeds load-side POL converters. Its Sine Amplitude Conversion topology provides faster transient response than hard-switched alternatives, eliminating the need for limited-life aluminum electrolytic or tantalum capacitors at POL inputs. The result is a smaller, cooler, more reliable 300 W intermediate bus that lowers total BOM cost and meets NEBS thermal and EMI requirements in central-office equipment.
Empfohlen
Industrial 380 V Process-Control Systems
The BCM352F110M300B00 is well suited to industrial 380 V process-control systems where a 300 W isolated 11 V bus is required to power PLCs, motor controllers, and sensor signal chains. Its 3,750 VDC isolation protects downstream 11 V circuitry from high-voltage transients on the 380 V bus, while the -40 C to +100 C T-Grade case temperature rating supports deployment in factory-floor enclosures. The VI Chip SMD package enables high-density PCB designs with direct thermal conduction to inner copper layers.
Empfohlen
Renewable-Energy / Solar Inverter Auxiliary Power
Solar inverters and energy-storage systems operate from 380 VDC bus rails and require isolated auxiliary power for gate drivers, controllers, and communication circuits. The BCM352F110M300B00 converts the high-voltage DC link into an isolated 11 V rail capable of 300 W, providing safe, reinforced-insulation power for low-voltage control circuitry. Its high efficiency at full load reduces thermal stress inside sealed inverter enclosures, and the VI Chip package simplifies PCB layout versus discrete flyback designs.
Empfohlen
High-Voltage LED Lighting Drivers
Architectural and horticultural LED lighting drivers operating from 380 VDC distribution rails use the BCM352F110M300B00 to generate an isolated 11 V bus for downstream constant-current LED driver ICs. At 300 W continuous, a single BCM can power an entire LED fixture array, and its 3,750 VDC isolation meets IEC 60598-1 safety requirements for luminaire insulation. The high-efficiency SAC topology keeps driver enclosure temperatures low, extending LED lifetime and reducing heatsink cost.
Empfohlen
Off-Line / Server DC Distribution
In -48 V to -380 V or 400 VDC data-center power shelves, the BCM352F110M300B00 provides an isolated 11 V / 300 W intermediate bus for downstream point-of-load converters feeding server CPUs, memory, and ASICs. Its fast transient response eliminates bulk hold-up capacitors that would otherwise consume board space and limit service life, while the 3,750 VDC isolation supports the reinforced insulation required between HVDC distribution and SELV logic rails in modern hyperscale data centers.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für BCM352F110M300B00 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | BCM352F110T300B00 | BCM352F110M300A00 | BCM352x110y300B00 |
|---|---|---|---|---|
| Package | VI Chip (co-molded SMD, M lead-form) | VI Chip (co-molded SMD, T lead-form) | VI Chip (co-molded SMD) | VI Chip (co-molded SMD) |
| Brand | Vicor | Vicor | Vicor | Vicor |
| Input Voltage Range | 330 V to 365 VDC | 330 V to 365 VDC | 330 V to 365 VDC | 330 V to 365 VDC |
| Output Voltage | 10.3 V to 11.4 V (11 V nom) | 10.3 V to 11.4 V (11 V nom) | 10.3 V to 11.4 V (11 V nom) | 10.3 V to 11.4 V (11 V nom) |
| Maximum Output Power | 300 W | 300 W | 300 W | 300 W |
| Maximum Output Current | 28.5 A | 28.5 A | 28.5 A | 28.5 A |
| Isolation Voltage | 3,750 VDC | 3,750 VDC | 3,750 VDC | 3,750 VDC |
| Transformation Ratio (K) | 1/32 | 1/32 | 1/32 | 1/32 |
| Lead-Form / Terminal Option | M (standard module terminal) | T (alternate terminal option) | M (standard) | x / y variants |
Wichtigste Unterscheidungsmerkmale
- Vicor-proprietary Sine Amplitude Conversion topology (vs. BCM352F110T300B00)
- 3,750 VDC reinforced isolation in a co-molded VI Chip SMD footprint (vs. BCM352F110M300A00)
- Drop-in compatible with the BCM352x110y300B00 product family (vs. BCM352x110y300y300B00)
Designhinweise
The BCM352F110M300B00 relies on direct thermal conduction from its co-molded VI Chip top thermal pad into the PCB copper pour. Per the Vicor datasheet, the device is rated for 300 W continuous at case temperatures up to 100 C (T-Grade). Use Vicor Application Note AN:301 land-pattern guidelines: maximize copper area under and around the thermal pad, stitch thermal vias directly under the pad, and use 2 oz or heavier copper on inner layers to keep junction-to-ambient thermal resistance within the SOA of the BCM die.
Per Vicor recommendations, route input and output high-current copper pours directly into the BCM352F110M300B00 land pads with minimal trace inductance. The 3,750 VDC isolation requires that the input-side and output-side copper pours maintain the creepage and clearance distances specified in the Vicor datasheet - typically 8 mm minimum on the PCB surface for reinforced insulation. Avoid routing any low-voltage control traces between input and output copper regions.
Estimated: at 300 W output and 95% efficiency, the BCM352F110M300B00 dissipates roughly 15.8 W internally. Without the PCB thermal pad designed per AN:301, junction temperature will exceed ratings. Do not assume the BCM352F110T300B00 and BCM352F110M300B00 share identical PCB land patterns - the M and T lead-form variants differ in external terminal geometry even though the internal die and thermal interface are identical. Verify land pattern against the specific Vicor mechanical drawing before PCB fabrication.
The BCM352F110M300B00 includes input overvoltage lockout per the Vicor datasheet - design the upstream PFC stage so that transient overshoots stay below the lockout threshold to avoid nuisance shutdowns. The fast transient response of the SAC topology means downstream POL converters can operate with much smaller input bulk capacitors; in many designs a single 22 uF ceramic per POL is sufficient, but always validate hold-up requirements against worst-case load steps.
Compliance-Informationen
RoHS compliant per Vicor product page. AEC-Q100 not applicable - this is an industrial / telecom DC-DC converter module, not an automotive-qualified IC. Halogen-free status not explicitly stated in verified web data.
