BD8LA700EFV-CE2 - 8-Ch Auto Low-Side Switch, 24-HTSSOP-B | ROHM
Teilenummer: BD8LA700EFV-CE2 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1.45 | $1,45 |
| 10 | $1.18 | $11,80 |
| 100 | $0.97 | $97,00 |
| 500 | $0.83 | $415,00 |
| 1.000 | $0.72 | $720,00 |
| 2.500 | $0.69 | $1.725,00 |
BD8LA700EFV-CE2 Übersicht
A low-side switch is a power-distribution topology in which the load (lamp, solenoid, relay coil, LED string) is tied to V_BAT, and the MOSFET is placed between the load and ground. Pulling the MOSFET gate high by the MCU sinks current to ground and energizes the load; releasing the gate de-energizes it. Compared with high-side switches, low-side drivers simplify diagnostic feedback because the load-end is always at battery potential, enabling robust open-load detection even when the switch is off.
Key features include 3 V to 5.5 V logic supply, integrated flyback/active clamp for inductive loads, parallel-channel operation for higher currents, very low quiescent current in standby, and built-in diagnostic flags (open-load, short-to-ground, over-temperature). The HTSSOP-B exposed pad lowers thermal resistance so all eight channels can run at full duty in ECU and BCM modules.
Typical applications include automotive body-control modules (BCM) driving lamps and indicators, junction-box load drivers, HVAC actuator switching, and rear-lamp clusters. ROHM PCB OEMs' monolithic CMOS-plus-power-MOS architecture integrates the MOSFET and CMOS control on 1 chip, reducing PCB area versus discrete MOSFET arrays and improving fault-coverage uniformity across channels.
When designing with this device, ensure the supply decoupling, exposed-pad soldering, and ground-return layout follow the manufacturer's reference pattern. The CE2 part is shipped over six distributors; pricing varies by reel size.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für BD8LA700EFV-CE2 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
BD8LA700EFV-C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
BD8LB700FFV-CE2
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
BD8LA700EFV-CE2 Grenzwerte & elektrische Eigenschaften
| Product Type | 8-Channel Low-Side Switch IC |
| Number of Channels | 8 |
| Channel Configuration | N-Channel, Low-Side |
| Per-Channel Continuous Drain Current | 200 mA |
| Logic Supply Voltage | 3 V to 5.5 V |
| Betriebstemperaturbereich | -40 C to +150 C (junction) |
| Gehäuse | HTSSOP-B-24 (exposed pad) |
| Montageart | Surface Mount |
| Protection Features | Open-Load Detection, Over-Current Protection, Active Clamp, Thermal Shutdown |
| Process Technology | Monolithic CMOS + Power MOSFET |
| Automotive Qualification | Yes (AEC-Q100 grade, -CE2 suffix) |
| RoHS-Status | Compliant |
BD8LA700EFV-CE2 htssop-b-24 (exposed pad) Pinbelegungsleitfaden
Pinbelegung für BD8LA700EFV-CE2 (htssop-b-24 (exposed pad)-Gehäuse). Dieses Leistungsbauteil verfügt über Gate-, Drain- und Source-Anschlüsse. Bei nicht gepolten Gehäusen entnehmen Sie die genaue Ausrichtung von Pin 1 und Footprint-Details dem Herstellerdatenblatt. Typische Anwendungen sind Netzteilentwurf, Motoransteuerung und Lastschaltung.
Keine detaillierten Pinbelegungsdaten verfügbar für BD8LA700EFV-CE2.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
BD8LA700EFV-CE2 ist geeignet für 7 Anwendungs: Automotive Body Control Module (BCM), Rear Lamp Cluster Driver, HVAC Actuator Switching, Automotive Junction Box / Fuse Replacement, LED Interior Lighting Modules, Industrial 24V PLC Solenoid/Relay Driver Card, Automotive Door Module / Mirror Control.
Automotive Body Control Module (BCM)
The BD8LA700EFV-CE2 fits automotive BCMs because its 8 N-channel low-side channels at 200 mA continuous per channel directly drive turn signals, tail lamps, courtesy lamps, and door-lock solenoids. The integrated open-load detection reports a failed bulb to the BCM firmware without extra wiring, while AEC-Q100 qualification and -40 C to +150 C junction range meet under-hood and under-dash thermal stress. Placed between each load and chassis ground, the IC replaces a discrete MOSFET array, saving roughly 30-50% PCB area versus eight SOT-23 MOSFETs and discrete gate resistors, and consolidating fault diagnostics into a single status pin.
Empfohlen
Rear Lamp Cluster Driver
The BD8LA700EFV-CE2 suits rear-lamp clusters (brake, tail, reverse, indicator) because each of its 8 channels independently drives one lamp filament at up to 200 mA, with parallel operation doubling current for combined brake/tail bulbs. Built-in active clamp absorbs inductive kick from lamp wiring inductance during switch-off, protecting the MOSFET and reducing EMI that could trigger adjacent-channel fault flags. The HTSSOP-B exposed pad provides low thermal resistance so all 8 lamps can be driven simultaneously during a brake-and-indicator fault without entering thermal shutdown.
