BD8LA700EFV-CE2 - 8-Ch Auto Low-Side Switch, 24-HTSSOP-B | ROHM
Référence : BD8LA700EFV-CE2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.45 | $1,45 |
| 10 | $1.18 | $11,80 |
| 100 | $0.97 | $97,00 |
| 500 | $0.83 | $415,00 |
| 1 000 | $0.72 | $720,00 |
| 2 500 | $0.69 | $1 725,00 |
BD8LA700EFV-CE2 Présentation
A low-side switch is a power-distribution topology in which the load (lamp, solenoid, relay coil, LED string) is tied to V_BAT, and the MOSFET is placed between the load and ground. Pulling the MOSFET gate high by the MCU sinks current to ground and energizes the load; releasing the gate de-energizes it. Compared with high-side switches, low-side drivers simplify diagnostic feedback because the load-end is always at battery potential, enabling robust open-load detection even when the switch is off.
Key features include 3 V to 5.5 V logic supply, integrated flyback/active clamp for inductive loads, parallel-channel operation for higher currents, very low quiescent current in standby, and built-in diagnostic flags (open-load, short-to-ground, over-temperature). The HTSSOP-B exposed pad lowers thermal resistance so all eight channels can run at full duty in ECU and BCM modules.
Typical applications include automotive body-control modules (BCM) driving lamps and indicators, junction-box load drivers, HVAC actuator switching, and rear-lamp clusters. ROHM PCB OEMs' monolithic CMOS-plus-power-MOS architecture integrates the MOSFET and CMOS control on 1 chip, reducing PCB area versus discrete MOSFET arrays and improving fault-coverage uniformity across channels.
When designing with this device, ensure the supply decoupling, exposed-pad soldering, and ground-return layout follow the manufacturer's reference pattern. The CE2 part is shipped over six distributors; pricing varies by reel size.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour BD8LA700EFV-CE2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
BD8LA700EFV-C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
BD8LB700FFV-CE2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
BD8LA700EFV-CE2 Valeurs maximales et caractéristiques électriques
| Product Type | 8-Channel Low-Side Switch IC |
| Number of Channels | 8 |
| Channel Configuration | N-Channel, Low-Side |
| Per-Channel Continuous Drain Current | 200 mA |
| Logic Supply Voltage | 3 V to 5.5 V |
| Plage de température de fonctionnement | -40 C to +150 C (junction) |
| Boîtier | HTSSOP-B-24 (exposed pad) |
| Type de montage | Surface Mount |
| Protection Features | Open-Load Detection, Over-Current Protection, Active Clamp, Thermal Shutdown |
| Process Technology | Monolithic CMOS + Power MOSFET |
| Automotive Qualification | Yes (AEC-Q100 grade, -CE2 suffix) |
| Statut RoHS | Compliant |
Guide de configuration des broches du BD8LA700EFV-CE2 htssop-b-24 (exposed pad)
Configuration des broches du BD8LA700EFV-CE2 (boîtier htssop-b-24 (exposed pad)). Ce composant de puissance comporte des bornes de grille, de drain et de source. Pour les boîtiers non polarisés, consultez la fiche technique du fabricant pour l'orientation exacte de la broche 1 et les détails de l'empreinte. Les applications courantes incluent la conception d'alimentations, la commande de moteurs et la commutation de charges.
Aucune donnée de brochage détaillée disponible pour BD8LA700EFV-CE2.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
BD8LA700EFV-CE2 convient pour 7 applications: Automotive Body Control Module (BCM), Rear Lamp Cluster Driver, HVAC Actuator Switching, Automotive Junction Box / Fuse Replacement, LED Interior Lighting Modules, Industrial 24V PLC Solenoid/Relay Driver Card, Automotive Door Module / Mirror Control.
Automotive Body Control Module (BCM)
The BD8LA700EFV-CE2 fits automotive BCMs because its 8 N-channel low-side channels at 200 mA continuous per channel directly drive turn signals, tail lamps, courtesy lamps, and door-lock solenoids. The integrated open-load detection reports a failed bulb to the BCM firmware without extra wiring, while AEC-Q100 qualification and -40 C to +150 C junction range meet under-hood and under-dash thermal stress. Placed between each load and chassis ground, the IC replaces a discrete MOSFET array, saving roughly 30-50% PCB area versus eight SOT-23 MOSFETs and discrete gate resistors, and consolidating fault diagnostics into a single status pin.
Recommandé
Rear Lamp Cluster Driver
The BD8LA700EFV-CE2 suits rear-lamp clusters (brake, tail, reverse, indicator) because each of its 8 channels independently drives one lamp filament at up to 200 mA, with parallel operation doubling current for combined brake/tail bulbs. Built-in active clamp absorbs inductive kick from lamp wiring inductance during switch-off, protecting the MOSFET and reducing EMI that could trigger adjacent-channel fault flags. The HTSSOP-B exposed pad provides low thermal resistance so all 8 lamps can be driven simultaneously during a brake-and-indicator fault without entering thermal shutdown.