Empfohlen
HVAC Actuator Switching
The BD8LA700EFV-CE2 drives HVAC mode doors, blend-door actuators, and blower-resistor taps because its 8 channels at 200 mA each match typical small DC-motor and solenoid loads, while integrated active clamp absorbs the inductive kick when motor commutates off. AEC-Q100 grade and -40 C to +150 C operation handle the high ambient temperatures inside HVAC modules near the heater core. Channels can be paralleled for higher-current actuators like the main blower relay, providing design flexibility within a single IC and shared diagnostic feedback.
Empfohlen
Automotive Junction Box / Fuse Replacement
The BD8LA700EFV-CE2 replaces electromechanical fuses and discrete MOSFETs in intelligent power distribution boxes, providing resettable electronic fuses with software-controlled current limits. Each of its 8 channels acts as a programmable e-fuse at 200 mA, with over-current protection isolating faults within microseconds versus the slower thermal trip of a blade fuse. The diagnostic flag reports the failed channel to the BCM, enabling remote fault logging and OTA diagnostics, while AEC-Q100 qualification and automotive temperature range satisfy under-hood deployment.
Empfohlen
LED Interior Lighting Modules
The BD8LA700EFV-CE2 drives interior LED strings (ambient lighting, dome lamps, footwell illumination) because each channel sources up to 200 mA to ground, matching typical LED-driver topologies with a high-side boost and per-channel low-side PWM return. PWM on the enable pin enables smooth dimming, while the active clamp absorbs any residual inductive kick from wiring harnesses. The HTSSOP-B-24 package fits within the tight PCB envelope of door-mounted LED modules, and AEC-Q100 qualification supports interior cabin thermal extremes.
Empfohlen
Industrial 24V PLC Solenoid/Relay Driver Card
The BD8LA700EFV-CE2 fits industrial 24 V PLC discrete-output cards because its 8 channels at 200 mA continuous per channel directly drive small solenoids, relays, and indicator lamps. The integrated active clamp absorbs inductive flyback when the solenoid or relay coil de-energizes, protecting the MOSFET without external freewheeling diodes. Operating from -40 C to +150 C junction supports factory-floor temperature extremes, while parallel channels handle higher-current loads like contactor coils; the monolithic construction reduces BOM count versus discrete MOSFET-plus-resistor discrete designs.
Empfohlen
Automotive Door Module / Mirror Control
The BD8LA700EFV-CE2 fits door modules (mirror adjust, window lift relays, puddle lamps, speakers) because each of its 8 channels at 200 mA continuous directly switches a sub-function, while built-in open-load and over-current diagnostics report wiring faults back to the door-module MCU over a single status pin. AEC-Q100 grade and -40 C to +150 C junction support the wide thermal swing of a sealed door cavity across seasons. The HTSSOP-B-24 package fits within the constrained PCB envelope of door modules, and the active clamp absorbs inductive kick from mirror-adjust motors.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für BD8LA700EFV-CE2 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | BD8LA700EFV-C | BD8LB700FFV-CE2 |
|---|---|---|---|
| Package | HTSSOP-B-24 (exposed pad) | HTSSOP-B-24 (exposed pad) - same | HTSSOP-B-24 (exposed pad) - same |
| Brand | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor |
| Automotive Grade (AEC-Q100) | Yes (-CE2 suffix) | No (industrial) | Yes (-CE2 suffix) |
Wichtigste Unterscheidungsmerkmale
- Monolithic 8-channel integration in HTSSQP-B-24 (vs. Discrete 8x SOT-23 N-MOSFET array)
- AEC-Q100 automotive qualification with -CE2 suffix (vs. BD8LA700EFV-C (non-automotive variant))
- Built-in open-load detection (vs. Discrete MOSFET array)
Designhinweise
Estimated: at V_BAT=14 V (running 8 lamps at 200 mA continuous), worst-case load current is 1.6 A and on-state power dissipation is roughly 14 V x 1.6 A x RDS(on). With RDS(on)= 1 ohm (placeholder), dissipation is ~22 W. The HTSSOP-B exposed pad must be soldered to at least 1 square inch of 2 oz copper pour; without it, junction temperature will exceed 150 C and trigger thermal shutdown. Place thermal vias under the pad to inner-layer copper ground planes.
Place the BD8LA700EFV-CE2 close to the connectors to minimize high-current trace length and EMI. Use wide copper pours (at least 0.5 mm per 100 mA) on each drain return path. Keep logic-level signals (EN, DIAG) routed on the opposite side of the package from the power traces, with a ground plane between them for noise isolation. Decouple VCC with a 100 nF ceramic capacitor placed within 5 mm of the supply pin.
Do not operate the BD8LA700EFV-CE2 above 200 mA continuous per channel - the over-current protection will engage and report a fault, but sustained operation near the limit degrades reliability. Always solder the exposed thermal pad; a floating pad raises thermal resistance by 3-5x and triggers premature thermal shutdown. Do not connect inductive loads (relays, solenoids) without verifying the active-clamp energy rating versus the load inductance; for very high-energy inductors, add an external TVS diode.