Recommandé
HVAC Actuator Switching
The BD8LA700EFV-CE2 drives HVAC mode doors, blend-door actuators, and blower-resistor taps because its 8 channels at 200 mA each match typical small DC-motor and solenoid loads, while integrated active clamp absorbs the inductive kick when motor commutates off. AEC-Q100 grade and -40 C to +150 C operation handle the high ambient temperatures inside HVAC modules near the heater core. Channels can be paralleled for higher-current actuators like the main blower relay, providing design flexibility within a single IC and shared diagnostic feedback.
Recommandé
Automotive Junction Box / Fuse Replacement
The BD8LA700EFV-CE2 replaces electromechanical fuses and discrete MOSFETs in intelligent power distribution boxes, providing resettable electronic fuses with software-controlled current limits. Each of its 8 channels acts as a programmable e-fuse at 200 mA, with over-current protection isolating faults within microseconds versus the slower thermal trip of a blade fuse. The diagnostic flag reports the failed channel to the BCM, enabling remote fault logging and OTA diagnostics, while AEC-Q100 qualification and automotive temperature range satisfy under-hood deployment.
Recommandé
LED Interior Lighting Modules
The BD8LA700EFV-CE2 drives interior LED strings (ambient lighting, dome lamps, footwell illumination) because each channel sources up to 200 mA to ground, matching typical LED-driver topologies with a high-side boost and per-channel low-side PWM return. PWM on the enable pin enables smooth dimming, while the active clamp absorbs any residual inductive kick from wiring harnesses. The HTSSOP-B-24 package fits within the tight PCB envelope of door-mounted LED modules, and AEC-Q100 qualification supports interior cabin thermal extremes.
Recommandé
Industrial 24V PLC Solenoid/Relay Driver Card
The BD8LA700EFV-CE2 fits industrial 24 V PLC discrete-output cards because its 8 channels at 200 mA continuous per channel directly drive small solenoids, relays, and indicator lamps. The integrated active clamp absorbs inductive flyback when the solenoid or relay coil de-energizes, protecting the MOSFET without external freewheeling diodes. Operating from -40 C to +150 C junction supports factory-floor temperature extremes, while parallel channels handle higher-current loads like contactor coils; the monolithic construction reduces BOM count versus discrete MOSFET-plus-resistor discrete designs.
Recommandé
Automotive Door Module / Mirror Control
The BD8LA700EFV-CE2 fits door modules (mirror adjust, window lift relays, puddle lamps, speakers) because each of its 8 channels at 200 mA continuous directly switches a sub-function, while built-in open-load and over-current diagnostics report wiring faults back to the door-module MCU over a single status pin. AEC-Q100 grade and -40 C to +150 C junction support the wide thermal swing of a sealed door cavity across seasons. The HTSSOP-B-24 package fits within the constrained PCB envelope of door modules, and the active clamp absorbs inductive kick from mirror-adjust motors.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour BD8LA700EFV-CE2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | BD8LA700EFV-C | BD8LB700FFV-CE2 |
|---|---|---|---|
| Package | HTSSOP-B-24 (exposed pad) | HTSSOP-B-24 (exposed pad) - same | HTSSOP-B-24 (exposed pad) - same |
| Brand | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor |
| Automotive Grade (AEC-Q100) | Yes (-CE2 suffix) | No (industrial) | Yes (-CE2 suffix) |
Principaux différenciateurs
- Monolithic 8-channel integration in HTSSQP-B-24 (vs Discrete 8x SOT-23 N-MOSFET array)
- AEC-Q100 automotive qualification with -CE2 suffix (vs BD8LA700EFV-C (non-automotive variant))
- Built-in open-load detection (vs Discrete MOSFET array)
Notes de conception
Estimated: at V_BAT=14 V (running 8 lamps at 200 mA continuous), worst-case load current is 1.6 A and on-state power dissipation is roughly 14 V x 1.6 A x RDS(on). With RDS(on)= 1 ohm (placeholder), dissipation is ~22 W. The HTSSOP-B exposed pad must be soldered to at least 1 square inch of 2 oz copper pour; without it, junction temperature will exceed 150 C and trigger thermal shutdown. Place thermal vias under the pad to inner-layer copper ground planes.
Place the BD8LA700EFV-CE2 close to the connectors to minimize high-current trace length and EMI. Use wide copper pours (at least 0.5 mm per 100 mA) on each drain return path. Keep logic-level signals (EN, DIAG) routed on the opposite side of the package from the power traces, with a ground plane between them for noise isolation. Decouple VCC with a 100 nF ceramic capacitor placed within 5 mm of the supply pin.
Do not operate the BD8LA700EFV-CE2 above 200 mA continuous per channel - the over-current protection will engage and report a fault, but sustained operation near the limit degrades reliability. Always solder the exposed thermal pad; a floating pad raises thermal resistance by 3-5x and triggers premature thermal shutdown. Do not connect inductive loads (relays, solenoids) without verifying the active-clamp energy rating versus the load inductance; for very high-energy inductors, add an external TVS diode.
